Abstract:
An electronic assembly comprises a printed circuit board that has an electronic component that is attached mechanically and electrically to the printed circuit board by soldering. A plastic header connector covers the electronic component and provides a socket for the electronic component when the plastic header connector is attached to the printed circuit board solely by portions of the plastic header connector.
Abstract:
A vehicle light assembly includes a casing with a plurality of frames connected thereto and each frame has a hole for receiving a light bulb of a Light Emitting Diode therein. Each Light Emitting Diode includes two legs and two protrusions extend from the two legs respectively. The legs of the Light Emitting Diodes are connected to a circuit board by a section from a distill end of each leg to the protrusion. The light bulbs are then bent toward a side of the circuit board and engaged with the holes of the frames. The side of the circuit board is shaped to cooperate with the positions of the frames.
Abstract:
A motherboard may have contact pads arranged along a peripheral region on one or both surfaces thereof. A memory module may have unit packages fixed to an upper plate and a lower plate of a module frame. The unit packages may be spaced apart from each other. The upper and the lower unit packages may have contact terminals facing each other. The contact terminals may be elastically bendable, and/or the unit packages may be mounted on the plates via elastic members. The peripheral region of the motherboard may be inserted into the memory module, so the contact terminals of the memory module may elastically contact with and be electrically coupled to the contact pads of the motherboard.
Abstract:
Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards. The lead frame connectors include a conductive lead structure that is encased in an insert injection molded plastic casing. The lead frame connector is aligned with the leads that protrude from the back end of the corresponding optical sub-assembly (OSA). The leads pass through corresponding holes in the lead frame connector and are soldered to the conductors of the lead frame assembly. Once the soldering has been performed, the combined OSA and lead frame connector becomes a surface mount device that can then be mounted to the PCB. Assembling an optical transceiver using the lead frame connectors is generally less expensive and more reliable compared to the use of conventional flexible printed circuit board connectors.
Abstract:
A filter includes a coil leading structure and at least one coil. The coil leading structure includes a board and at least one pin. The pin is disposed at a side of the board and formed integrally with the board as a monolithic piece. The core is disposed on the board and has at least one end to be coupled with the pin.
Abstract:
An edge connector assembly includes a PCB defining a first face, a second face opposite to the first face thereof and a notch therein, a daughter board defining a front mating portion and a rear retaining portion and an edge connector mounted in the notch of the PCB. The connector includes an insulating housing defining a longitudinal slot for receiving the front mating portion of the daughter board and a mounting face thereof to abut against the first face of the PCB, a plurality of contacts defining contacting portions extending into the slot. The daughter board is inserted into slot from the second face of the PCB in a slant direction and then pivots about the front mating portion and is retained in the notch.
Abstract:
Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.
Abstract:
A power supply is described. The power supply includes a main power connector and one or more circuit boards rigidly connected to the main power connector, including mechanical and electrical connection. The main power connector has a body that includes a plurality of contacts. The main power connector is configured to mate with a corresponding connector on a motherboard in a computer. The motherboard is coupled to one or more processors. A first plane including a first circuit board in the one or more circuit boards is substantially parallel to a symmetry plane of the body. The symmetry plane includes a direction of insertion of the main power connector when mated with the corresponding connector. The one or more circuit boards include one or more switched mode power supplies to convert an input signal to one or more output signals.
Abstract:
A coaxial connector is configured to be connected to a flexible printed circuit board on which a signal line is formed. An inner conductor is configured to be connected to the signal line. An outer conductor surrounds the inner conductor and serves as a connector body. At least one slit is provided to the outer conductor so that a portion of the flexible printed circuit board is inserted therein.
Abstract:
A communications adaptor card is disclosed herein. One embodiment of the communications adaptor card comprises, a printed-circuit board, the printed circuit board having at least one keep-out area, the at least one keep-out area configured to accept a multi-contact electrical connector receptacle and at least one optical module attached to the printed circuit board. The at least one optical module can be attached to the printed circuit board substantially within the at-least-one keep-out area.