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公开(公告)号:US20220384663A1
公开(公告)日:2022-12-01
申请号:US17882148
申请日:2022-08-05
Applicant: FLOSFIA INC.
Inventor: Yusuke MATSUBARA , Osamu IMAFUJI , Hiroyuki ANDO , Hideki TAKEHARA , Takashi SHINOHE , Mitsuru OKIGAWA
IPC: H01L29/872 , H01L29/24
Abstract: Provided is a semiconductor element including: a multilayer structure including: a conductive substrate; and an oxide semiconductor film arranged directly on the conductive substrate or over the conductive substrate via a different layer, the oxide semiconductor film including an oxide, as a major component, having a corundum structure, the conductive substrate having a larger area than the oxide semiconductor film.
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公开(公告)号:US20240363695A1
公开(公告)日:2024-10-31
申请号:US18771277
申请日:2024-07-12
Applicant: Flosfia Inc.
Inventor: Takashi SHINOHE , Mitsuru OKIGAWA , Koji AMAZUTSUMI , Yasushi HIGUCHI , Tokiyoshi MATSUDA
IPC: H01L29/24 , H01L29/739 , H01L29/778 , H01L29/868 , H01L29/872
CPC classification number: H01L29/24 , H01L29/7395 , H01L29/7786 , H01L29/868 , H01L29/872
Abstract: Provided is a semiconductor device including at least: an n type oxide semiconductor layer; a first p type oxide semiconductor layer that forms a main junction with the n type oxide semiconductor layer, and a hole supply layer, wherein the hole supply layer includes a second p type oxide semiconductor layer that is different from the first p type oxide semiconductor layer.
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公开(公告)号:US20220393037A1
公开(公告)日:2022-12-08
申请号:US17834129
申请日:2022-06-07
Applicant: FLOSFIA INC.
Inventor: Mitsuru OKIGAWA , Fujio OKUI , Yasushi HIGUCHI , Koji AMAZUTSUMI , Hidetaka SHIBATA , Yuji KATO , Atsushi TERAI
IPC: H01L29/872 , H01L29/24
Abstract: Provided is a semiconductor device in which a leakage current is reduced, the semiconductor device which is particularly useful for power devices. A semiconductor device including at least: an n+-type semiconductor layer, which contains a crystalline oxide semiconductor as a major component; an n−-type semiconductor layer that is placed on the n+-type semiconductor layer, the n−-type semiconductor layer containing a crystalline oxide semiconductor as a major component; a high-resistance layer with at least a part thereof being embedded in the n−-type semiconductor layer, a depth d (μm) of the part embedded in the n−-type semiconductor layer satisfying d≥1.4; and a Schottky electrode that forms a Schottky junction with the n−-type semiconductor layer, the Schottky electrode having an edge located on the high-resistance layer.
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公开(公告)号:US20220246733A1
公开(公告)日:2022-08-04
申请号:US17613393
申请日:2020-05-22
Applicant: FLOSFIA INC.
Inventor: Mitsuru OKIGAWA , Yasushi HIGUCHI , Yusuke MATSUBARA
IPC: H01L29/40 , H01L29/24 , H01L29/872
Abstract: An object of the disclosure is to provide a semiconductor device with low-loss and suppressed leakage current, which is particularly useful for power devices. A semiconductor device including a semiconductor layer, a dielectric film provided on the semiconductor layer and having an opening and provided over a distance of at least 0.25 μm from the opening, and an electrode layer provided over a part or all of the dielectric film from the inside of the opening, wherein the dielectric film has a thickness of less than 50 nm from the opening to a distance of 0.25 μm, and has relative permittivity of 5 or less.
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公开(公告)号:US20220223737A1
公开(公告)日:2022-07-14
申请号:US17613346
申请日:2020-05-22
Applicant: FLOSFIA INC.
Inventor: Mitsuru OKIGAWA
IPC: H01L29/786 , H01L29/47 , H01L29/872
Abstract: An object of the disclosure is to provide a semiconductor device with low-loss and suppressed leakage current, which is particularly useful for power devices. A semiconductor device including a semiconductor layer including an oxide semiconductor having a corundum structure as a main component, and a Schottky electrode including a first electrode layer and a second electrode layer having a higher conductivity than the first electrode layer, wherein an outer edge portion of the second electrode layer is electrically connected to the semiconductor layer at an electrical connection region through the first electrode layer, and an outer edge portion of the first electrode layer is located outside an outer edge portion of the electrical connection region.
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公开(公告)号:US20220158000A1
公开(公告)日:2022-05-19
申请号:US17575857
申请日:2022-01-14
Applicant: FLOSFIA INC.
Inventor: Mitsuru OKIGAWA , Yasushi HIGUCHI , Yusuke MATSUBARA , Osamu IMAFUJI , Takashi SHINOHE
IPC: H01L29/872 , H01L29/24 , H01L29/04 , H01L29/47 , H01L29/417
Abstract: Provided is a semiconductor device in which crystal defects due to stress concentration in a semiconductor layer caused by an insulator film are prevented, the semiconductor device that is particularly useful for power devices. A semiconductor device including at least: a semiconductor layer; a Schottky electrode; and an insulator layer provided between a part of the semiconductor layer and the Schottky electrode, wherein the semiconductor layer contains a crystalline oxide semiconductor, and wherein the insulator layer has a taper angle of 10° or less.
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公开(公告)号:US20210242363A1
公开(公告)日:2021-08-05
申请号:US17163826
申请日:2021-02-01
Applicant: FLOSFIA INC.
Inventor: Mitsuru OKIGAWA , Manabu KIGUCHI , Koji AMAZUTSUMI
IPC: H01L31/173 , H01L31/032 , H01L31/113
Abstract: A semiconductor element and/or semiconductor device having enhanced semiconductor characteristics useful as power devices are provided. A semiconductor element, including: a first electrode; a second electrode; an n−-type semiconductor layer; and a low electrically conductive layer, the low electrically conductive layer that is arranged between the first electrode and the n−-type semiconductor layer, a first barrier height of the first electrode is larger than a second barrier height of the second electrode, a first electrical resistivity of the low electrically conductive layer is equal to or more than 1000 times as large as a second electrical resistivity of the n−-type semiconductor layer, and the semiconductor element that is configured to be able to irradiate light from an outside to at least a part of the low electrically conductive layer.
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公开(公告)号:US20250133757A1
公开(公告)日:2025-04-24
申请号:US19005007
申请日:2024-12-30
Applicant: FLOSFIA INC.
Inventor: Yusuke MATSUBARA , Mitsuru OKIGAWA , Hiroyuki ANDO , Takashi SHINOHE
Abstract: Provided a semiconductor device including: a semiconductor layer with an extended depletion layer; and an electrode disposed on the semiconductor layer directly or via another layer, the semiconductor layer including a first region containing, as a major component, a crystalline oxide semiconductor containing gallium, and a second region containing, as a major component, an oxide containing gallium, the second region including a linear crystal defect region in a cross section perpendicular to an upper surface of the semiconductor layer.
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公开(公告)号:US20220393015A1
公开(公告)日:2022-12-08
申请号:US17834089
申请日:2022-06-07
Applicant: FLOSFIA INC.
Inventor: Mitsuru OKIGAWA , Fujio OKUI , Yasushi HIGUCHI , Koji AMAZUTSUMI , Hidetaka SHIBATA , Yuji KATO , Atsushi TERAI
Abstract: Provided is a semiconductor device in which a leakage current is reduced, the semiconductor device which is particularly useful for power devices. A semiconductor device including at least: an n+-type semiconductor layer, which contains a crystalline oxide semiconductor as a major component; an n−-type semiconductor layer that is placed on the n+-type semiconductor layer, the n−-type semiconductor layer containing a crystalline oxide semiconductor as a major component; a high-resistance layer with at least a part thereof being embedded in the n−-type semiconductor layer, the high-resistance layer having a bottom surface located at a distance of less than 1.5 μm from an upper surface of the n+-type semiconductor layer; and a Schottky electrode that forms a Schottky junction with the n−-type semiconductor layer, the Schottky electrode having an edge located on the high-resistance layer.
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公开(公告)号:US20220376056A1
公开(公告)日:2022-11-24
申请号:US17882193
申请日:2022-08-05
Applicant: FLOSFIA INC.
Inventor: Yusuke MATSUBARA , Osamu IMAFUJI , Hiroyuki ANDO , Hideki TAKEHARA , Takashi SHINOHE , Mitsuru OKIGAWA
IPC: H01L29/24 , H01L29/872 , H01L29/47 , H01L29/739 , H01L29/786 , H01L23/13
Abstract: Provided is a semiconductor element including: a multilayer structure including: a conductive substrate; and an oxide semiconductor film arranged directly on the conductive substrate or over the conductive substrate via a different layer, the oxide semiconductor film including an oxide, as a major component, containing gallium, the conductive substrate having a larger area than the oxide semiconductor film.
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