公开(公告)号：US20120012365A1

公开(公告)日：2012-01-19

申请号：US13107911

申请日：2011-05-14

Applicant: GABE CHERIAN ,  Don Ellison Saunders

Inventor： GABE CHERIAN ,  Don Ellison Saunders

IPC: H05K1/00

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling and thermal fluctuations. The invention more specifically shows certain improvements related to its mother patent application, called Thermal Flex Contact Carrier (TFCC), where the improvements allow the height of the contact elements to be now not restricted anymore by the size of the spaces or distances between the contact pads of the devices to be attached together. Certain improvements to the carrier wafer are also shown.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环和热波动的不期望的影响的手段和方法。 本发明更具体地示出了与其母版专利申请（称为热弹性接触载体（TFCC））相关的某些改进，其中改进使得接触元件的高度现在不再受限于接触的空间或距离之间的距离 要连接在一起的设备的垫。 还示出了对载体晶片的某些改进。

公开(公告)号：US20110141699A1

公开(公告)日：2011-06-16

申请号：US12639092

申请日：2009-12-16

Applicant: David L. Hager ,  Paul A. Wormsbecher

Inventor： David L. Hager ,  Paul A. Wormsbecher

IPC: H05K7/20 ,  H05K7/00 ,  H05K3/30

CPC classification number: H05K7/12 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/10871 ,  H05K2203/1446 ,  Y10T29/4913

Abstract: Various embodiments of the present invention provide an anchor, circuit board assembly, and method for operably engaging an electronic component with a circuit board having a first side and a second side. Anchor embodiments include an anchor portion configured for receiving at least a portion of the electronic component and a pair of anchor legs flexibly extending from the ends of the anchor portion and configured for insertion into apertures defined in the circuit board. The anchor further includes a compression element slidably disposed about the anchor legs and movable between an unlocked position and a locked position. The compression element is configured for urging the anchor legs towards one another when moved from the unlocked position to the locked position such that the anchor is secured in the apertures when the compression element is in the locked position.

Abstract translation: 本发明的各种实施例提供了一种锚固器，电路板组件和用于将电子部件与具有第一侧和第二侧的电路板可操作地接合的方法。 锚固实施例包括构造成用于接收电子部件的至少一部分的锚定部分和从锚定部分的端部柔性地延伸并且被配置为插入到限定在电路板中的孔中的一对锚腿。 锚固件还包括可滑动地设置在锚腿周围并且可在解锁位置和锁定位置之间移动的压缩元件。 压缩元件构造成当从解锁位置移动到锁定位置时将锚腿朝向彼此推动，使得当压缩元件处于锁定位置时，锚固件固定在孔中。

公开(公告)号：US20110134597A1

公开(公告)日：2011-06-09

申请号：US12630677

申请日：2009-12-03

Applicant: Mark E. Andresen ,  Virginia Ott

Inventor： Mark E. Andresen ,  Virginia Ott

IPC: H05K1/18 ,  G06F1/16 ,  H01R9/00

CPC classification number: H05K3/308 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/10303 ,  H05K2201/10545 ,  H05K2201/10871 ,  H05K2203/0207 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A printed circuit board and method of making a print circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Abstract translation: 一种印刷电路板和制造具有一个或多个孔的印刷电路板的方法，所述孔被可控制地钻出以延伸到印刷电路板基板中到第一和第二面之间的预定深度。 机械定位销被接收到一个或多个孔中的每一个中，以机械对准用于与印刷电路板基板电子接口的第一部件。 第二部件安装在与一个或多个孔直接相对的第二面上，使得第二部件与形成在与孔直接相对的第二面上的导电迹线或互连电子连通。

公开(公告)号：US20110084303A1

公开(公告)日：2011-04-14

申请号：US12865388

申请日：2009-01-30

Applicant: Yeon Su Cho ,  Chang Won Lee ,  Kyung Min Cho

Inventor： Yeon Su Cho ,  Chang Won Lee ,  Kyung Min Cho

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H05K1/0203 ,  H01L33/642 ,  H01L2924/0002 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/10553 ,  H05K2201/10871 ,  H01L2924/00

Abstract: The present invention relates to the heat-radiation structure of a pin-type power Light Emitting Diode (LED). The heat-radiation structure includes an LED device, first and second lead frames, a mold unit, and a heat sink. The first lead frame is electrically connected to the LED device, and extended forward to the outside in order to supply power to the LED device. The second lead frame is provided to face the first lead frame, and extended forward to the outside. The mold unit includes the LED device, and molds the upper portions of the first and second lead frames out transparent material. The heat sink is provided at a bottom of the mold unit so that the lead frames penetrate therethrough, fixed into any of the two lead frames, and configured to receive heat from the lead frame which comes into contact therewith and to radiate the heat to the outside.

Abstract translation: 本发明涉及一种针式功率发光二极管（LED）的散热结构。 热辐射结构包括LED器件，第一和第二引线框架，模具单元和散热器。 第一引线框架电连接到LED器件，并且向前延伸到外部以便向LED器件供电。 第二引线框架被设置为面向第一引线框架并向外延伸到外部。 模具单元包括LED装置，并且将第一和第二引线框架的上部模制成透明材料。 散热器设置在模具单元的底部，使得引线框架穿过其中，固定到两个引线框架中的任一个中，并且构造成从与其接触的引线框架接收热量并将热量辐射到 外。

公开(公告)号：US20090039905A1

公开(公告)日：2009-02-12

申请号：US11815506

申请日：2006-01-11

Applicant: Kiyoshi Kimura ,  Fujio Hara ,  Ken-ichi Koyama ,  Sugiro Shimoda

Inventor： Kiyoshi Kimura ,  Fujio Hara ,  Ken-ichi Koyama ,  Sugiro Shimoda

IPC: H01R11/01 ,  G01R3/00 ,  G01R31/28

CPC classification number: G01R3/00 ,  G01R1/07378 ,  H01R11/01 ,  H01R13/03 ,  H05K3/4046 ,  H05K2201/10871 ,  H05K2203/308 ,  Y10T29/49124

Abstract: Disclosed herein are a composite conductive sheet that has rigid conductors movable in a thickness-wise direction of an insulating sheet without falling off from the insulating sheet and is easy to handle by itself, a production process thereof, and an anisotropically conductive connector, an adaptor device and an electrical inspection apparatus for circuit devices, which are each equipped with this composite conductive sheet.The composite conductive sheet of the invention has an insulating sheet, in which a plurality of through-holes each extending in a thickness-wise direction of the sheet are formed, and rigid conductors arranged respectively in the through-holes in the insulating sheet so as to protrude from both surfaces of the insulating sheet, wherein each of the rigid conductors has terminal portions formed on both ends of a body portion inserted into the through-hole in the insulating sheet and each having a diameter greater than a diameter of the through-hole in the insulating sheet, and is movable in the thickness-wise direction of the insulating sheet.

Abstract translation: 这里公开了一种复合导电片，其具有在绝缘片的厚度方向上可移动的刚性导体，而不会从绝缘片脱落，并且易于自身处理，其制造方法和各向异性导电连接器，适配器 装置和用于电路装置的电气检查装置，每个装备有该复合导电片。 本发明的复合导电片具有绝缘片，其中形成有沿片材的厚度方向延伸的多个通孔，以及分别布置在绝缘片中的通孔中的刚性导体，以便 从绝缘片的两个表面突出，其中每个刚性导体具有形成在插入绝缘片中的通孔中的主体部分的两端上的端子部分，并且每个具有大于通孔直径的直径， 并且能够在绝缘片的厚度方向上移动。

公开(公告)号：US20080144260A1

公开(公告)日：2008-06-19

申请号：US11979972

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H05K7/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二个土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

公开(公告)号：US07085146B2

公开(公告)日：2006-08-01

申请号：US10378549

申请日：2003-03-03

Applicant: Lennart Pitzele

Inventor： Lennart Pitzele

IPC: H02M1/00 ,  H01R23/72

CPC classification number: H05K7/142 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。

公开(公告)号：US06941537B2

公开(公告)日：2005-09-06

申请号：US10067244

申请日：2002-02-07

Applicant: Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

Inventor： Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  G06F17/50

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/1319 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K3/303 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10022 ,  H05K2201/10303 ,  H05K2201/1053 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A standoff device provides predetermined control of a standoff distance between electrical components mounted together with opposing conductive grid array patterns. In an embodiment, a predetermined electrical function is provided by the device to at least one of the electrical components. The standoff device comprises a plurality of rigid one-piece standoff pins which, in an embodiment, contains one or more stops which buttress against the electrical components to serve as a distancing control structure. In an embodiment, the standoff device is integral with one of the electrical components.

Abstract translation: 对接装置提供了通过相对的导电栅格阵列图案安装在一起的电气部件之间的间隔距离的预定控制。 在一个实施例中，预定的电功能由该装置提供给至少一个电气部件。 间隔装置包括多个刚性的一体式支座销，在一个实施例中，该销钉包含一个或多个支撑电气部件以用作隔离控制结构的止挡件。 在一个实施例中，支座装置与电气部件之一是一体的。

公开(公告)号：US06924964B2

公开(公告)日：2005-08-02

申请号：US10316026

申请日：2002-12-11

Applicant: Hiroyuki Ashiya ,  Masataka Suzuki ,  Yoshiyuki Tanaka ,  Shingo Matsuura

Inventor： Hiroyuki Ashiya ,  Masataka Suzuki ,  Yoshiyuki Tanaka ,  Shingo Matsuura

IPC: H05K3/34 ,  H01H1/58 ,  H01H45/04 ,  H01H45/14 ,  H01H50/14 ,  H01H50/44 ,  H05K1/18 ,  H05K3/30 ,  H01H47/00

CPC classification number: H01H1/5805 ,  H01H50/14 ,  H01H50/443 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: Terminals (11, 13) for electrical connection respectively have front end portions (11b, 13b) to be joined to a wiring board (20) with solder and base end portions (11a, 13a) drawn outside from a cover (7) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil (5) by the deflection deformation of the intermediate portions (11c, 13c) of the terminals positioned closer to the cover than the wiring board 20 with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of L′ in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.

Abstract translation: 用于电连接的端子（11,13）分别具有要接合到布线板（20）的前端部分（11b，13b），焊料和基端部分（11a，13a）从盖子 7）由热膨胀材料制成。 为了使基端部吸收由于电磁线圈（5）由于中间部（11c，13c）的偏转变形而产生的热而受到热膨胀的盖受到的外力的应力 端子位于比布线板20更靠近盖子的位置，并且继电器件安装在布线板上，端子沿着端子的延伸方向形成有预定长度的L'，从而确保必要的柔性所需的长度 对于中间部分。

公开(公告)号：US06912780B2

公开(公告)日：2005-07-05

申请号：US10860427

申请日：2004-06-03

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R12/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。