公开(公告)号：US20060290421A1

公开(公告)日：2006-12-28

申请号：US11512471

申请日：2006-08-30

Applicant: Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang ,  Zlatko Filipvic

Inventor： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang ,  Zlatko Filipvic

IPC: H03F1/00

CPC classification number: H03F3/195 ,  H01L23/66 ,  H01L25/162 ,  H01L25/165 ,  H01L25/18 ,  H01L2223/665 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03F1/34 ,  H03F3/24 ,  H03F2200/294 ,  H03F2200/372 ,  H04B2001/0433 ,  H05K1/0237 ,  H05K1/144 ,  H05K1/16 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/041 ,  H01L2924/00

Abstract: A radio frequency (RF) module includes a first substrate adapted to receive passive circuits; and a second substrate adapted to receive active circuits, the first and second substrates electrically coupled through pads positioned on opposing surfaces of the first and second substrate.

Abstract translation: 射频（RF）模块包括适于接收无源电路的第一衬底; 以及适于接收有源电路的第二衬底，所述第一和第二衬底通过定位在所述第一和第二衬底的相对表面上的衬垫电耦合。

公开(公告)号：US20060274055A1

公开(公告)日：2006-12-07

申请号：US11143275

申请日：2005-06-01

Applicant: Joseph Reynolds ,  Shawn Day

Inventor： Joseph Reynolds ,  Shawn Day

IPC: G09G5/00

CPC classification number: G06F3/03547 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04107 ,  H03K17/962 ,  H03K2217/960765 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

Abstract translation: 提供一种触摸传感器装置，其使用柔性电路基板来提供改进的输入装置。 具体地说，本发明使用固定在柔性电路基板上的触摸传感器控制器，其耦合到传感器部件，以提供适用于各种应用的灵活，可靠和成本有效的触摸传感器。 在一个实施例中，触摸传感器使用提供相对高耐温性的柔性电路基板。 这允许使用可靠的技术来粘贴触摸传感器控制器，例如各种类型的焊接。 传感器组件可以包括相对低温的衬底，其可以提供成本有效的解决方案。 综合起来，触摸传感器的这个实施例以相对低的成本提供可靠性和灵活性。

公开(公告)号：US20060115928A1

公开(公告)日：2006-06-01

申请号：US11051341

申请日：2005-02-04

Applicant: Cam Nguyen ,  Sherry Zhu

Inventor： Cam Nguyen ,  Sherry Zhu

IPC: H01L21/50

CPC classification number: H05K1/141 ,  H01L22/34 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3511 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/041 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.

公开(公告)号：US4015328A

公开(公告)日：1977-04-05

申请号：US582735

申请日：1975-06-02

Applicant: Cletus G. McDonough

Inventor： Cletus G. McDonough

IPC: H05K1/11 ,  H01R4/06 ,  H01R12/58 ,  H01R12/61 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K1/04

CPC classification number: H05K3/363 ,  H01R12/523 ,  H01R4/06 ,  H05K3/4046 ,  H05K2201/0305 ,  H05K2201/041 ,  H05K2201/096 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K3/3447 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4611 ,  Y10T29/49126 ,  Y10T29/49142

Abstract: A method of making a multilayered circuit assembly from a plurality of flat, flexible circuit elements, wherein each circuit element includes a substrate having conductive means to define an electrical path of travel which is formed between a base layer made of insulation material and a cover layer made of insulation material. Each circuit element has a connecting station associated with the conductive means. The method generally includes the steps of forming the conductive means on the base layer of each circuit element, punching a first opening through the conductive means and base layer at a connecting station of each circuit element, soldering the connecting station of each circuit element so that a solid solder pad fills the first opening whereby the solder electrically contacts the conductive means, punching a second opening through the cover layer of each circuit element, securing the cover layer of each circuit element over the base layer and conductive means so that the first opening is generally concentric with the second opening, punching a third opening in each circuit element through the solder pad, stacking a plurality of punched and soldered circuit elements on top of one another so that the third openings are generally concentric, inserting a terminal into the third openings of the stacked circuit elements so that a portion thereof contacts the solder, and staking the terminal so that the other surface thereof forms a cold weld interference fit against the solder.

Abstract translation: 一种从多个平面柔性电路元件制造多层电路组件的方法，其中每个电路元件包括具有导电装置的基板，该基板具有限定形成在由绝缘材料制成的基底层和覆盖层之间的行进电路径 由绝缘材料制成。 每个电路元件具有与导电装置相关联的连接站。 该方法通常包括以下步骤：在每个电路元件的基底层上形成导电装置，在每个电路元件的连接站处冲压通过导电装置和基底层的第一开口，焊接每个电路元件的连接站，使得 固体焊盘填充第一开口，由此焊料与导电装置电接触，冲穿通过每个电路元件的覆盖层的第二开口，将每个电路元件的覆盖层固定在基底层和导电装置上，使得第一开口 通常与第二开口同心，通过焊盘冲压每个电路元件中的第三开口，将多个冲压和焊接的电路元件堆叠在一起，使得第三开口大致同心，将端子插入第三开口 堆叠电路元件的开口，使得其一部分接触焊料，并铆接端子 使得其另一个表面形成与焊料的冷焊缝干涉配合。

公开(公告)号：US3537176A

公开(公告)日：1970-11-03

申请号：US3537176D

申请日：1969-04-01

Applicant: LOCKHEED AIRCRAFT CORP

Inventor： HEALY RICHARD H ,  PALMER WILLIAM L

IPC: H01R12/51 ,  H05K1/00 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3447 ,  H05K1/0393 ,  H05K3/0044 ,  H05K3/3457 ,  H05K3/3468 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/044 ,  Y10T29/49149

公开(公告)号：US3228093A

公开(公告)日：1966-01-11

申请号：US17118162

申请日：1962-02-05

Applicant: SCHJELDAHL CO G T

Inventor： BRATTON FRANCIS H

IPC: H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/002 ,  H05K3/3468 ,  H05K3/363 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4611 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/041 ,  H05K2201/09563 ,  H05K2201/10477 ,  H05K2203/0789 ,  Y10T29/49155

公开(公告)号：US3070650A

公开(公告)日：1962-12-25

申请号：US5793660

申请日：1960-09-23

Applicant: SANDERS ASSOCIATES INC

Inventor： STEARNS THOMAS H

IPC: B23K1/20 ,  H01R4/02 ,  H01R12/61 ,  H02B1/20 ,  H05K1/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R12/61 ,  B23K1/20 ,  B23K2201/42 ,  H05K1/0289 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/0215 ,  H05K2201/041 ,  H05K2203/0415 ,  Y10T29/49213

公开(公告)号：US2963392A

公开(公告)日：1960-12-06

申请号：US73371058

申请日：1958-05-07

Applicant: SANDERS ASSOCIATES INC

Inventor： DAHLGREN VICTOR F

IPC: H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/363 ,  H05K3/284 ,  H05K3/328 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/041 ,  H05K2201/10977 ,  H05K2203/1115 ,  H05K2203/1311 ,  Y10T29/49002 ,  Y10T29/49904

公开(公告)号：US20240356251A1

公开(公告)日：2024-10-24

申请号：US18455803

申请日：2023-08-25

Applicant: Cisco Technology, Inc.

Inventor： David Nozadze ,  Mike Sapozhnikov ,  Amendra Koul ,  Sayed Ashraf Mamun ,  Upen Reddy Kareti

IPC: H01R12/53 ,  H01R12/55 ,  H05K1/14

CPC classification number: H01R12/53 ,  H01R12/55 ,  H05K1/144 ,  H01R43/007 ,  H05K1/0219 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/10356

Abstract: In some aspects, the techniques described herein relate to an apparatus for connecting cables to Input Output (IO) connector pins, including: a first Printed Circuit Board (PCB) configured to receive terminal ends of a plurality of cables, wherein the terminal ends of the plurality of cables are electrically isolated from one another in the first PCB; a second PCB configured to receive a plurality of IO connector pins, wherein the plurality of IO connector pins are electrically isolated from one another in the second PCB; and wherein the first PCB is configured to join to the second PCB to connect each of the terminal ends of the plurality of cables to corresponding pins of the plurality of IO connector pins.

公开(公告)号：US12108534B2

公开(公告)日：2024-10-01

申请号：US17731479

申请日：2022-04-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Eun Lee ,  Yong Hoon Kim

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/185 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/16 ,  H05K1/09 ,  H05K1/111 ,  H05K1/144 ,  H01L2224/16227 ,  H05K2201/041 ,  H05K2201/10015 ,  H05K2201/10734

Abstract: A substrate structure and electronic device provide improved power integrity and simplified manufacturing. The substrate structure includes a first printed circuit board, having a first side and a second side opposing each other, and a plurality of passive components embedded in the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components and a smallest distance between adjacent second passive components.