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    Optical/electrical composite wiring board and a manufacturing method thereof
    83.
    发明授权
    Optical/electrical composite wiring board and a manufacturing method thereof 有权
    光电复合布线板及其制造方法

    公开(公告)号：US07724989B2

    公开(公告)日：2010-05-25

    申请号：US12118344

    申请日：2008-05-09

    Applicant: Hiroaki Kodama ,  Kazuhito Yamada

    Inventor： Hiroaki Kodama ,  Kazuhito Yamada

    IPC: G02B6/10 ,  G02B6/12

    CPC classification number: G02B6/12002 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/005 ,  H05K3/107 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2203/0108

    Abstract: The optical/electrical composite wiring board comprises a lower insulating layer that also serves as a lower clad; a upper insulating layer that also serves as an upper clad; a core that is placed between the lower insulating layer and the upper insulating layer and has a predetermined optical wiring pattern; and a conductor layer that is placed along with the core between the lower insulating layer and the upper insulating layer and has a predetermined electrical wiring pattern. Herein, the core and the conductor layer are formed via a short manufacturing method, whereby the concave portion for optical wiring and the concave portion for electrical wiring are formed on the lower insulating layer by press process, and a core material and conductor material are filled into each of the concave portions, and afterward, the core material and conductor material are ground until they are flush with the upper surface of the lower insulating layer.

    Abstract translation: 光电复合布线板包括也用作下包层的下绝缘层; 也用作上部包层的上部绝缘层; 放置在下绝缘层和上绝缘层之间并具有预定光布线图案的芯; 以及导体层，其与所述芯在所述下绝缘层和所述上绝缘层之间放置并且具有预定的电布线图案。 这里，通过短的制造方法形成芯和导体层，由此通过冲压加工在下绝缘层上形成用于光布线的凹部和电布线用凹部，并且填充芯材和导体材料 在每个凹部中分离，然后将芯材和导体材料研磨成与下绝缘层的上表面齐平。

    Integrating Capacitors Into Vias Of Printed Circuit Boards
    84.
    发明申请
    Integrating Capacitors Into Vias Of Printed Circuit Boards 有权
    将电容器集成到印刷电路板的通孔中

    公开(公告)号：US20100124035A1

    公开(公告)日：2010-05-20

    申请号：US12274407

    申请日：2008-11-20

    Applicant: Justin P. Bandholz ,  Jonathan R. Hinkle ,  Pravin Patel

    Inventor： Justin P. Bandholz ,  Jonathan R. Hinkle ,  Pravin Patel

    IPC: H05K1/18

    CPC classification number: H05K1/162 ,  H05K1/0239 ,  H05K3/429 ,  H05K2201/09536 ,  H05K2201/09809

    Abstract: A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole characterized by a generally tubular inner surface; a capacitor integrated within the via, the capacitor including two capacitor plates, an inner plate and an outer plate, the two plates composed of electrically conductive material disposed upon the inner surface of the via hole, both plates traversing layers of the laminate, the inner plate traversing more layers of the laminate than are traversed by the outer plate; and a layer of dielectric material disposed between the two plates.

    Abstract translation: 印刷电路板（“PCB”），其电容器集成在PCB的通孔内，PCB包括层压板; 通孔，其包括穿过所述PCB的层的通孔，所述通孔的特征在于大致管状的内表面; 集成在通孔内的电容器，电容器包括两个电容器板，内板和外板，两个板由设置在通孔内表面上的导电材料组成，两个板横跨层压板，内部 板穿过层压板比由外板穿过的多层; 以及设置在两个板之间的介电材料层。

    Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the Same
    87.
    发明申请
    Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the Same 审中-公开
    具有嵌入式半导体元件的印刷电路板及其制造方法

    公开(公告)号：US20100006331A1

    公开(公告)日：2010-01-14

    申请号：US12501102

    申请日：2009-07-10

    Applicant: Shin-Ping Hsu

    Inventor： Shin-Ping Hsu

    IPC: H05K1/16 ,  H05K1/11 ,  H05K3/30 ,  H05K3/10

    CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01033 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10674 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: A printed circuit board having a semiconductor component embedded therein and a method of fabricating the same are proposed, including: providing a circuit board body having a through hole, a first surface and an opposing second surface both provided with a core circuit layer thereon; forming on the first surface a first dielectric layer with a dielectric-layer opening for exposing part of the first surface; forming a first circuit layer on the first dielectric layer, and forming first conductive vias in the first dielectric layer; fixing in position to the through hole a semiconductor chip having an active surface with electrode pads thereon; forming in the dielectric-layer opening a third dielectric layer for covering the active surface of the semiconductor chip; forming a third circuit layer on the third dielectric layer, and forming third conductive vias in the third dielectric layer. The printed circuit board thus fabricated is warpage-free.

    Abstract translation: 提出了一种嵌入其中的半导体元件的印刷电路板及其制造方法，包括：提供具有通孔的电路板主体，第一表面和相对的第二表面，其上均设有芯线电路层; 在所述第一表面上形成具有用于暴露所述第一表面的一部分的介电层开口的第一介电层; 在所述第一电介质层上形成第一电路层，以及在所述第一电介质层中形成第一导电通孔; 将具有活性表面的半导体芯片固定在通孔上，其上具有电极焊盘; 在所述电介质层开口中形成用于覆盖所述半导体芯片的有源表面的第三电介质层; 在第三电介质层上形成第三电路层，并在第三介电层中形成第三导电通孔。 这样制造的印刷电路板是无翘曲的。

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