公开(公告)号：US09955577B2

公开(公告)日：2018-04-24

申请号：US15133352

申请日：2016-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngjin Cho ,  Hyeon Cheol Park ,  Kwanghee Kim ,  Weonho Shin ,  Daejin Yang

IPC: H05K1/09 ,  H05K1/02 ,  H01L51/52 ,  G06F3/047

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/047 ,  G06F2203/04102 ,  H01B1/02 ,  H01B1/023 ,  H01B1/026 ,  H01B1/16 ,  H01L51/5206 ,  H01L51/5234 ,  H01L2251/301 ,  H01L2251/5338 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/0373 ,  H05K2201/0379 ,  H05K2201/0391 ,  H05K2201/09681 ,  H05K2201/10128

Abstract: A conductive component including: a substrate, a first layer comprising a plurality of island structures disposed on the substrate, wherein the island structures include graphene; and a second layer disposed on the first layer, wherein the second layer includes a plurality of conductive nanowires. Also, an electronic device including the conductive component.

公开(公告)号：US09826629B2

公开(公告)日：2017-11-21

申请号：US14729806

申请日：2015-06-03

Applicant: Samsung Display Co., Ltd.

Inventor： Won Il Choi ,  Jong Ho Hong

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0283 ,  H05K2201/0311 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/09736

Abstract: An electronic device including a stretchable/contractible base and a wiring formed on the base, the wiring being divided into a first region having a shape extending in a proceeding direction and a second region in which the proceeding direction is curved. The wiring includes a first conductive layer and a second conductive layer formed of a material that makes the second conductive layer easier to be curved than the first conductive layer. The first conductive layer is formed in the first region and the second conductive layer is formed in the second region.

公开(公告)号：US09807888B2

公开(公告)日：2017-10-31

申请号：US14588321

申请日：2014-12-31

Applicant: TAI-SAW TECHNOLOGY CO., LTD.

Inventor： Yu-Tung Huang ,  Ming-Hung Chang

IPC: H01L23/02 ,  H05K3/30 ,  H01L23/498 ,  H05K1/11 ,  H01L23/00

CPC classification number: H05K3/305 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/1319 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H05K1/111 ,  H05K2201/0373 ,  H05K2201/09781 ,  Y02P70/613 ,  Y10T156/10 ,  H01L2924/00014

Abstract: A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.

公开(公告)号：US09775230B2

公开(公告)日：2017-09-26

申请号：US15232794

申请日：2016-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-jae Kim ,  Hyung-gil Baek ,  Baik-woo Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K3/22

CPC classification number: H05K1/0219 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/183 ,  H05K3/0073 ,  H05K3/22 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/0376 ,  H05K2201/09409 ,  H05K2201/09745 ,  H05K2201/0989 ,  H05K2203/1105 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A printed circuit board is provided. The printed circuit board comprises a base substrate comprising a chip mounting region on an upper surface thereof, a plurality of connection pad structures in the chip mounting region, and an extension pattern on the base substrate, spaced from each of two adjacent connection pad structures from among the plurality of connection pad structures, and extending along the two adjacent connection pad structures. Upper surfaces of the plurality of connection pad structures are positioned at a higher level than an upper surface of the extension pattern.

公开(公告)号：US20170064824A1

公开(公告)日：2017-03-02

申请号：US15232794

申请日：2016-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-jae KIM ,  Hyung-gil BAEK ,  Baik-woo LEE

IPC: H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0219 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/183 ,  H05K3/0073 ,  H05K3/22 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/0376 ,  H05K2201/09409 ,  H05K2201/09745 ,  H05K2201/0989 ,  H05K2203/1105 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A printed circuit board is provided. The printed circuit board comprises a base substrate comprising a chip mounting region on an upper surface thereof, a plurality of connection pad structures in the chip mounting region, and an extension pattern on the base substrate, spaced from each of two adjacent connection pad structures from among the plurality of connection pad structures, and extending along the two adjacent connection pad structures. Upper surfaces of the plurality of connection pad structures are positioned at a higher level than an upper surface of the extension pattern.

Abstract translation: 提供印刷电路板。 印刷电路板包括基底基板，该基板在其上表面上包括芯片安装区域，芯片安装区域中的多个连接焊盘结构以及基板上的延伸图案，与两个相邻的连接焊盘结构中的每一个间隔开 在多个连接焊盘结构中，并且沿着两个相邻的连接焊盘结构延伸。 多个连接垫结构的上表面位于比延伸图案的上表面更高的水平。

公开(公告)号：US09351402B2

公开(公告)日：2016-05-24

申请号：US14554334

申请日：2014-11-26

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC: H05K1/09 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H01L23/00

CPC classification number: H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/107 ,  H05K3/184 ,  H05K3/38 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/0565 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.

公开(公告)号：US20160043489A1

公开(公告)日：2016-02-11

申请号：US14452197

申请日：2014-08-05

Applicant: INFINERA CORP.

Inventor： John Michael Coronati ,  Eugene Messenger ,  Michael Sipics ,  Joseph Edward Riska ,  Jiaming Zhang

IPC: H01R12/71 ,  H01R43/26 ,  H01R4/38

CPC classification number: H01R12/714 ,  H01L31/02002 ,  H01R12/7011 ,  H01R12/73 ,  H05K3/225 ,  H05K3/325 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/068 ,  H05K2201/09427 ,  H05K2201/10121 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2203/176

Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.

Abstract translation: 公开了一种包括桥构件和夹具的装置。 桥构件定位在第一平面中并且具有带有第一表面和第二表面的基底; 以及形成在所述基板的第二表面上的多个不同的导电柱。 夹具具有主体，近端和远端。 身体位于第一平面上方的第二平面中，第二平面在与第一平面平行的2度内。 近端沿着第二平面定位; 并且远端具有多个插脚。 远端在朝向桥接件的方向上偏离第二平面，使得每个尖头接触基板的第一表面。

公开(公告)号：US09253879B2

公开(公告)日：2016-02-02

申请号：US13875896

申请日：2013-05-02

Applicant: NITTO DENKO CORPORATION

Inventor： Jun Ishii ,  Saori Kanazaki

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/06 ,  G11B5/48 ,  H05K3/40 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0296 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/189 ,  H05K3/06 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/053 ,  H05K2201/09072 ,  H05K2201/10083

Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

Abstract translation: 布线电路板包括线，以及在布线电路板的厚度方向上在其一个表面上电连接到电线以电连接到电子元件的端子。 端子在其厚度方向的一个表面上包括在厚度方向上朝向其一侧突出的突出部分和覆盖突出部分在厚度方向上的一个端部的覆盖层。

公开(公告)号：US20150333022A1

公开(公告)日：2015-11-19

申请号：US14280110

申请日：2014-05-16

Applicant: Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

Inventor： Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/05 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/141 ,  H01L2224/16238 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0373

Abstract: Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.

Abstract translation: 这里公开了与集成电路（IC）封装一起使用的接触焊盘。 在一些实施例中，本文公开的接触垫可以设置在IC封装的基板上，并且可以包括金属突出部分和金属凹部。 金属突出部和金属凹部中的每一个可以具有焊料接触表面。 金属凹部的焊接接触表面可以与金属突出部的焊接接触表面间隔开。 本文还公开了相关的设备和技术，并且可以要求保护其他实施例。

公开(公告)号：US20150289371A1

公开(公告)日：2015-10-08

申请号：US14437059

申请日：2013-10-23

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Kiminori Ozaki ,  Yasuhiro Koike ,  Hiroaki Asano ,  Hitoshi Shimadu ,  Shigeki Kawaguchi ,  Tomoaki Asai

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/2732 ,  H01L2224/29013 ,  H01L2224/29017 ,  H01L2224/29018 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83815 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/09427 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.

Abstract translation: 衬底包括绝缘衬底，形成在绝缘衬底的一个表面上的金属层和焊接到金属层的表面的电子部件。 金属层由金属板形成。 金属层的表面具有焊接区域和位于焊接区域的外周上的槽部。