Abstract:
A PCB apparatus, a module board, and a method for function extension is disclosed. The PCB apparatus includes a substrate for PCB design, and further includes: at least one module board, integrated with a performance enhancing module; and a connector, the module board being connected to the substrate through the connector, such that the module board and the substrate perform signal transmission.
Abstract:
A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.
Abstract:
A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.
Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.
Abstract:
A coreless organic substrate in which a mounting hole is formed near each corner of the substrate and is used during assembly processes to secure the substrate so as to prevent flexing.
Abstract:
Disclosed is a lighting apparatus that can be provided in a warehouse and driven by using an industrial power source and has superior light efficiency and long life span.The disclosed lighting apparatus is provided in a warehouse and driven by an industrial power source, and comprises a main body having a plurality of concave portions and a plurality of convex portions; and a plurality of light emitting modules disposed in the concave portions of the main body, thereby having low power consumption and long life span.
Abstract:
A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.
Abstract:
A plug connector includes a front housing, a first and a second terminal module each including an insulator insert molded with terminals. The front housing defines a rear wall, a front mating cavity opening forwards, and a plurality of terminal passageways running through the rear wall in a front and rear direction and the front housing in a vertical direction a first terminal module, The terminals comprising contacting portions received in the corresponding terminal passageways. The shell fitly encloses the front housing and the insulators. The front housing unitarily defines a plurality of protection flanges, each protection flange is located above a front end of each terminal passageway and each contacting section is located inside the protection flange thereby ensuring the contacting sections separating from the shell during the contacting sections are pushed outwards by an insertion of a mating receptacle connector.
Abstract:
A circuit board device is provided, including: a first circuit board having a first predetermined connection section; a second circuit board arranged opposite to the first circuit board and having a second predetermined connection section directly facing the first predetermined connection section; and a connector including a first portion and a second portion. The connecter has: a first state where the first portion is arranged at a side of the first circuit board away from the second circuit board, the second portion is arranged at a side of the second circuit board away from the first circuit board, and the first portion and the second portion cooperate with each other to press the first circuit board against the second circuit board; and a second state where the first circuit board is separated from the second circuit board.
Abstract:
In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.