公开(公告)号：US20170168977A1

公开(公告)日：2017-06-15

申请号：US15250521

申请日：2016-08-29

Applicant: Le Holdings (Beijing) Co., Ltd. ,  LE SHI ZHI XIN ELECTRONIC TECHNOLOGY (TIANJIN) LIMITED

Inventor： Xiaoming HOU

IPC: G06F13/42 ,  G06F13/40 ,  H05K1/18

CPC classification number: G06F13/4282 ,  G06F13/4095 ,  H05K1/141 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: A PCB apparatus, a module board, and a method for function extension is disclosed. The PCB apparatus includes a substrate for PCB design, and further includes: at least one module board, integrated with a performance enhancing module; and a connector, the module board being connected to the substrate through the connector, such that the module board and the substrate perform signal transmission.

公开(公告)号：US09678149B2

公开(公告)日：2017-06-13

申请号：US14166296

申请日：2014-01-28

Applicant: CELADON SYSTEMS, INC.

Inventor： Bryan J. Root ,  William A. Funk

IPC: G01R31/28 ,  G01R1/073 ,  G01R3/00 ,  H05K1/11 ,  H05K3/32

CPC classification number: G01R31/2889 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

公开(公告)号：US09648749B1

公开(公告)日：2017-05-09

申请号：US14943299

申请日：2015-11-17

Applicant: Martin Brokner Christiansen ,  Leonard George Chorosinski ,  H. Craig Heffner ,  Stanley Katsuyoshi Wakamiya ,  Keith R. Kirkwood

Inventor： Martin Brokner Christiansen ,  Leonard George Chorosinski ,  H. Craig Heffner ,  Stanley Katsuyoshi Wakamiya ,  Keith R. Kirkwood

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/303 ,  H05K3/46 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/09763

Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.

公开(公告)号：US09648744B2

公开(公告)日：2017-05-09

申请号：US13610701

申请日：2012-09-11

Applicant: Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

IPC: H05K1/18 ,  G06F1/16 ,  H05K7/02 ,  H05K3/00 ,  H05K3/30 ,  G06K13/08 ,  H05K1/11

CPC classification number: H05K1/18 ,  G06F1/1658 ,  G06K13/0825 ,  H04M2250/14 ,  H05K1/117 ,  H05K1/183 ,  H05K3/00 ,  H05K3/30 ,  H05K7/02 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09163 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

公开(公告)号：US09648728B1

公开(公告)日：2017-05-09

申请号：US14601973

申请日：2015-01-21

Applicant: ALTERA CORPORATION

Inventor： Vincent Hool ,  Susan Huang

IPC: H01L25/18 ,  H01L25/065 ,  H05K1/02 ,  H01L23/00 ,  H01L23/14 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H01L23/145 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75701 ,  H01L2224/75704 ,  H01L2224/7598 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/3512 ,  H05K1/0326 ,  H05K1/111 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2203/0169 ,  H05K2203/167 ,  H01L2924/00014

Abstract: A coreless organic substrate in which a mounting hole is formed near each corner of the substrate and is used during assembly processes to secure the substrate so as to prevent flexing.

公开(公告)号：US09644832B2

公开(公告)日：2017-05-09

申请号：US13951800

申请日：2013-07-26

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Mi Ra Yun

IPC: F21V21/00 ,  F21V7/00 ,  F21V29/83 ,  F21S8/04 ,  F21V23/00 ,  F21W131/40 ,  H05K1/02 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21V29/83 ,  F21S8/04 ,  F21V7/005 ,  F21V23/005 ,  F21W2131/40 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K2201/09063 ,  H05K2201/10106

Abstract: Disclosed is a lighting apparatus that can be provided in a warehouse and driven by using an industrial power source and has superior light efficiency and long life span.The disclosed lighting apparatus is provided in a warehouse and driven by an industrial power source, and comprises a main body having a plurality of concave portions and a plurality of convex portions; and a plurality of light emitting modules disposed in the concave portions of the main body, thereby having low power consumption and long life span.

公开(公告)号：US09596765B2

公开(公告)日：2017-03-14

申请号：US14426364

申请日：2012-09-11

Applicant: Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

Inventor： Akira Yamaki ,  Tatsuya Kikuchi ,  Mitsuaki Toda

IPC: H05K3/30 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  C25D7/06 ,  H05K1/09 ,  H05K3/40 ,  H01L23/544 ,  H01L21/683 ,  H05K1/02 ,  H01L21/56

CPC classification number: H05K3/0008 ,  C25D7/0607 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/09 ,  H05K1/185 ,  H05K1/188 ,  H05K3/305 ,  H05K3/4007 ,  H05K3/403 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4658 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  H01L2924/00

Abstract: A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

Abstract translation: 根据本发明的用于组件的基片的制造方法包括：根据形成在铜层上的标记来定位电子部件，该标记由铜蚀刻剂（铜蚀刻剂）蚀刻铜不易蚀刻的材料构成 在将电子部件粘附在铜层上之后，将电子部件和标记嵌入绝缘基板后，将铜层的一部分进行蚀刻除去，形成露出标记的窗口，形成 参照曝光标记的LVH到达电子部件的端子，经由通过将电镀施加到LVH而形成的导通孔将端子和铜层电连接，然后将铜层形成布线图案。

公开(公告)号：US09583900B2

公开(公告)日：2017-02-28

申请号：US15169004

申请日：2016-05-31

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Chih-Pi Cheng ,  Wen He ,  Qi-Jin Yi ,  Feng Zeng

IPC: H01R24/00 ,  H01R24/60 ,  H01R13/405 ,  H01R12/53 ,  H01R13/627 ,  H01R4/02 ,  H01R13/6583 ,  H01R24/30 ,  H01R13/6582 ,  H01R12/72 ,  H01R107/00 ,  H05K1/11 ,  H05K1/18 ,  H01R13/6474

CPC classification number: H01R24/60 ,  H01R4/023 ,  H01R12/53 ,  H01R12/724 ,  H01R13/405 ,  H01R13/6273 ,  H01R13/6275 ,  H01R13/6474 ,  H01R13/6582 ,  H01R13/6583 ,  H01R24/30 ,  H01R2107/00 ,  H05K1/117 ,  H05K1/184 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A plug connector includes a front housing, a first and a second terminal module each including an insulator insert molded with terminals. The front housing defines a rear wall, a front mating cavity opening forwards, and a plurality of terminal passageways running through the rear wall in a front and rear direction and the front housing in a vertical direction a first terminal module, The terminals comprising contacting portions received in the corresponding terminal passageways. The shell fitly encloses the front housing and the insulators. The front housing unitarily defines a plurality of protection flanges, each protection flange is located above a front end of each terminal passageway and each contacting section is located inside the protection flange thereby ensuring the contacting sections separating from the shell during the contacting sections are pushed outwards by an insertion of a mating receptacle connector.

Abstract translation: 插头连接器包括前壳体，第一和第二端子模块，每个端子模块包括模制有端子的绝缘体插件。 前壳体限定了后壁，向前开口的前配合空腔和沿前后方向延伸穿过后壁的多个端子通道，并且在垂直方向上限定了前壳体，该第一端子模块包括接触部分 收到相应的终端通道。 壳体适合地包围前壳体和绝缘体。 前壳体整体地限定多个保护凸缘，每个保护凸缘位于每个端子通道的前端上方，并且每个接触部分位于保护凸缘内部，从而确保在接触部分被向外推动的与壳体分离的接触部分 通过插入配合插座连接器。

公开(公告)号：US09583855B2

公开(公告)日：2017-02-28

申请号：US15134839

申请日：2016-04-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Rubo Ying ,  Shounian Chen ,  Jinmoo Park

IPC: H01R12/00 ,  H01R12/71 ,  H01R4/48 ,  H01R4/04

CPC classification number: H01R12/716 ,  H01R4/04 ,  H01R4/48 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/167

Abstract: A circuit board device is provided, including: a first circuit board having a first predetermined connection section; a second circuit board arranged opposite to the first circuit board and having a second predetermined connection section directly facing the first predetermined connection section; and a connector including a first portion and a second portion. The connecter has: a first state where the first portion is arranged at a side of the first circuit board away from the second circuit board, the second portion is arranged at a side of the second circuit board away from the first circuit board, and the first portion and the second portion cooperate with each other to press the first circuit board against the second circuit board; and a second state where the first circuit board is separated from the second circuit board.

Abstract translation: 提供一种电路板装置，包括：具有第一预定连接部分的第一电路板; 第二电路板，布置成与第一电路板相对并具有直接面对第一预定连接部分的第二预定连接部分; 以及包括第一部分和第二部分的连接器。 连接器具有第一状态，其中第一部分布置在远离第二电路板的第一电路板的一侧，第二部分布置在第二电路板的远离第一电路板的一侧，并且 第一部分和第二部分彼此配合以将第一电路板压靠第二电路板; 以及第二状态，其中第一电路板与第二电路板分离。

公开(公告)号：US09560736B2

公开(公告)日：2017-01-31

申请号：US14546494

申请日：2014-11-18

Applicant: Cisco Technology, Inc.

Inventor： Long Dang ,  Don Nguyen ,  Michael Brooks

IPC: H05K1/02 ,  H05K3/22 ,  F16B2/24 ,  H05K1/18

CPC classification number: H05K7/2039 ,  F16B2/248 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10265 ,  H05K2201/10393

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract translation: 在一个实施例中，印刷电路板具有孔。 该孔在印刷电路板的表面上具有最长的程度。 夹子通过脚的脚插在孔中。 脚是具有长度超过孔的最长程度的一半的延伸部。 散热器部分地通过夹子相对于印刷电路板保持。 散热器的一部分接触夹子的环，并且将夹子施加在远离印刷电路板的夹子上。 印刷电路板相对于散热器的夹子的脚将夹子固定到印刷电路板上以抵抗力。 所述插脚构造成抵消所述脚，使得所述延伸部与沿着所述孔的最长延伸部分延伸的长度小于所述脚的长度的总和小于通过所述孔插入的最长程度。