公开(公告)号：US09013882B2

公开(公告)日：2015-04-21

申请号：US14328989

申请日：2014-07-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki Gouchi ,  Takahiro Baba

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/538 ,  H01L23/66 ,  H05K1/16 ,  H01L23/58 ,  H01L25/16 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48 ,  H05K3/46 ,  H01L23/00

CPC classification number: H05K1/185 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L23/562 ,  H01L23/585 ,  H01L23/66 ,  H01L24/19 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/115 ,  H05K1/16 ,  H05K3/4632 ,  H05K3/4697 ,  H05K2201/032 ,  H05K2201/042 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract translation: 高频模块具有通过层压由热塑性树脂材料制成的多个片材并对层压片材进行热压接而形成的多层板，以及设置在多层板中的空腔中的IC芯片。 在IC芯片的一侧和空腔的内壁之间设置间隙。 多层板包括设置在空腔内壁附近的通孔导体，用于防止树脂片在热压接时软化并流入空腔。

公开(公告)号：US20150098196A1

公开(公告)日：2015-04-09

申请号：US14400261

申请日：2012-05-18

Applicant: Logan Peter Palmer

Inventor： Logan Peter Palmer

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/4691 ,  H05K9/0022 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/042 ,  H05K2201/055 ,  H05K2201/056 ,  Y10T29/49124

Abstract: Printed circuit board apparatus with electromagnetic interference shields and methods of making the same.

Abstract translation: 具有电磁干扰屏蔽的印刷电路板装置及其制造方法。

公开(公告)号：US20150062834A1

公开(公告)日：2015-03-05

申请号：US14469675

申请日：2014-08-27

Applicant: YAZAKI CORPORATION

Inventor： Takanori KITAJO ,  Masaki SUGIYAMA ,  Masayuki NAOHARA

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/111 ,  H01R12/526 ,  H01R29/00 ,  H05K1/029 ,  H05K1/14 ,  H05K1/182 ,  H05K3/222 ,  H05K2201/042 ,  H05K2201/09209 ,  H05K2201/10363 ,  H05K2201/10954

Abstract: A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module.

Abstract translation: 跳线模块安装电路板包括：电路板; 以及跳线模块，其具有绝缘体主体，该绝缘体主体设置有用于连接连接图案之间的导电电连接部件，以便通过将导电电连接部件的两端上的每个接触部分连接到形成为 在电路板上彼此间隔开。 跳线模块安装在电路板上，以便在接触部分和形成为彼此间隔开的连接图案之间连接。 电路板包括通过在跳线模块的安装位置根据多个布线规格聚集连接图案形成的连接图案集中部分。

公开(公告)号：US20150054356A1

公开(公告)日：2015-02-26

申请号：US14217179

申请日：2014-03-17

Applicant: Zonit Structured Solutions, LLC

Inventor： Steve Chapel ,  William Pachoud

IPC: H05K1/02 ,  H05K7/20 ,  H05K3/30 ,  H03K17/687 ,  H03K17/13 ,  H05K1/18 ,  H05K5/00

CPC classification number: H03K17/133 ,  H03K17/687 ,  H05K1/0204 ,  H05K3/306 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/2036 ,  Y10T29/4913 ,  Y10T307/937

Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

Abstract translation: 提供紧凑型固态继电器（7）。 固态设备（74,75），例如Triacs或Thyristors用于实现继电器功能。 该装置至少部分地封装在具有用于安装在电子板上的销的壳体中。 在壳体中设有多个“U”型跳线（72）或其它跳线或电线，以作为散热片。 微型风扇（70）被定位成在散热器上方产生空气流并从设备散发热量。

公开(公告)号：US20140376174A1

公开(公告)日：2014-12-25

申请号：US13922136

申请日：2013-06-19

Applicant: SMART Storage Systems, Inc.

Inventor： David Lee Dean ,  Dennis Bennett ,  Robert W. Ellis

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G01R31/20 ,  G06F1/186 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/148 ,  H05K5/0026 ,  H05K7/20 ,  H05K2201/042 ,  H05K2201/058 ,  Y10T29/49002

Abstract: An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.

Abstract translation: 电子组件和制造方法包括：具有圆形轨道和气流接头的气流支架，气流支架电连接圆形轨道和气流接头; 连接到圆形导轨的顶板，用于电连接顶板和圆形导轨; 以及附接到圆形导轨的底板，用于电连接顶板和圆形导轨，底板被定位成在顶板和底板之间形成热通道，用于引导空气通过圆形导轨的通风口。

公开(公告)号：US08916963B2

公开(公告)日：2014-12-23

申请号：US13498919

申请日：2010-10-07

Applicant: Jean-Michel Morelle ,  Ky Lim Tan ,  Laurent Vivet ,  Sandra Dimelli ,  Stéphane Thomelin ,  Hervé Lorin ,  Patrick Dubus

Inventor： Jean-Michel Morelle ,  Ky Lim Tan ,  Laurent Vivet ,  Sandra Dimelli ,  Stéphane Thomelin ,  Hervé Lorin ,  Patrick Dubus

IPC: H01L23/34 ,  H05K3/30 ,  H05K7/00 ,  H01L23/498 ,  H01L23/00 ,  H01L23/36 ,  H01L25/18 ,  H01L25/07 ,  H05K1/14 ,  H01L23/10 ,  H05K3/00

CPC classification number: H05K1/144 ,  H01L23/10 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/72 ,  H01L24/73 ,  H01L25/074 ,  H01L25/18 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/732 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/0061 ,  H05K2201/042 ,  H05K2201/1053 ,  Y10T29/4913 ,  H01L2224/13 ,  H01L2224/72 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.

Abstract translation: 本发明涉及一种优选用于车辆，特别是电动车辆的功率模块（10），其特征在于，所述模块包括两个垂直相邻的半导体芯片（12,14），每个芯片具有第一表面（20,22） 连接到散热器基板（24,26），以及与第一表面分开并且在其上布置至少一个电子部件（38a-44b）的第二表面（28,30），该模块被布置成使得 芯片的第二表面彼此相对布置。

公开(公告)号：US08851733B2

公开(公告)日：2014-10-07

申请号：US13504987

申请日：2010-10-28

Applicant: Frank Lahner ,  Thomas Völkel

Inventor： Frank Lahner ,  Thomas Völkel

IPC: F21V7/04 ,  H05K3/46 ,  G01V8/10 ,  H05K1/14 ,  H05K1/02

CPC classification number: G01V8/10 ,  H05K1/0274 ,  H05K1/144 ,  H05K3/4697 ,  H05K2201/042 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A light signal transmitter and a light receiver for an optical sensor may be used for an industrial automation system. The light signal transmitter has a semiconductor-based light source for generating light. The semiconductor-based light source is disposed in an installation space between outer layers of a multi-layer circuit board. The light emission direction of the semiconductor-based light source is oriented substantially parallel to the layers of the printed circuit board. A deflection unit deflects the light emitted by the semiconductor-based light source in a direction substantially perpendicular to the layers of the printed circuit board. In the case of the light receiver, a light sensor is provided in place of the light source. Such optical sensors can be designed in a particularly flat and installation-friendly manner.

Abstract translation: 用于光学传感器的光信号发射器和光接收器可以用于工业自动化系统。 光信号发射器具有用于产生光的基于半导体的光源。 基于半导体的光源设置在多层电路板的外层之间的安装空间中。 基于半导体的光源的发光方向被取向为基本上平行于印刷电路板的层。 偏转单元使基于半导体的光源发射的光在基本上垂直于印刷电路板的层的方向上偏转。 在光接收器的情况下，提供光传感器来代替光源。 这种光学传感器可以以特别平坦和安装友好的方式设计。

公开(公告)号：US20140198471A1

公开(公告)日：2014-07-17

申请号：US14149864

申请日：2014-01-08

Applicant: FUJITSU LIMITED

Inventor： Naohiko Kajio ,  NAOFUMI KOSUGI ,  Yoshio Matsumoto

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10568 ,  H05K2201/10803 ,  H05K2201/2036 ,  H05K2203/167

Abstract: First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.

Abstract translation: 第一和第二锥形孔设置在第一和第二电路板的相对位置处。 包括第一和第二间隔件的弹性间隔件连接在它们之间以使两者平行连接，从而便于将两者附接到后面板。 第一间隔件在一端部设置有与第一锥形孔配合的锥形部，第二间隔件在一端部设置有与第二锥形孔配合的锥形部。 弹簧插入两个间隔件之间。 第一间隔件装配在锥形孔中，并通过螺钉固定在第一电路板上。 第二电路板通过螺钉固定在第一间隔件上，其状态是将第二锥形孔装配在第二间隔件上，而第二电路板接近第一电路板。

公开(公告)号：US20140187060A1

公开(公告)日：2014-07-03

申请号：US14165723

申请日：2014-01-28

Applicant: OLYMPUS MEDICAL SYSTEMS CORP.

Inventor： Takafumi KUBO

IPC: H01R13/58 ,  H01R12/71

CPC classification number: H01R13/58 ,  A61B1/00124 ,  A61B1/04 ,  G02B23/24 ,  G02B23/2476 ,  H01R12/716 ,  H05K1/14 ,  H05K1/144 ,  H05K3/36 ,  H05K2201/042

Abstract: A substrate connection structure includes: a first substrate having stiffness with a first connector mounted on a front face; a second substrate having stiffness with a second connector detachably attached to the first connector mounted on a front face facing the front face of the first substrate; and a restricting member including a projection portion, the restricting member including a plate-like member and being detachably attachable to the first substrate by being moved along a planar surface of the first substrate, the projection portion projecting from the front face of the first substrate and regulating a position of the second substrate relative to the first substrate in a state in which the restricting member is attached to the first substrate, and limiting a direction in which the second substrate is detached when the second connector mounted on the second substrate is detached from the first connector on the first substrate.

Abstract translation: 基板连接结构包括：第一基板，具有刚性，第一连接器安装在前表面上; 具有刚度的第二基板，具有可拆卸地附接到安装在面向所述第一基板的前表面的正面上的所述第一连接器的第二连接器; 以及限制构件，其包括突出部，所述限制构件包括板状构件，并且通过沿着所述第一基板的平坦表面移动而可拆卸地附接到所述第一基板，所述突出部从所述第一基板的前表面突出 以及在所述限制件附接到所述第一基板的状态下调节所述第二基板相对于所述第一基板的位置，并且当所述第二基板安装在所述第二基板上时，限制所述第二基板被拆卸的方向 从第一基板上的第一连接器。

公开(公告)号：US08767409B2

公开(公告)日：2014-07-01

申请号：US13470301

申请日：2012-05-12

Applicant: Tsung-Jung Cheng

Inventor： Tsung-Jung Cheng

IPC: H01R12/16

CPC classification number: H05K1/144 ,  H01L23/552 ,  H01L25/16 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2924/00

Abstract: The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.

Abstract translation: 本公开提供一种自密封堆叠结构，其包括基板单元，第一框架，导电单元和阻挡单元。 基板单元包括第一和第二基板以及夹在其间的第一框架。 导电单元包括多个第一导体和电连接第一基板，第一框架和第二基板的第二导体。 第一和第二导体电连接。 包括至少两个第一和至少两个第二阻塞器的阻塞单元分别围绕多个第一和第二导体周围布置。 第一基板和第一框架通过由焊料组合的第一阻挡件以密封方式连接，其中第一框架和第二基板以密封方式连接通过由焊料组合的第二阻挡件。