Abstract:
An apparatus and method for producing a coated analytic substrate using a compact and portable automated instrument located in the laboratory setting at the point of use which can consistently produce one or a plurality of coated analytic substrates “on demand” for using the analytic substrate immediately after coating, preferably without a step of rinsing the coated analytic substrate before use. The apparatus preferably uses applicator cartridges having a reservoir containing the coating compositions used to form the coatings. Preferably the cartridges are removable and interchangeable to facilitate the production of individual analytic substrates having different coatings or different coating patterns. These coated analytic substrates have superior specimen adhesion characteristics due to the improved quality of the coatings applied by the coating apparatus and due to the quickness with which the coated analytic substrates can be used in the lab after production.
Abstract:
Disclosed is a technique for preventing a water-repellent protective film formed on a resist film from peeling off during immersion exposure. A resist film is formed on the front surface of a substrate and then the peripheral edge portion of the resist film is removed. Before forming a water-repellent protective film onto the resist film, an adhesion-improving fluid, preferably hexamethyldisilazane gas, for improving the adhesion of the water-repellent protective film, is supplied to the region from which the resist film is removed.
Abstract:
A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.
Abstract:
The present application relates to a slot die coating apparatus and, more particularly, to a slot die coating apparatus which can ensure the coating stability of a substrate film by reducing pressure oscillations within a vacuum chamber when slot die coating is carried out. The slot die coating apparatus according to the present application can effectively dampen pressure oscillations within a vacuum chamber by connecting a pressure oscillation reducing tank to the vacuum chamber and thus can ensure the coating stability of a substrate film, resulting in a reduction in the proportion of defective products.
Abstract:
A method of coating a substrate with a liquid comprising a catalyst component, the method comprising: (a) holding the substrate vertically, thereby defining upper and lower ends thereof, wherein the vertical substrate comprises a plurality of channels that are open at said upper and lower ends; (b) continuously introducing the liquid into the substrate by pushing or injecting the liquid through the open ends of the channels at the lower end of the substrate with a piston; and (c) after the lower end of the substrate has been partly filled with the liquid in step (b), applying a vacuum to the open ends of the channels at the upper end of the substrate while continuing to introduce the liquid into the substrate.
Abstract:
A method and apparatus for applying a fluid onto a number of surfaces. The apparatus comprises a structure, an applicator associated with the structure, a first control device associated with the structure, and a second control device associated with the structure. Applying a first force to the first control device causes the applicator to move relative to a center axis of the applicator. Applying a second force to the second control device causes the fluid to be delivered from a fluid dispensing system to the applicator.
Abstract:
A solvent vapor is made to adhere efficiently to the surface of a resist pattern without using an ultraviolet irradiation process to improve processing accuracy, to reduce processing time and to suppress the diffusion of the solvent outside a substrate processing system. The surface of a resist pattern R formed on a semiconductor wafer W by an exposure process and a developing process is coated with water molecules m. A solvent vapor of a water-soluble solvent, such as NMP, is spouted on the surface of the resist pattern R coated with the water molecules m. A surface layer of the resist pattern R is swollen by the solvent vapor combined with the water molecules m to achieve a smoothing process. The water molecules m and the solvent s remaining on the resist pattern R on the wafer W after the smoothing process are removed by drying.
Abstract:
A paste supply apparatus includes a paste pot including a tubular container which stores paste and which includes a bottom portion provided with a through hole and a movable inner lid provided in the tubular container, and a pot holder which holds the paste pot in a state in which the through hole of the paste pot is directed downward such that lateral expansion of the tubular container is suppressed and downward movement of the tubular container thereof is regulated. The paste supply apparatus further includes a paste ejecting device which presses the inner lid of the paste pot and which ejects the paste in the tubular container from the through hole.
Abstract:
Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
Abstract:
A coated film manufacturing method and a coating machine are provided which can prevent deformation of a die coater due to evaporation of a coating liquid and prevent surface deficiency occurring when starting the coating. A coating machine is prepared which includes a die coater having a manifold, a slot communicating with the manifold, and a lip face formed at an end of the slot, a heat-insulating plate being disposed in a region below the lip face of the die coater and having a tapered top end portion, and a depressurizing chamber being disposed upstream in a web conveying direction from the die coater. The coating machine is made to stand by at a position for forming a clearance greater than a predetermined clearance between the coating machine and the web at the time of coating while flowing the coating liquid from the die coater.