中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

296 records (took 0.024 seconds)

    102.
    发明专利
    未知

    公开(公告)号：DE102008051465A1

    公开(公告)日：2009-05-20

    申请号：DE102008051465

    申请日：2008-10-13

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： RIEDL EDMUND ,  MAHLER JOACHIM ,  LODERMEYER JOHANNES ,  VAUPEL MATHIAS ,  JORDAN STEFFEN

    IPC: H01L23/50 ,  H01L21/50 ,  H01L23/29

    Abstract: A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.

    104.
    发明专利
    未知

    公开(公告)号：DE102006056363A1

    公开(公告)日：2008-06-05

    申请号：DE102006056363

    申请日：2006-11-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： BAUER MICHAEL ,  KESSLER ANGELA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

    IPC: H01L23/48 ,  H01L25/04

    Abstract: A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

    108.
    发明专利
    未知

    公开(公告)号：DE102005061248B4

    公开(公告)日：2007-09-20

    申请号：DE102005061248

    申请日：2005-12-20

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： MAHLER JOACHIM ,  WOMBACHER RALF ,  LACHMANN DIETER ,  BETZ BERND ,  PAULUS STEFAN ,  RIEDL EDMUND

    IPC: H01L23/16 ,  C09D5/25 ,  C23C16/453 ,  H01L21/50 ,  H01L23/08

    Abstract: A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.

    109.
    发明专利
    未知

    公开(公告)号：DE102005058654A1

    公开(公告)日：2007-06-14

    申请号：DE102005058654

    申请日：2005-12-07

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： HOSSEINI KHALIL ,  MAHLER JOACHIM ,  RIEDL EDMUND ,  GALESIC IVAN ,  ROESL KONRAD

    IPC: H01L21/60

    Abstract: A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear sides, respectively. Subsequently, the components to be joined one on the other are introduced into a reducing atmosphere. The components are aligned and a compressive pressure is exerted on the aligned components. While heating up the components to be joined in the reducing atmosphere to a diffusion joining temperature, isothermal solidification takes place, the diffusion joining temperature lying below the melting temperature of the forming diffusion joint of the joined material.

Patent Agency Ranking