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    Method for evaluating secondary optical system of electron beam inspection device
    1.
    发明授权
    Method for evaluating secondary optical system of electron beam inspection device 有权

    公开(公告)号：US11251017B2

    公开(公告)日：2022-02-15

    申请号：US16891620

    申请日：2020-06-03

    Applicant: EBARA CORPORATION

    Inventor： Takehide Hayashi

    IPC: H01J37/28 ,  H01J37/244 ,  G01N23/225

    Abstract: A method for evaluating a secondary optical system of an electron beam inspection device provided with a primary optical system that irradiates a sample placed at an observation target position with an electron beam emitted from an electron source, and the secondary optical system that forms, on a detector, an enlarged image of an electron beam generated from the sample or an electron beam transmitted through the sample. The method includes: placing a photoelectric surface at the observation target position; irradiating the photoelectric surface with laser; forming an enlarged image of an electron beam generated from the photoelectric surface on the detector by the secondary optical system; and evaluating the secondary optical system based on an electron beam image obtained by the detector.

    Inspection apparatus
    3.
    发明授权
    Inspection apparatus 有权

    公开(公告)号：US09728374B2

    公开(公告)日：2017-08-08

    申请号：US15147356

    申请日：2016-05-05

    Applicant: EBARA CORPORATION

    Inventor： Takehide Hayashi ,  Masahiro Hatakeyama ,  Shinji Yamaguchi ,  Masato Naka

    IPC: H01J37/26 ,  H01J37/22 ,  H01J37/28

    CPC classification number: H01J37/28 ,  H01J37/185 ,  H01J37/222 ,  H01J37/224 ,  H01J2237/2448 ,  H01J2237/2806 ,  H01J2237/2817

    Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.

    Electro-optical inspection apparatus and method with dust or particle collection function
    4.
    发明授权
    Electro-optical inspection apparatus and method with dust or particle collection function 有权
    电光检测装置及方法，具有灰尘或颗粒收集功能

    公开(公告)号：US09105444B2

    公开(公告)日：2015-08-11

    申请号：US14096361

    申请日：2013-12-04

    Applicant: Ebara Corporation

    Inventor： Kenji Watanabe ,  Masahiro Hatakeyama ,  Yoshihiko Naito ,  Tatsuya Kohama ,  Kenji Terao ,  Takeshi Murakami ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Hiroshi Sobukawa ,  Norio Kimura

    IPC: H01J37/24 ,  H01J37/02 ,  H01J37/22 ,  H01J37/26 ,  H01J37/29

    CPC classification number: H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

    Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate (124) having a through hole (124a) at the center above the sample (200) and the dust collecting electrode (122).

    Abstract translation: 提供一种电光检查装置，其能够尽可能地防止灰尘或颗粒附着到样品表面。 将其上放置有样品（200）的载物台（100）设置在能够抽真空的真空室（112）的内部，并且设置集尘电极（122）以包围样品（200）的周围， 。 集尘电极（122）施加与施加到样品（200）的电压相同极性的电压和与电压的绝对值相同或更大的绝对值。 因此，由于灰尘或颗粒例如颗粒附着在集尘电极122上，所以可以降低灰尘或颗粒对样品表面的粘附。 代替使用集尘电极，可以在包含载物台的真空室的壁上形成凹部，或者在壁上配置具有施加了预定电压的网状结构的金属板。 此外，通过在样品（200）上方的中心和集尘电极（122）设置具有通孔（124a）的间隙控制板（124），可以进一步减少灰尘或颗粒的附着。

    Adjustment method and electron beam device
    5.
    发明授权
    Adjustment method and electron beam device 有权

    公开(公告)号：US11217421B2

    公开(公告)日：2022-01-04

    申请号：US16879151

    申请日：2020-05-20

    Applicant: EBARA CORPORATION

    Inventor： Takehide Hayashi ,  Ryo Tajima ,  Tatsuya Kohama ,  Kenji Watanabe ,  Tsutomu Karimata

    IPC: H01J37/147 ,  H01J37/244 ,  H01J37/32 ,  H01J37/14

    Abstract: An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.

    Inspection apparatus
    7.
    发明授权
    Inspection apparatus 有权
    检验仪器

    公开(公告)号：US09368322B2

    公开(公告)日：2016-06-14

    申请号：US14677086

    申请日：2015-04-02

    Applicant: EBARA CORPORATION

    Inventor： Takehide Hayashi ,  Masahiro Hatakeyama ,  Shinji Yamaguchi ,  Masato Naka

    IPC: H01J37/26 ,  H01J37/22 ,  H01J37/28

    CPC classification number: H01J37/28 ,  H01J37/185 ,  H01J37/222 ,  H01J37/224 ,  H01J2237/2448 ,  H01J2237/2806 ,  H01J2237/2817

    Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.

    Abstract translation: 检查装置包括光束产生装置，主光学系统，二次光学系统和图像处理系统。 光束的照射能量被设定在能够从作为二次带电粒子的检查对象射出的电子束照射的能量区域。 二次光学系统包括用于检测二次带电粒子的相机，其位置沿着光轴方向可调节的数值孔径，以及形成已经通过数字孔径的图像上的次级带电粒子的图像的透镜， 相机。 在图像处理系统中，在数值孔径的位置位于物体表面上的孔径成像条件下形成图像以获取图像。

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