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    Connector pin on springs
    71.
    发明授权
    Connector pin on springs 有权
    弹簧连接销

    公开(公告)号：US09257765B2

    公开(公告)日：2016-02-09

    申请号：US14615152

    申请日：2015-02-05

    Applicant: Amazon Technologies, Inc.

    Inventor： Nidhi Rathi ,  Edward A. Lilgegren

    IPC: H05K5/00 ,  H01R12/71 ,  H05K1/18 ,  H05K3/32

    CPC classification number: H01R12/714 ,  H05K1/18 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/0311 ,  H05K2201/09063 ,  H05K2201/09981 ,  H05K2201/10037 ,  H05K2201/10265 ,  H05K2201/10416 ,  H05K2201/10962

    Abstract: An electronic device includes a printed circuit board (PCB) with a first conductive element and having a first side opposite a second side. The electronic device includes a wall disposed on the first side of the PCB and having a channel through the wall. The electronic device includes a supporting structure disposed on the second side of the PCB. The electronic device includes a connector which includes an electrically conductive based configured to provide a conductive path between the first conductive element and the channel and also includes a spring structure disposed between the electrically conductive base and the supporting structure.

    Abstract translation: 电子设备包括具有第一导电元件并且具有与第二侧相对的第一侧的印刷电路板（PCB）。 电子设备包括设置在PCB的第一侧上并具有通过壁的通道的壁。 电子设备包括设置在PCB的第二侧上的支撑结构。 电子设备包括连接器，该连接器包括被配置为在第一导电元件和沟道之间提供导电路径的导电基底，并且还包括布置在导电基底和支撑结构之间的弹簧结构。

    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION
    72.
    发明申请
    AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION 有权
    轴向焊接网格阵列接触和制造方法

    公开(公告)号：US20150334830A1

    公开(公告)日：2015-11-19

    申请号：US14700850

    申请日：2015-04-30

    Applicant: International Business Machines Corporation

    Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu ,  Sung K. Kang ,  Frank R. Libsch ,  Xiao H. Liu

    IPC: H05K1/11 ,  H01R43/16

    CPC classification number: H05K1/11 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49224 ,  Y10T29/49226

    Abstract: A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

    Abstract translation: 用于微电子器件的接触结构和组件包括螺旋形的第一和第二导电触头。 载体元件附接到并定位在第一和第二触点之间。 第一和第二触点彼此电连通，并且第一和第二触点彼此成镜像关系。 一对绝缘基板各自包括导电构件。 每个第一和第二触点上的接触点被附接并与相应的导电构件电连通，使得该对绝缘基板之间的第一和第二导电触点形成导电封装。 载体元件上的金属层通过由载体元件在螺旋形接触件的第一和第二部分之间限定的第一开口提供导电性。

    Connector and assembly method for transmission assembly of connector
    73.
    发明授权
    Connector and assembly method for transmission assembly of connector 有权
    连接器传输组件的连接器和组装方法

    公开(公告)号：US09130329B1

    公开(公告)日：2015-09-08

    申请号：US14199663

    申请日：2014-03-06

    Applicant: Telebox Industries Corp.

    Inventor： Fu-Wen Wu ,  Su-Hui Huang ,  Ching-Yi Hsu

    IPC: H01R24/00 ,  H01R24/64 ,  H01R13/6466 ,  H05K3/30

    CPC classification number: H01R24/64 ,  H01R13/6466 ,  H05K1/0218 ,  H05K1/141 ,  H05K2201/0311 ,  H05K2201/041 ,  H05K2201/10303 ,  Y10T29/49147

    Abstract: A connector includes an insulated housing having a slot and a transmission assembly located inside the insulated housing. The transmission assembly includes a main circuit board, an expanded circuit board, a plurality of first terminals and at least one second terminal. The expanded circuit board is stacked on the main circuit board and a first lateral side and a second lateral side of the expanded circuit board which are opposite to each other has a plurality of first electrical contacts and at least one second electrical contact, respectively. The first terminals and the at least one second terminal are plugged in the main circuit board. One ends of the first terminals are in electrical contact with the first electrical contacts respectively. The other ends of the first terminals bend and extend towards the second lateral side of the expanded circuit board.

    Abstract translation: 连接器包括具有狭槽的绝缘壳体和位于绝缘壳体内部的传动组件。 传动组件包括主电路板，扩展电路板，多个第一端子和至少一个第二端子。 扩展电路板堆叠在主电路板上，并且彼此相对的扩展电路板的第一横向侧和第二横向侧分别具有多个第一电触点和至少一个第二电接触。 第一端子和至少一个第二端子插入主电路板。 第一端子的一端分别与第一电触点电接触。 第一端子的另一端朝向扩展电路板的第二侧面弯曲并延伸。

    Multilayer laminated structure for plug and connector with spring finger interconnecting feature
    76.
    发明授权
    Multilayer laminated structure for plug and connector with spring finger interconnecting feature 有权
    用于插头和连接器的多层层压结构，具有弹簧指互连功能

    公开(公告)号：US08941013B2

    公开(公告)日：2015-01-27

    申请号：US13598503

    申请日：2012-08-29

    Applicant: Shawn X. Arnold

    Inventor： Shawn X. Arnold

    IPC: H01R13/62 ,  H05K1/16

    CPC classification number: H01R12/714 ,  H01R12/732 ,  H05K1/117 ,  H05K1/142 ,  H05K3/365 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/1034 ,  H05K2201/1059 ,  Y10T156/10 ,  Y10T156/1052

    Abstract: A spring finger interconnection system can include a plug and a receptacle. In one embodiment, the plug can include spring finger contacts configured to carry electrical signals. The receptacle can include a cavity to receive the plug and the cavity can be constructed with printed circuit board fabrication techniques. In one embodiment, the cavity can be formed, at least in part, in a pre-impregnation layer and a first and a second layer can be disposed above and below the pre-impregnation layer to further form the cavity. In one embodiment, contacts can be arranged on the first layer to contact the spring fingers when the plug is inserted into the cavity. In another embodiment, contacts can be arranged on both the first and the second layers. In yet another embodiment, the cavity can be shaped to aid in contact-to-spring finger alignment when the plug is inserted in the cavity.

    Abstract translation: 弹簧手指互连系统可以包括插头和插座。 在一个实施例中，插头可以包括配置成承载电信号的弹簧爪触点。 容器可以包括用于接收插头的空腔，并且空腔可以由印刷电路板制造技术构成。 在一个实施例中，空腔可以至少部分地形成在预浸渍层中，并且可以在预浸渍层的上方和下方设置第一和第二层以进一步形成空腔。 在一个实施例中，当插头插入空腔时，触头可布置在第一层上以接触弹簧指。 在另一个实施例中，触点可以布置在第一和第二层上。 在另一个实施例中，当插头插入空腔时，空腔可被成形为有助于接触弹簧对准。

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    77.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    电子元件及其制造方法

    公开(公告)号：US20150008026A1

    公开(公告)日：2015-01-08

    申请号：US14374471

    申请日：2013-03-28

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Hirokazu Orimo

    IPC: H01G4/228 ,  H05K1/18 ,  H01G4/005

    CPC classification number: H01G4/228 ,  H01C1/148 ,  H01C7/1006 ,  H01C7/18 ,  H01G2/06 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/0311 ,  H05K2201/10015 ,  Y02P70/613

    Abstract: An electronic component is provided with: an electronic component body including a top face, a bottom face, a pair of side faces, and a pair of end faces provided with an outside electrode; and a pair of metal terminals individually connected to the pair of outside electrodes of the electronic component body, wherein the metal terminals is electrically and mechanically connected to the outside electrode of the electronic component body, and is also in contact with bottom face of the electronic component. The electronic component requires no jig or a simple jig if any for securing a metal terminal and electronic component body in place.

    Abstract translation: 电子部件设置有：电子部件主体，包括顶面，底面，一对侧面和设置有外部电极的一对端面; 以及一对金属端子，分别与电子部件主体的一对外侧电极连接，金属端子与电子部件主体的外侧电极电连接，也与电子部件主体的底面接触 零件。 电子部件不需要夹具或简单的夹具，如果有任何固定金属端子和电子部件体就位。

    Flexible Metal Interconnect Structure
    78.
    发明申请
    Flexible Metal Interconnect Structure 有权
    柔性金属互连结构

    公开(公告)号：US20140268596A1

    公开(公告)日：2014-09-18

    申请号：US13802701

    申请日：2013-03-13

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： Eugene M. Chow ,  Dirk DeBruyker

    IPC: H05K1/02

    CPC classification number: H01L23/5387 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/113 ,  H05K1/189 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H01L2924/00

    Abstract: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.

    Abstract translation: 用于在柔性电子器件中的IC器件之间传输信号的柔性金属互连结构形成在层叠在一起形成多层柔性衬底的两个柔性柔性材料层之间。 互连结构由连接到柔性材料层的内侧（面向）表面的两排间隔开的导电焊盘（金属岛）形成。 合适的微接触元件例如微弹簧提供滑动金属压力接触件，其在拉伸复合片材期间保持岛之间的电连接。 具体地，至少两个微接触元件附接到行中的一个中的每个金属岛，其中一个元件与相对行中的相关联的第一金属岛滑动压力接触，并且第二元件与相关联的第二元件滑动压力接触 金属岛。 岛和滑动触点可以被图案化成适应大应变的高密度迹线。

    Electromagnetic Interference Shielding and Strain Relief Structures For Coupled Printed Circuits
    79.
    发明申请
    Electromagnetic Interference Shielding and Strain Relief Structures For Coupled Printed Circuits 有权
    用于耦合印刷电路的电磁干扰屏蔽和应变消除结构

    公开(公告)号：US20140177180A1

    公开(公告)日：2014-06-26

    申请号：US13726509

    申请日：2012-12-24

    Applicant: APPLE INC.

    Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

    IPC: H05K1/02 ,  H05K1/11 ,  H05K13/00 ,  H05K9/00

    CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

    Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

    Abstract translation: 电子设备中的电气部件安装在诸如印刷电路的基板上。 印刷电路包含由金属迹线形成的信号路径。 印刷电路的信号路径中的信号线通过诸如印刷电路板对板连接器，由各向异性导电膜连接的触点或使用焊料连接的触点之类的电连接结构耦合在一起。 电连接结构可以由诸如导电泡沫结构或弹簧结构的导电弹性环形结构围绕。 导电泡沫结构可以设置有金属层，导电泡沫结构通过该金属层焊接到印刷电路上的金属环。 应变消除结构可以由围绕电连接结构或包覆成型的塑料结构的弹性体环形成。 涂层和导电塑料可用于提供具有电磁干扰屏蔽能力的应变消除结构。

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