公开(公告)号：WO2011118415A1

公开(公告)日：2011-09-29

申请号：PCT/JP2011/055738

申请日：2011-03-11

Applicant: 株式会社大真空 ,  前田 佳樹 ,  草井 強

Inventor： 前田　佳樹 ,  草井　強

IPC: H01L23/04 ,  H03H9/02

CPC classification number: H03H9/1021 ,  H01L23/053 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16195 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/10068 ,  Y02P70/613 ,  H01L2924/00

Abstract: 電子部品用パッケージのベースは、電子部品素子を保持し、前記ベースの底面は、平面視矩形とされる。前記ベースの底面には、外部の回路基板と導電性接合材を用いて接合する一対の矩形状の端子電極が形成されている。前記一対の端子電極は、互いに対称形状で構成される。前記各端子電極の長辺は、前記底面の長辺の端部に近接あるいは接して形成される。また、前記各端子電極の長辺と前記底面の長辺とが並列に配置され、前記各端子電極の長辺の寸法は、前記底面の長辺の半分を超える寸法とされる。

Abstract translation: 公开了一种保持电子部件的电子部件包装基座，所述基座在俯视图中具有矩形形状。 在基座的下侧形成有使用导电接合材料接合到外部电路板的一对矩形端子电极。 一对端子电极被定位成相对于彼此对称。 每个端子电极的长边形成为与基底的下侧的长边的端部接近或接触。 此外，每个端子电极的长边和基底的下侧的长边彼此平行地设置，并且每个端子电极的长边的长度大于下侧的长边的长度的一半 的基地。

公开(公告)号：WO2009029226A1

公开(公告)日：2009-03-05

申请号：PCT/US2008/010017

申请日：2008-08-22

Applicant: CTS CORPORATION

Inventor： MCCRACKEN, Jeffrey

IPC: H03L1/04 ,  H03L1/02 ,  H03B5/04

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：WO2009025320A1

公开(公告)日：2009-02-26

申请号：PCT/JP2008/064914

申请日：2008-08-21

Applicant: 株式会社大真空 ,  飯塚 実 ,  岸本 光市 ,  澁谷 浩三 ,  中西 健太郎

Inventor： 飯塚 実 ,  岸本 光市 ,  澁谷 浩三 ,  中西 健太郎

IPC: H01L23/04 ,  H01L23/12 ,  H03H9/02

CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: 　電子部品用パッケージは平面矩形状のベースと金属蓋とを有し、ベース底面の端子電極と回路基板とが導電性接合材により接合されている。この電子部品用パッケージでは、ベースの底面の一角位置に偏って２つ以上の端子電極が並列に形成された第１の端子電極群が形成され、一角位置の第１の対角位置のみに偏って１つの第２の端子電極、２つ以上の端子電極が並列に形成された第２の端子電極群が形成されている。また、一角位置からベースの短辺方向に対向する他角位置と、他角位置の第２の対角位置とには、ベースの短辺に沿って端子電極が形成されない無電極領域が備えられ、少なくとも１つの端子電極が金属蓋と接続されたグランド端子電極である。

Abstract translation: 提供一种电子部件包装，其包括基部和具有矩形顶部平面形状的金属盖，并且底部底面的端子电极和电路基板通过导电性接合材料接合。 在该电子部件封装中，形成有平行形成有两个以上的端子电极的第一端子电极组，形成在底部的底面上的一个偏移角位置，具有一个第二端子电极和两个以上的第二端子电极组 平行地形成的端子电极仅在一个角度位置的第一对角线位置处偏移。 在接地端子电极中，沿着基座的短边形成有没有端子电极的无电极区域形成在与基座的短边方向相对的基准面的另一个角度位置上，并且在另一个角位置处的第二对角位置 角位置，并且至少一个端子电极与金属盖连接。

公开(公告)号：WO2008063507A2

公开(公告)日：2008-05-29

申请号：PCT/US2007023861

申请日：2007-11-14

Applicant: CTS CORP

Inventor： JACOBSON ROBERT ,  DAS NEVES ELISIO ,  REESER GLEN ,  KNECHT THOMAS

IPC: H03B5/12

CPC classification number: H03B5/1847 ,  H03B2200/0008 ,  H03B2200/0034 ,  H03B2200/004 ,  H05K1/0243 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10734

Abstract: A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

Abstract translation: 压控振荡器（VCO）组件和包含球栅阵列谐振器的模块，作为压控振荡器振荡回路的一部分。 VCO模块优选地包括至少一个振荡器电路，储能电路和输出缓冲级电路，其全部由包括安装到印刷电路板的球栅阵列谐振器的多个互连的电气/电子部件限定。 在另一个实施例中，振荡器组件还包括至少部分由安装到印刷电路板的集成电路限定的锁相环电路。

公开(公告)号：WO2007061658A1

公开(公告)日：2007-05-31

申请号：PCT/US2006/043902

申请日：2006-11-13

Applicant: CTS CORPORATION

Inventor： KNECHT, Thomas, A. ,  JACOBSON, Robert ,  REESER, Glen

IPC: H01P7/04 ,  H03B5/18 ,  H05K1/00 ,  H03L7/06

CPC classification number: H03B5/1805 ,  H03B5/1221 ,  H03B5/1231 ,  H03B5/1243 ,  H03L7/06 ,  H03L7/099 ,  H03L7/16 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10689

Abstract: A synthesizer module/oscillator assembly includes a voltage controlled oscillator with a coaxial resonator. In one embodiment, the module measures 20.3mm x 14.8mm x 3.9mm and the coaxial resonator is positioned on the circuit board of the module between a phase locked loop integrated circuit and a main section of the voltage controlled oscillator. The phase locked loop circuit includes a loop filter and is adapted to receive the frequency signal generated by the voltage controlled oscillator and generate an adjusted frequency signal.

Abstract translation: 合成器模块/振荡器组件包括具有同轴谐振器的压控振荡器。 在一个实施例中，模块测量为20.3mm×14.8mm×3.9mm，并且同轴谐振器位于模块的电路板之间，锁相环集成电路和压控振荡器的主要部分之间。 锁相环电路包括环路滤波器，并且适于接收由压控振荡器产生的频率信号并产生经调整的频率信号。

公开(公告)号：US20230413422A1

公开(公告)日：2023-12-21

申请号：US18337725

申请日：2023-06-20

Applicant: ELECTRONIC DESIGN & DEVELOPMENT, CORP.

Inventor： Sergio E. Cardona, Jr.

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K1/024 ,  H05K3/341 ,  H05K1/0306 ,  H05K2201/015 ,  H05K2201/10068 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2203/041

Abstract: A hermetic glass module for wireless communication. In some embodiments, the module may comprise a plurality of glass layers comprising a first layer having capacitors, inductors, and resonators, a second layer comprising capacitors, inductors, diplexers, and waveguides, a third layer comprising microchips, and capacitors, and a fourth layer comprising a glass cover layer, and antennas disposed within the glass cover layer. The plurality of glass layers may each be separated by a substrate of a plurality of substrates and are connected by a redistribution layer (RDL) of a plurality of RDLs.

公开(公告)号：US20180198407A1

公开(公告)日：2018-07-12

申请号：US15740738

申请日：2015-07-27

Applicant: GUANGDONG DAPU TELECOM TECHNOLOGY CO., LTD.

Inventor： Yifeng WANG ,  Chaosheng LIU

IPC: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/02

CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0306 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10196

Abstract: The disclosure relates to the technical field of quartz crystal oscillators, in particular to a direct temperature measurement oven controlled crystal oscillator. The direct temperature measurement oven controlled crystal oscillator according to the present disclosure does not require additional components for measuring the temperature of the wafer inside the crystal oscillator. Instead, the temperature measurement device is disposed on the surface of the wafer to directly measure the temperature of the wafer itself, In order to achieve the exact temperature of the wafer itself. The oven controlled crystal oscillator according to the present disclosure has a simple in structure and is easy to be manufactured. The temperature of the wafer itself is directly measured to make temperature measurement more accurate.

公开(公告)号：US20170359906A1

公开(公告)日：2017-12-14

申请号：US15614618

申请日：2017-06-06

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： Tomoyuki HOSODA ,  Junichi ARAI

IPC: H05K3/34 ,  H03B5/32 ,  H03H3/02 ,  H03H9/02 ,  H01L23/049

CPC classification number: H05K3/3442 ,  H01L23/049 ,  H03B5/32 ,  H03H3/02 ,  H03H9/02 ,  H03H9/0538 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: An electronic device includes a first board, a second board, and support pillars. The support pillars hold the first board and the second board mutually separated. The first board has a first surface on which an electronic component is mounted. The first board has a second surface that includes depressed portions into which the support pillars extending from the second board are inserted.

公开(公告)号：US20170194552A1

公开(公告)日：2017-07-06

申请号：US15379521

申请日：2016-12-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiharu SUEMORI

IPC: H01L41/053 ,  H01L41/047

CPC classification number: H01L41/0533 ,  H01L23/3121 ,  H01L23/564 ,  H01L25/16 ,  H01L41/0472 ,  H01L41/0475 ,  H01L41/0477 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H03H9/1085 ,  H05K3/281 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10068 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1178 ,  H05K2203/1311 ,  H05K2203/1316 ,  H05K2203/1322 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/014

Abstract: An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

公开(公告)号：US09219218B2

公开(公告)日：2015-12-22

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki Ishigami ,  Hidefumi Nakamura ,  Yukihiko Shiohara ,  Taku Kawasaki ,  Fumiaki Akahane

IPC: H05K1/09 ,  H05K1/03 ,  H01L41/047 ,  H01L41/053 ,  H01L41/333 ,  H01L41/29 ,  B22F5/12 ,  B22F3/105

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。