公开(公告)号：US5666721A

公开(公告)日：1997-09-16

申请号：US373785

申请日：1995-01-17

Applicant: Shoji Sakemi

Inventor： Shoji Sakemi

IPC: H01R12/72 ,  H01R43/20 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H01R9/00

CPC classification number: H01R43/205 ,  H05K1/117 ,  H05K3/3405 ,  H01R12/725 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2203/0545 ,  H05K2203/167 ,  H05K3/305 ,  H05K3/3426 ,  H05K3/3484 ,  Y10T29/49149

Abstract: A lead 20 protrudes from a main body 19a of a connector 18. A connector electrode 13 extends along a surface 10a of a printed circuit board 10. A solder paste 26, applied onto the connector electrode 13, is offset a predetermined distance inward from the edge of the printed circuit board 10. The lead 20 is shifted along the surface of connector electrode 13 inwardly from the edge of the printed circuit board 10 until a distal end 20a of the lead 20 is brought into contact with the solder paste 26. Then, the solder paste 26 is melted under the condition where the distal end 20a is brought into contact with the solder paste 26, thereby soldering the connector 18 on the printed circuit board 10.

Abstract translation: 引线20从连接器18的主体19a突出。连接器电极13沿着印刷电路板10的表面10a延伸。施加到连接器电极13上的焊膏26从内部偏离预定距离 引线20从连接器电极13的表面向内移动，从印刷电路板10的边缘向内移动，直到导线20的远端20a与焊膏26接触。然后， 焊膏26在远端20a与焊膏26接触的状态下熔化，从而将连接器18焊接在印刷电路板10上。

公开(公告)号：US5659953A

公开(公告)日：1997-08-26

申请号：US464384

申请日：1995-06-05

Applicant: Stanford W. Crane, Jr. ,  Maria M. Portuondo

Inventor： Stanford W. Crane, Jr. ,  Maria M. Portuondo

IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H01R9/00 ,  H05K3/00

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H05K1/112 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4623 ,  H01L2924/0002 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  H05K3/321 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract translation: 一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面 以及在所述多层基板的内表面上的所述阱内形成的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。 另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从所述多层的外表面延伸 在多层基板的内表面上形成有在多层基板的内表面上的导电部件， 并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。

公开(公告)号：US5543586A

公开(公告)日：1996-08-06

申请号：US208519

申请日：1994-03-11

Applicant: Stanford W. Crane, Jr. ,  Maria M. Portuondo

Inventor： Stanford W. Crane, Jr. ,  Maria M. Portuondo

IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H05K1/02

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H05K1/112 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4623 ,  H01L2924/0002 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  H05K3/321 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract translation: 一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面 以及形成在多层基板的内表面上的阱内的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。 另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从多层的外表面延伸 在多层基板的内表面上形成有在多层基板的内表面上的导电部件， 并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。

公开(公告)号：US5281152A

公开(公告)日：1994-01-25

申请号：US914870

申请日：1992-07-15

Applicant: Hisafumi Takahashi ,  Naoki Sugita

Inventor： Hisafumi Takahashi ,  Naoki Sugita

IPC: H05K3/34 ,  H01R9/09

CPC classification number: H05K3/3426 ,  H01R12/716 ,  H05K2201/09709 ,  H05K2201/10772 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A surface-mounted electronic connector in which board connecting end portions of contacts of the connector extend in mutually parallel, closely spaced apart, coplanar relation and are maintained spaced apart above the board by feet of equal height which depend from tips of respective end portions. The height of each foot is not less than the sum the above-board height of a connection portion of a conductive layer of the board and the height of a reflow solder layer or pad thereon.

Abstract translation: 一种表面安装的电子连接器，其中连接连接端子的触头端部的板以相互平行的，相互间隔开的共面关系延伸，并且在板的上方保持间隔开，这些脚相等于相应端部的尖端。 每个脚的高度不小于板的导电层的连接部分的上板高度和其上的回流焊料层或焊盘的高度之和。

公开(公告)号：US5241134A

公开(公告)日：1993-08-31

申请号：US908826

申请日：1992-07-01

Applicant: Clarence S. Yoo

Inventor： Clarence S. Yoo

IPC: H01L23/495 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R43/0235 ,  H01L23/49541 ,  H05K3/3426 ,  H05K3/3442 ,  H05K3/3478 ,  H01L2924/0002 ,  H05K2201/0373 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0113 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K3/3489 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder relief terminals: solder relief holes through the terminal, notches, grooves or ridges on the surface of the terminal, or bending of the terminal. In a second embodiment, this modification entails predeposit of a predetermined and controlled amount of solid solder and flux on the terminal.

Abstract translation: 改进了用于在引线和键合部位之间形成焊料接合的现有技术的端子，以提高焊料接合的可靠性。 在一个实施例中，该修改涉及消除焊接端子：通过端子的焊接浮雕孔，端子表面上的凹口，凹槽或脊，或端子的弯曲。 在第二实施例中，该修改需要在端子上预定和控制量的固体焊料和焊剂。

公开(公告)号：US4953173A

公开(公告)日：1990-08-28

申请号：US228107

申请日：1988-08-04

Applicant: Takao Fujitsu

Inventor： Takao Fujitsu

IPC: H01L23/14 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H05K1/05 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K3/363 ,  H01L23/142 ,  H01L23/49534 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/056 ,  H05K1/141 ,  H05K2201/091 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10772 ,  H05K2203/302 ,  H05K3/0061

Abstract: A semiconductor device comprises an inverted-tray-shaped support frame having a concave inner surface, a semiconductor element supported by the support frame at the center of its inner surface, and a plurality of leads which are formed on the inner surface of the support frame over an insulative layer interposed therebetween, and which extend from the center of the support frame outward to the periphery hereof and are electrically connected at their inner root ends to respective electrodes of the semiconductor element. The support frame reinforces and preserves the mechanical strength of the leads, which can therefore be spaced more closely and accurately.

Abstract translation: 半导体器件包括具有凹内表面的倒托盘状支撑框架，在其内表面的中心由支撑框架支撑的半导体元件和形成在支撑框架的内表面上的多个引线 在绝缘层之间插入，并且从支撑框架的中心向外延伸到其周边，并且在其内根部处电连接到半导体元件的相应电极。 支撑框架加强并保持引线的机械强度，因此可以更紧密和准确地间隔。

公开(公告)号：US4777564A

公开(公告)日：1988-10-11

申请号：US122606

申请日：1987-11-17

Applicant: Dennis J. Derfiny ,  Joseph D. Ceccoli ,  Emery E. Baxter

Inventor： Dennis J. Derfiny ,  Joseph D. Ceccoli ,  Emery E. Baxter

IPC: H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01R9/00

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H01R12/57 ,  H05K1/0271 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K3/305 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved leadform for use with surface mount components is described. The improved leadform provides a connection to a printed circuit substrate which is highly resistant to stress related failures. The leadform is configured so that the connection utilizes a relatively greater area of the leadform for contact with a solder connection resulting in a more compliant connection. In addition, the present invention provides a preparation for the printed circuit media which allows the substrate media to absorb stresses which occur due to thermal cycling.

Abstract translation: 描述了一种用于表面安装部件的改进的引线形式。 改进的引线形式提供与印刷电路基板的连接，其高度抵抗与应力相关的故障。 引线形状被配置为使得连接利用引线形式的相对较大的区域与焊接连接接触，导致更顺从的连接。 此外，本发明提供了印刷电路介质的准备，其允许基板介质吸收由于热循环而发生的应力。

公开(公告)号：WO2006104003A1

公开(公告)日：2006-10-05

申请号：PCT/JP2006/305790

申请日：2006-03-23

Applicant: 並木精密宝石株式会社 ,  植木 俊雄 ,  青柳 智英 ,  久郷 智之

Inventor： 植木 俊雄 ,  青柳 智英 ,  久郷 智之

IPC: H02K5/00

CPC classification number: H05K3/341 ,  H02K5/04 ,  H02K5/225 ,  H02K7/061 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613

Abstract: 【課題】　半田リフロー処理時において、半田溶融時の金属ホルダー又は金属ハウジングケースの浮き現象を抑え、位置ズレが発生しにくい表面実装型振動モータ及び取付構造を提供する。 【解決手段】　回転軸に偏心分銅を取り付けた振動モータと、前記振動モータ本体の胴部を保持し、載置する回路基板側の固定領域に半田接合する金属ホルダーと、前記振動モータ本体内部の回転駆動機構に通電するための一対の給電端子と、を備える表面実装型振動モータにおいて、振動モータ本体の胴部を保持し、載置する回路基板側の固定領域に当接して半田接合する前記金属ホルダーの底面部に、回転軸の軸方向に延在する隆起した凸状レールを複数本、あるいは半球状の突起を複数個配置したことを特徴とする表面実装型振動モータとする。

Abstract translation: 本发明提供一种表面安装振动电机，其防止金属保持架或金属外壳在焊锡回流焊接时的焊料熔化时的浮动现象，并且不易引起位置偏移，并且安装结构。 具体实施方式本发明提供一种表面安装振动电动机，其特征在于，具有安装在所述旋转轴上的偏心重物的振动电动机，将所述振动电动机主体的躯干保持在固定区域上的金属保持架， 电路板侧，以及用于对振动电动机主体内部的旋转驱动机构进行通电的一对供电端子，其特征在于，在所述旋转轴的轴向或多个半球形的突起上设置有多个突出的凸条， 在保持振动电机主体的躯干的金属保持器的底面上接触并焊接到用于安装在电路板侧的固定区域。

公开(公告)号：WO01022489A2

公开(公告)日：2001-03-29

申请号：PCT/DE2000/003275

申请日：2000-09-20

IPC: H01L23/367 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: The control device (1) is equipped with an electrical component (2) in which heat is generated. Said heat is dissipated over an elongated metal part (10) whose one face (12) is soldered to the component (2). The face (12) oriented toward the component (2) has a shape that increases the size of its surface. The shape is outwardly arched and can be provided with a ribbing.

Abstract translation: 控制单元（1）配备有发热的电气部件（2）。 这通过细长的金属部件（10）去除，该金属部件的一个端面（12）焊接到部件（2）上。 面向端面（12）的部件（2）具有扩大其形状的表面。 它向外弯曲，可以提供波纹。

公开(公告)号：WO99026754A1

公开(公告)日：1999-06-03

申请号：PCT/EP1998/007432

申请日：1998-11-19

IPC: B23K1/00 ,  B23K1/005 ,  G02B6/42 ,  G02B7/00 ,  H05K3/34

CPC classification number: B23K1/0056 ,  B23K2201/40 ,  G02B6/4238 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0373 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/101 ,  Y02P70/613 ,  Y10T29/4913

Abstract: The invention relates to a method for fixing an especially modularly mounted, miniaturised component (2) onto a base plate (1) by means of a soldered joint. One side (4) of the component (2) is coated with a layer (5) of soldering material and the base plate (1) is coated at least partially with a layer of metal (6, 6', 6''). The component (2) is positioned above the base plate (1) with the metal layer and the layer of soldering material (5) facing each other without touching, at a vertical distance from each other. Heat energy is then supplied from the side of the base plate (1) in order to melt the soldering material of the soldering material layer (5) on the side (4) of the component (2) until a drop is formed. The component (2) and the base plate (1) are mutually fixed to each other when the drop of soldering material (5') fills the gap between them.

Abstract translation: 它被描述（2）在底板（1）通过钎焊连接固定的特定组合的模块化，小型化的部件的方法。 成分（2）与焊料材料的层（5）和底板（1）在与金属的（6,6“ 6' ”）的层至少部分地被涂覆的一侧（4）。 组分（2）被布置在底板（1），其中，所述金属层和所述钎焊材料层（5）在非接触，垂直间隔的相对的上方。 然后，热能从基板（1）的一侧为上部件（2）的侧部（4）熔化焊料材料层（5）的钎焊材料，以提供小滴的形成，从而使焊接材料（5“）（成分之间的空间 2）与底板（1），用于相互固定填充。