公开(公告)号：US20050018390A1

公开(公告)日：2005-01-27

申请号：US10893904

申请日：2004-07-20

Applicant: Satoshi Sanada ,  Takao Tsunooka ,  Matsuhisa Tsuruta

Inventor： Satoshi Sanada ,  Takao Tsunooka ,  Matsuhisa Tsuruta

IPC: H01R13/14 ,  H01R13/24 ,  H02G3/16 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K5/0247 ,  B60T8/3675 ,  H01R13/24 ,  H05K1/0263 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0979 ,  H05K2201/10272 ,  H05K2201/10848 ,  Y10T137/8326 ,  Y10T137/87885

Abstract: In an electronic control unit, a chassis is provided with a plate portion, and a circuit board is secured to a board-side attaching surface of the plate portion with a predetermined space secured relative to the plate portion. The chassis is further provided with a side wall protruding from the circumferential portion of the other surface of the plate portion and is mounted on a surface of a housing incorporating a device therein, with an end surface of the side wall being seated on the surface of the housing. A bus bar is fixed at a fixing portion thereof to the board-side attaching surface between the plate portion and the circuit board and is connected to a terminal of the device which is taken out from the housing. The bus bar is provided at plural free ends thereof with branch portions at which lead portions extend to be joined at end portions thereof to the circuit board. Elastic portions for reducing stresses which are developed at juncture portions of the lead portions to the circuit board as the temperature changes are formed between the base portion and the branch portions alongside the board-side attaching surface.

Abstract translation: 在电子控制单元中，机架设有板部，电路板以相对于板部固定的预定空间固定在板部的板侧安装面上。 底盘还设置有从板部分的另一表面的圆周部分突出的侧壁，并且安装在其中包括装置的壳体的表面上，侧壁的端表面位于 住房。 母线固定在其固定部分到板部分和电路板之间的板侧安装表面，并连接到从壳体中取出的装置的端子。 汇流条在其多个自由端处设置有分支部分，引导部分在端部处延伸以连接到电路板。 弹性部分，用于在基板侧和基板侧安装面之间的分支部分之间形成用于减小随着温度变化而在引线部分到电路板的接合部分处产生的应力的应力。

公开(公告)号：US06840781B2

公开(公告)日：2005-01-11

申请号：US10626262

申请日：2003-07-24

Applicant: Harehide Sasaki ,  Yoshiaki Kato ,  Keiichi Ito ,  Masato Minakata ,  Atsushi Nishida

Inventor： Harehide Sasaki ,  Yoshiaki Kato ,  Keiichi Ito ,  Masato Minakata ,  Atsushi Nishida

IPC: H01R4/02 ,  H05K3/34 ,  H01R9/09

CPC classification number: H01R12/58 ,  H01R4/02 ,  H01R12/712 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/1081 ,  H05K2201/10848

Abstract: A connector has terminals, each having a tip end portion. A wiring board has through holes. A land is provided on the wiring board about each through hole. When the connector is mounted on the wiring board, each terminal is connected to one of the lands with a part of the tip end portion being located in the corresponding through hole. The ratio of the cross-sectional area of each tip end portion to the cross-sectional area of each through hole is at least 0.11 and no more than 0.89. This improves the reliability of the joint portions between the terminals and the wiring board.

Abstract translation: 连接器具有端子，每个端子具有尖端部分。 接线板有通孔。 在每个通孔上的布线板上设置一个焊盘。 当连接器安装在布线板上时，每个端子连接到其中一个焊盘，其顶端部分的一部分位于相应的通孔中。 每个末端部分的横截面积与每个通孔的横截面面积之比至少为0.11且不大于0.89。 这提高了端子和布线板之间的接合部的可靠性。

公开(公告)号：US5647124A

公开(公告)日：1997-07-15

申请号：US565224

申请日：1995-11-30

Applicant: Min Yu Chan ,  Jing Sua Goh

Inventor： Min Yu Chan ,  Jing Sua Goh

IPC: H01L23/495 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/49541 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10689 ,  H05K2201/1084 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

Abstract translation: 一种用于半导体器件（12）的引线（10），包括带状部分（14），所述带状部分包括连接到所述半导体器件（12）的第一基本上水平的部分（18），大致垂直部分（20），连接到所述第一基本水平 以及连接到大致垂直部分（20）的第二基本上水平的部分（22），其中至少一个孔（16）设置在带状部分（14）中。 一种提供用于将半导体器件（12）连接到表面（24）的电触点的方法，包括以下步骤：从半导体器件（12）延伸至少一个引线（10）并对引线（10）进行开槽。

公开(公告)号：US5573172A

公开(公告)日：1996-11-12

申请号：US346131

申请日：1994-11-29

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A hidden lead package device is configured to be placed between a leadless component such as a surface mount package (SMP) used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The hidden lead device is made using materials having similar characteristic thermal expansion properties as that of the SMP and printed circuit board pads to which the hidden lead is affixed. The hidden lead extends across the underside of the SMP along the PCB surface. One end of the lead is brazed to an SMP pad and the opposite end is soldered to a communicating PCB pad. The brazing temperature is higher than the reflow temperature for the solder. The hidden lead device causes the relative movement between the leadless carrier and the printed circuit board to occur along a length of the hidden lead and thus minimizes tensional or compressive forces to the solder joints. Such an approach relieves the stress and resulting creep typically seen at solder joints when mounting leadless packages to printed circuit boards. In addition, by segregating the input and output pads and placing the hidden leads to ground pads between those of input and output pads, crosstalk rejection of the components is improved.

Abstract translation: 隐藏的引线封装器件被配置为放置在诸如用于容纳SAW器件的表面贴装封装（SMP）的无引线部件和被配置为与印刷电路板无引线接触的焊接接头的标准印刷电路板之间。 隐藏引线器件使用具有与SMP相似的特性热膨胀性能的材料和附着有隐藏引线的印刷电路板焊盘制成。 隐藏的引线沿着PCB表面延伸穿过SMP的下侧。 引线的一端钎焊到SMP焊盘，相对端焊接到通信的PCB焊盘。 钎焊温度高于焊料的回流温度。 隐藏的引线装置导致无引线载体和印刷电路板之间的相对运动沿着隐藏引线的长度发生，从而最小化对焊点的张力或压缩力。 当将无引线封装安装到印刷电路板上时，这种方法减轻了在焊点处通常出现的应力和结果的蠕变。 此外，通过分离输入和输出焊盘并将隐藏引线放置在输入和输出焊盘之间的接地焊盘，组件的串扰抑制被改善。

公开(公告)号：US5076796A

公开(公告)日：1991-12-31

申请号：US615527

申请日：1990-11-19

Applicant: Jiro Kusayanagi ,  Shoji Yamada ,  Yuji Yamada

Inventor： Jiro Kusayanagi ,  Shoji Yamada ,  Yuji Yamada

IPC: H01R12/50 ,  H01R12/71 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K3/308 ,  H01R12/58 ,  H01R12/716 ,  H01R23/68 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10568 ,  H05K2201/10848 ,  H05K2201/2036

Abstract: A terminal pin is designed for insertion through a hole in a printed circuit board and for soldering to a circuit trace on the board. The pin includes a terminal portion at one end and a solder tail portion at an opposite end, with the neck portion therebetween. The neck portion has a reduced cross-sectional dimension versus that of the terminal portion and the solder tail portion to increase the flexibility of the pin at the neck portion. The neck portion provides an area of flexibility adjacent the area of soldering the pin to the printed circuit board.

Abstract translation: 端子针设计用于插入印刷电路板中的孔，并焊接到电路板上的电路迹线。 销在一端包括端子部分和在相对端的焊接尾部，其中颈部部分在其间。 颈部具有相对于端子部分和焊接尾部部分的横截面尺寸减小以增加销在颈部的柔性。 颈部提供了在将引脚焊接到印刷电路板的区域附近的柔性区域。

公开(公告)号：US4294007A

公开(公告)日：1981-10-13

申请号：US108624

申请日：1979-12-31

Applicant: Paul R. Ellis, Jr.

Inventor： Paul R. Ellis, Jr.

IPC: H01R4/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/366 ,  H01R12/718 ,  H01R4/028 ,  H05K3/3447 ,  H05K1/0306 ,  H05K2201/10386 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/308 ,  H05K3/306 ,  H05K3/3468 ,  Y10T29/49126 ,  Y10T29/49799 ,  Y10T29/4981

Abstract: In this method of fabricating an electrical circuit assembly, a thick film hybrid substrate is held in an inverted position as apertured glass-ceramic beads are placed over the end leads on the substrate. A drop of liquid flux is then applied to the apertures to hold the beads in place. After the flux dries, the leads are inserted into plated-through holes in a circuit board, with the beads locating portions of the leads above the board. Following wave soldering of the board, the beads are fractured with a sharp instrument prior to a cleaning operation which removes bead parts from the soldered assembly. In this manner, the substrate is flexibly mounted in the board so that the substrate can be tilted without damaging it.

Abstract translation: 在这种制造电路组件的方法中，当多孔玻璃陶瓷珠置于衬底上的端引线上时，厚膜混合衬底保持在倒置位置。 然后将一滴液体通量施加到孔以将珠保持在适当位置。 焊剂干燥后，将引线插入到电路板的电镀通孔中，其中引线将引线定位在板上方的部分。 在板的波峰焊之后，在清洁操作之前，珠子用尖锐的工具断裂，从焊接的组件中去除了珠子部件。 以这种方式，基板被柔性地安装在板中，使得基板可以倾斜而不损坏基板。