公开(公告)号：US08610141B2

公开(公告)日：2013-12-17

申请号：US13640869

申请日：2011-04-14

Applicant: Naoya Tohyama ,  Takuya Inoue ,  Kouichi Kumagai ,  Takaha Kunieda

Inventor： Naoya Tohyama ,  Takuya Inoue ,  Kouichi Kumagai ,  Takaha Kunieda

IPC: H01L33/08 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L25/167 ,  F21K9/23 ,  F21V3/00 ,  F21Y2115/10 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/10106 ,  H05K2201/10378 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.

Abstract translation: 本发明包括一个或多个LED元件，通过微型凸块安装LED元件的硅衬底，并且内部形成的布线连接到微型突起，与LED元件的相对侧粘贴的隔热有机衬底， 硅基板的安装侧，并且具有布线穿过的通孔，粘贴在隔热有机基板的硅基板侧的相反侧的芯片安装基板和内部形成的布线连接到布线 隔热有机基板的通孔，以及通过微型突起与芯片安装基板的布线连接的LED控制电路芯片，并且经由隔热有机基板侧的相反侧的微凸块安装 的芯片安装基板。

公开(公告)号：US08604353B2

公开(公告)日：2013-12-10

申请号：US13374858

申请日：2012-01-19

Applicant: Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

IPC: H05K1/03 ,  B23K1/20 ,  B23K31/02 ,  B05D5/12 ,  B05D3/00

CPC classification number: H05K1/0201 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/107 ,  H05K3/205 ,  H05K3/388 ,  H05K3/4617 ,  H05K3/4629 ,  H05K3/4647 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

公开(公告)号：US20130307016A1

公开(公告)日：2013-11-21

申请号：US13981821

申请日：2012-01-17

Applicant: Chung Hoon Lee

Inventor： Chung Hoon Lee

IPC: H01L33/64 ,  F21K99/00

CPC classification number: H01L33/64 ,  F21K9/278 ,  F21V23/005 ,  F21V29/15 ,  F21V29/74 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/10106 ,  H05K2201/10575 ,  H01L2924/00

Abstract: Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.

Abstract translation: 公开了一种发光二极管（LED）模块和照明组件。 照明组件包括发光器件，用于驱动发光器件的驱动器集成电路器件，用于散发从发光器件产生的热的散热器，以及用于阻挡驱动器集成电路器件与驱动器集成电路器件之间的热干扰的热屏蔽部分 发光装置。 在LED模块中，驱动器集成电路器件设置在热屏蔽部分上。 因此，可以阻止发光器件和驱动器集成电路器件之间的热干扰并且减小照明组件的尺寸。

公开(公告)号：US20130249407A1

公开(公告)日：2013-09-26

申请号：US13826989

申请日：2013-03-14

Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION

Inventor： Takahito Kashiwagi ,  Yoshiko Takahashi ,  Tsuyoshi Oyaizu ,  Seiko Kawashima ,  Kiyoshi Nishimura

IPC: H05B33/08

CPC classification number: H05B33/0866 ,  F21K9/232 ,  F21V23/0457 ,  F21Y2105/12 ,  F21Y2105/18 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L2224/48137 ,  H05B33/0869 ,  H05K1/0201 ,  H05K2201/09227 ,  H05K2201/10106

Abstract: A first LED group including a plurality of LEDs is regularly arranged in a toric shape on the circumference of a center of an approximately rectangular substrate which is formed of ceramics. In addition, the first LED group including the plurality of LEDs is entirely covered in a toric shape with a sealing member. In addition, a second LED group including a plurality of LEDs is regularly arranged in a grid shape in the vicinity of the center of the approximately rectangular substrate. In addition, the LED group including the plurality of LEDs is entirely covered with a sealing member. In addition, the sealing member entirely covers the inside of the toric portion of a first region.

Abstract translation: 包括多个LED的第一LED组在由陶瓷形成的大致矩形的基板的中心的圆周上规则地设置为复曲面形状。 此外，包括多个LED的第一LED组完全被覆盖成具有密封构件的复曲面形状。 此外，包括多个LED的第二LED组在大致矩形的基板的中心附近规则地排列成格子状。 此外，包括多个LED的LED组完全被密封构件覆盖。 此外，密封构件完全覆盖第一区域的复曲面部分的内部。

公开(公告)号：US20130200983A1

公开(公告)日：2013-08-08

申请号：US13814527

申请日：2011-08-05

Applicant: Thomas Meyer ,  Steffen Pfortner ,  Peter Berg

Inventor： Thomas Meyer ,  Steffen Pfortner ,  Peter Berg

IPC: H01H85/36

CPC classification number: H01H85/36 ,  H01H37/761 ,  H01H2037/762 ,  H01T1/14 ,  H05K1/0201 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2203/176

Abstract: A thermal overload protection apparatus for protection of an electrical component is disclosed. In one exemplary implementation, such apparatus may comprise a switching element for short-circuiting or disconnecting electrical connections, an actuator apparatus for switching the switching element to a short-circuit or disconnect position, and a tripping element which trips the actuator apparatus on a thermally sensitive basis. In some implementations, the actuator apparatus may be configured to be switched over for activation from an inactive state, in which the switching element cannot be switched by the actuator apparatus, into a trippable state, in which the switching element is capable of being switched by the actuator apparatus. Innovations herein also relate to corresponding arrangements having a conductor track mount, at least one component arranged thereon, and at least one associated overload protection apparatus.

Abstract translation: 公开了一种用于保护电气部件的热过载保护装置。 在一个示例性实施方式中，这种装置可以包括用于使电气连接短路或断开的开关元件，用于将开关元件切换到短路或断开位置的致动器装置，以及使致动器装置以热的方式跳闸的跳闸元件 敏感基础。 在一些实施方式中，致动器装置可以被配置为从开关元件不能被致动器装置切换到非活动状态的激活切换到可跳闸状态，其中开关元件能够被切换 致动器装置。 本文的创新还涉及具有导体轨道安装件，布置在其上的至少一个部件和至少一个相关联的过载保护装置的相应布置。

公开(公告)号：US20130168137A1

公开(公告)日：2013-07-04

申请号：US13732125

申请日：2012-12-31

Applicant: Peking Unicersity Founder Group Co., Ltd. ,  Zhuhai Founder Tech. Multilayer PCB Co., Ltd. ,  Zhuhai Founder PCB Development Co., Ltd.

Inventor： Yansheng HUA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/46 ,  H05K1/0201 ,  H05K1/0204 ,  H05K3/4611 ,  H05K3/4694 ,  H05K2201/10416 ,  Y10T156/1056

Abstract: A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion.

Abstract translation: 公开了一种制造印刷电路板的方法。 该方法包括在第一基板中打开第一窗口并在第二基板和树脂层中打开第二窗口。 树脂层位于第二基板和第一基板之间。 该方法还包括通过树脂层将第一基板和第二基板接合; 通过第二窗口将散热导体放置在第一基板中的第一窗口中; 将树脂部分放置在第二窗口中的第一基板上; 将子板嵌入第二基板的第二窗口中; 以及通过所述树脂部分将所述子板与所述第一基板接合。

公开(公告)号：US20130149564A1

公开(公告)日：2013-06-13

申请号：US13759694

申请日：2013-02-05

Applicant: LG Chem, Ltd.

Inventor： Youngsun PARK ,  Jeongsuk LEE ,  Keunpyo AHN ,  Chunyeon KIM ,  Joung Ho HA ,  Masayuki WAKEBE

IPC: H01M10/42

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H01M2220/30 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/341 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  Y02E60/122

Abstract: A battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state, and a protection circuit module (PCM) electrically connected to the battery cell. The PCM includes a protection circuit board (PCB) electrically connected to the battery cell, the PCB being provided on a region where a circuit is connected with a conductive pattern including a fusing part, having relatively high resistance, configured to fuse itself for interrupting the flow of current when a large amount of current is conducted.

公开(公告)号：US20130128452A1

公开(公告)日：2013-05-23

申请号：US13300871

申请日：2011-11-21

Applicant: Carmelo Engracia Baquiano ,  Carmelo Delovino Cayaban ,  Paul Francis Brosas Montalbo ,  Joseph Estorgio Celocia

Inventor： Carmelo Engracia Baquiano ,  Carmelo Delovino Cayaban ,  Paul Francis Brosas Montalbo ,  Joseph Estorgio Celocia

IPC: H05K7/20

CPC classification number: G05D23/19 ,  H05K1/0201 ,  H05K1/18 ,  H05K7/20 ,  H05K7/20536 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/2018

Abstract: A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.

Abstract translation: 包括在冷启动启动期间操作的加热装置的电路板组件包括具有计算机部件的电路板。 连接到电路板组件的热传递装置在计算机部件操作以移除由计算机部件产生的热量时起作用。 加热装置用于加热热转印装置。 当感测到计算机部件或热转印装置处的冷启动条件的温度时，现场可编程门阵列用于激励加热装置。 加热装置加热时的热转印装置将计算机部件加热到大于冷启动条件的温度。 连接到加热装置的控制装置提供加热装置的操作模式。

公开(公告)号：US08435655B2

公开(公告)日：2013-05-07

申请号：US12458897

申请日：2009-07-27

Applicant: Seok Koh ,  Eunok Kwak

Inventor： Seok Koh ,  Eunok Kwak

IPC: H01M2/22 ,  H01M2/30

CPC classification number: H01M10/4257 ,  H01M2/0404 ,  H01M10/42 ,  H01M2200/00 ,  H01M2200/106 ,  H05K1/0201 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: A secondary battery including a bare cell, a protection circuit module electrically coupled to the bare cell, and a holder between the bare cell and the protection circuit module, wherein the protection circuit module includes a flexible printed circuit board having an upper and a lower surface, a charging/discharging terminal on the upper surface of the flexible printed circuit board and a protection circuit unit on the lower surface of the flexible printed circuit board opposite to the charging/discharging terminal, and the holder is disposed on the protection circuit unit on the lower surface of the flexible printed circuit board.

Abstract translation: 包括裸电池，电耦合到裸电池的保护电路模块和裸电池与保护电路模块之间的保持器的二次电池，其中保护电路模块包括柔性印刷电路板，其具有上表面和下表面 ，柔性印刷电路板的上表面上的充电/放电端子和柔性印刷电路板的与充电/放电端子相对的下表面上的保护电路单元，保持器设置在保护电路单元上 柔性印刷电路板的下表面。

公开(公告)号：US08423317B2

公开(公告)日：2013-04-16

申请号：US11036012

申请日：2005-01-18

Applicant: Tomoya Kamezawa ,  Naoki Takata ,  Masayuki Hirota ,  Masahiro Hiraga ,  Satoshi Ibori

Inventor： Tomoya Kamezawa ,  Naoki Takata ,  Masayuki Hirota ,  Masahiro Hiraga ,  Satoshi Ibori

IPC: G01K11/00

CPC classification number: H01L25/115 ,  G01K7/22 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/0201 ,  H05K3/3447 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2203/304 ,  H01L2924/00

Abstract: A temperature detection method for a semiconductor device and a power conversion apparatus are disclosed. A temperature detection device is used to detect the temperature for thermal protection of a power semiconductor device. The temperature detection device is placed in the proximity of a component having the power semiconductor device packaged therein, and either an emitter terminal or a collector terminal of the power semiconductor device. Since the temperature detection device is mounted on a circuit board, it does not require insulation from a cooling fin on which the power semiconductor device is mounted and lead wires can be eliminated.

Abstract translation: 公开了一种用于半导体器件和功率转换装置的温度检测方法。 温度检测装置用于检测功率半导体器件的热保护的温度。 温度检测装置被放置在其中封装有功率半导体器件的部件附近以及功率半导体器件的发射极端子或集电极端子附近。 由于温度检测装置安装在电路板上，所以不需要与安装有功率半导体器件的散热片绝缘，也可以省略导线。