公开(公告)号：US3346774A

公开(公告)日：1967-10-10

申请号：US47599765

申请日：1965-07-30

Applicant: CTS CORP

Inventor： BRADY LYNN J

IPC: H01G2/00 ,  H01G4/228 ,  H01G4/242 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01G4/242 ,  H01G2/00 ,  H01G4/228 ,  H05K1/0306 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/1034

公开(公告)号：US20240172398A1

公开(公告)日：2024-05-23

申请号：US18385191

申请日：2023-10-30

Applicant: Micron Technology, Inc.

Inventor： Deepu Narasimiah Subhash ,  Suresh Reddy Yarragunta ,  Koneri Sathyanarayana Guptha Amith

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC classification number: H05K7/205 ,  G06F1/206 ,  H05K1/0215 ,  H05K7/20509 ,  H05K1/18 ,  H05K2201/09163

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triangular shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with a heat spreader on a primary and secondary side of the bracket. The triangular shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through a vertex portion of the triangular shaped metal bracket.

公开(公告)号：US11955739B2

公开(公告)日：2024-04-09

申请号：US17277579

申请日：2019-10-21

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Kazunari Fukagawa ,  Hironori Ogawa ,  Akihiko Oguri ,  Ryuuichi Toyota ,  Natsuko Kitagawa

IPC: H01R12/51 ,  H01R4/38 ,  H05K1/11

CPC classification number: H01R12/515 ,  H05K1/119 ,  H01R4/38 ,  H05K2201/09163 ,  H05K2201/10393 ,  H05K2201/10409

Abstract: A connection structure between a printed circuit board and a terminal block includes: an insertion portion at one end of the printed circuit board with a pattern disposed thereon; a terminal-block main body including a receiving port that receives the insertion portion; a nut held in the terminal-block main body; and a screw tightened into the nut. The pattern is interposed between the screw and the nut when the insertion portion is inserted into the receiving port.

公开(公告)号：US20240064909A1

公开(公告)日：2024-02-22

申请号：US18384597

申请日：2023-10-27

Applicant: HELLA GmbH & Co. KGaA

Inventor： Alexander HANSEN

IPC: H05K3/32 ,  H05K1/11 ,  H01R12/72 ,  H01R13/627

CPC classification number: H05K3/326 ,  H05K1/117 ,  H01R12/721 ,  H01R13/6273 ,  H05K2201/09163

Abstract: The present invention relates to a latching system, including a printed circuit board and an edge-contact plug, for establishing a latching connection between the printed circuit board and the edge-contact plug, including two retaining arms, each having a latch, the edge-contact plug including two mating latches for establishing the latching connection with the latch. The mating latches being formed on two different outer sides of the edge-contact plug as a set-back portion on the outer sides in each case, and the latches being able to engage with the set-back portions on the outer sides to establish the latching connection.

公开(公告)号：US11877407B2

公开(公告)日：2024-01-16

申请号：US16995402

申请日：2020-08-17

Applicant: Eaton Intelligent Power Limited

Inventor： Ramesh Shivaji Powar ,  Ramesh Jagadale ,  Jeffrey Cox ,  Jeffrey W. Lockhart ,  Victor Epee

IPC: H05K5/00 ,  H05K5/02 ,  H05K1/18 ,  H01C1/02 ,  H01C7/12

CPC classification number: H05K5/006 ,  H01C1/02 ,  H01C7/12 ,  H05K1/18 ,  H05K5/0052 ,  H05K5/0247 ,  H05K5/0069 ,  H05K2201/09163 ,  H05K2201/10106 ,  H05K2201/10196

Abstract: A surge protection device has a housing that is formed from a first lateral portion, a middle portion, and a second lateral portion that are connected together with a plurality of fasteners. The surge protection device includes an electronic apparatus having a neutral wire and further includes a housing that advantageously includes a strain relief that causes the neutral wire to frictionally engage the housing with sufficient friction to resist a predetermined tension applied to the free end or other portion of the neutral wire at the exterior of the housing from damaging an electrical connection between the neutral wire and a circuit board within an interior region of the surge protection device.

公开(公告)号：US20230171899A1

公开(公告)日：2023-06-01

申请号：US18152918

申请日：2023-01-11

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Woo RYOU

IPC: H05K3/46 ,  H05K1/14 ,  H05K1/02 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57

CPC classification number: H05K3/4691 ,  H04N23/54 ,  H04N23/55 ,  H04N23/57 ,  H05K1/02 ,  H05K1/14 ,  H05K1/147 ,  H05K1/0281 ,  H05K1/144 ,  H05K3/365 ,  H05K2201/09163

Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

公开(公告)号：US20180233841A1

公开(公告)日：2018-08-16

申请号：US15751018

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Kit Chew Chee ,  Ahmad Jalaluddin Yusof ,  Tin Poay Chuah

IPC: H01R12/77 ,  H01R12/79

CPC classification number: H01R12/774 ,  H01R12/79 ,  H01R13/6275 ,  H01R2107/00 ,  H05K1/117 ,  H05K1/118 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09481 ,  H05K2201/1034

Abstract: In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.

公开(公告)号：US09949376B2

公开(公告)日：2018-04-17

申请号：US14563778

申请日：2014-12-08

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J Greenberg ,  Neil H Talbot ,  James S Little

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36 ,  A61N1/372 ,  H05K3/28 ,  H05K1/11 ,  H05K1/14 ,  A61B5/00 ,  A61B5/0478 ,  H05K1/18 ,  H01L23/055 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/282 ,  A61B5/0006 ,  A61B5/0478 ,  A61B5/4836 ,  A61B5/6868 ,  A61B2562/0209 ,  A61B2562/046 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/3606 ,  A61N1/36071 ,  A61N1/36082 ,  A61N1/36139 ,  A61N1/375 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/005 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4061 ,  H05K2201/0245 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/10795 ,  H05K2201/10931 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/068 ,  H05K2203/082 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/1394 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

公开(公告)号：US09883589B2

公开(公告)日：2018-01-30

申请号：US14764795

申请日：2014-07-30

Applicant: KYOCERA Corporation

Inventor： Kouichi Kawasaki

IPC: H05K7/10 ,  H05K1/11 ,  H01L23/13 ,  H01L23/498 ,  H01L23/24 ,  H01L23/00 ,  H05K3/34 ,  H05K1/18 ,  H05K1/02 ,  H01R9/00 ,  H01L23/48 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

公开(公告)号：US09648744B2

公开(公告)日：2017-05-09

申请号：US13610701

申请日：2012-09-11

Applicant: Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

IPC: H05K1/18 ,  G06F1/16 ,  H05K7/02 ,  H05K3/00 ,  H05K3/30 ,  G06K13/08 ,  H05K1/11

CPC classification number: H05K1/18 ,  G06F1/1658 ,  G06K13/0825 ,  H04M2250/14 ,  H05K1/117 ,  H05K1/183 ,  H05K3/00 ,  H05K3/30 ,  H05K7/02 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09163 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.