MOLECULAR LIGHT EMITTING DEVICE
    3.
    发明申请
    MOLECULAR LIGHT EMITTING DEVICE 审中-公开
    分子发光装置

    公开(公告)号:WO2004030043A2

    公开(公告)日:2004-04-08

    申请号:PCT/US0330647

    申请日:2003-09-26

    Applicant: IBM

    Abstract: A light emitting device comprises a gate electrode (101), a channel (103) comprising a molecule for electrically stimulated optical emission, wherein the molecule is disposed within an effective range of the gate electrode (101), a source (104) coupled to a first end of the channel injecting electrons into the channel, and a drain (105) coupled to a second end of the channel injecting holes into the channel.

    Abstract translation: 发光装置包括栅电极(101),包含用于电激发光发射的分子的通道(103),其中分子设置在栅电极(101)的有效范围内,源(104)耦合到 所述沟道的第一端将电子注入所述沟道中,以及与所述沟道的第二端连接的漏极(105)将空穴注入所述沟道中。

    SELF-ALIGNED SILICIDE PROCESS AND STRUCTURE FORMED USING IT

    公开(公告)号:JP2002353246A

    公开(公告)日:2002-12-06

    申请号:JP2002110367

    申请日:2002-04-12

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a self-aligned silicide process applicable to contacting silicon, sidewall, source, and drain. SOLUTION: A method (and a structure formed by using this method) to form a metal silicide contact on a non-planar silicon-containing area which limits the silicon consumption at a silicon-containing area includes: forming a blanket metal layer over the silicon-containing area, forming a silicon layer over the metal layer, performing an selective and anisotropical etching of the silicon layer against the metal, forming a metal silicon alloy by reacting the metal and silicon at a first temperature, etching away any unreacted metal layer, forming a metal-Si2 alloy by annealing at a second temperature, and selectively etching away any unreacted silicon layer.

    MICRO-STRUCTURE AND ITS MANUFACTURING METHOD

    公开(公告)号:JP2003266396A

    公开(公告)日:2003-09-24

    申请号:JP2003006130

    申请日:2003-01-14

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing micro-structures, such as micro-electromechanical structures (MEMS) or silicon optical benches. SOLUTION: The method includes using a single mask to pattern a plurality of cavity areas to be etched on a substrate in different etching steps, and then selectively choosing the cavity areas for etching. In a preferred embodiment, the method includes patterning a substrate to identify a plurality of cavity areas to be etched on the substrate and filling at least one of the cavity areas with a distinctive filler material. The filler material is chemically distinctive in the sense that it can be etched selectively with respect to the other filling materials 203, 205, 206, 207. The methods of the invention produce micro- structures with more accurate cavity areas by minimizing overlay error and avoiding the need for lithography over extreme topography. COPYRIGHT: (C)2003,JPO

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