Abstract:
PROBLEM TO BE SOLVED: To obtain a resist composition, having responsiveness to imaging irradiation and enhanced resistance to reactive ion etching by incorporating a radiation sensitive polymer and an organometallic compound of a specified metal. SOLUTION: This resist composition contains a radiation responsive polymer and an organometallic compound of a metal selected from among the group comprising yttrium, aluminum, iron, titanium, zirconium, hafnium and a mixture of these. The organometallic compound is, e.g. yttrium trishexafluoroacetylacetonate or yttrium tris(2,2,6,6-tetramethyl)-3,5-heptanedioate and the amount of the organometallic compound used is about 0.1-25 wt.% of the weight of the radiation sensitive polymer. The organometallic compound may be used in combination with various resist polymers including a chemically amplified resist and a non-chemically amplified resist.
Abstract:
Inventive silsesquioxane polymers are provided, and resist compositions that contain such silsesquioxane polymers are provided in which at least a portion of the silsesquioxane polymer contains fluorinated moieties, and at least a portion of the silisesquioxane polymer contains pendant solubility inhibiting acid-labile moieties that have low activation energy for acid-catalyzed cleaving, and the presence of high optical density moieties are minimized or avoided. The inventive polymer also contains pendant polar moieties that promote alkaline solubility of the resist in aqueous alkaline solutions. The inventive polymers are particularly useful in positive resist compositions. The invention encompasses methods of using such resist compositions in forming a patterned structure on a substrate, and particularly multilayer (e.g. bilayer) photolithographic methods, which methods are capable of producing high resolution images at wavelengths such as 193nm and 157nm.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation and useful as a chemically amplified resist excellent in sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin typified by a copolymer of 2-methyl-2-adamantyl methacrylate, 3-hydroxy-1- adamantyl methacrylate and a methacrylic ester of formula (1), (B) a radiation- sensitive acid generator typified by triphenylsulfonium nonafluoro-n- butanesulfonate or 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium perfluoro-n- octanesulfonate and (C) a solvent. Preferably the solvent (C) includes at least one selected from the group comprising propylene glycol monomethyl ether acetate, 2-heptanone and cyclohexanone. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a composition usable as resist, sensitive to image rendering irradiation, and enhanced in its capability to resist reactive ion etching. SOLUTION: A composition which resists reactive ion etching includes polymerizable organometallic monomer acids or ester polymers. Specifically described, it is a polymer generated to include at least one monomer from the group of organic metal acrylates, organic metal methacrylates, organometallic styrenes, and their mixtures. In this composition, metals are selected from yttrium, aluminum, iron, titanium, zirconium, hafnium, and their mixtures.
Abstract:
PROBLEM TO BE SOLVED: To provide silsesquioxane polymers and photoresist compositions that contain such silsesquioxane polymers. SOLUTION: At least a portion of the silsesquioxane polymer contains fluorinated moieties, and at least a portion of the silsesquioxane polymer contains pendant solubility inhibiting cyclic ketal acid-labile moieties that have low activation energy for acid-catalyzed cleaving. The inventive polymer also contains pendant polar moieties that promote alkaline solubility of the resist in aqueous alkaline solutions. The inventive polymers are particularly useful in positive photoresist compositions. The invention encompasses methods of using such photoresist compositions in forming a patterned structure on a substrate, and particularly multilayer (e.g., bilayer) photolithographic methods, which methods are capable of producing high resolution images at wavelengths such as 193 nm and 157 nm. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition having improved dry etching resistance. SOLUTION: This composition comprising a polymer having at least one kind of silicon, germanium and tin, and a protective group grafted on the skeleton of the polymer is useful as a resist, has a sensitivity to the radiation for forming an image, and exhibits an enhanced resistance to reactive ion etching.
Abstract:
2090039 9205474 PCTABS00011 A protective material for use as an overcoating film for acid catalyzed resist compositions comprising a polymeric film forming compound, the films of which are impermeable to vapors of organic and inorganic bases.