公开(公告)号：EP2563106A2

公开(公告)日：2013-02-27

申请号：EP12169496.2

申请日：2012-05-25

Applicant: Kabushiki Kaisha Yaskawa Denki

Inventor： Sasahara, Kenta ,  Mizumoto, Junya ,  Sakai, Masafumi

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G2/06 ,  H01G4/38 ,  H01G9/26 ,  H05K3/303 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10454 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K2201/2045

Abstract: Provided is a lead component holder and an electronic device capable of improving vibration resistance performance. A lead component holder (10) includes a plurality of supporting portions (30a, 30b, 30c) each supporting one of lead components (C) at a position distant from a component mounting surface of a substrate (22), and at least one of coupling members (32a, 32b) respectively coupling the adjacent supporting portions (30a, 30b) and (30b, 30c) at a position distant from the component mounting surface. An electronic device (12) includes the substrate (22), the lead component holder (10), and an electronic component mounted to the substrate (22) located below the coupling members (32a, 32b).

Abstract translation: 提供能够提高抗振性能的引线部件保持器和电子器件。 引线部件保持器（10）包括多个支撑部分（30a，30b，30c），每个支撑部分在远离基板（22）的部件安装表面的位置处支撑引线部件（C）中的一个，以及至少一个 分别将相邻的支撑部分（30a，30b）和（30b,30c）联接在远离部件安装表面的位置处的联接构件（32a，32b）。 电子设备（12）包括基板（22），引线部件保持器（10）和安装到位于耦合部件（32a，32b）下方的基板的电子部件。

公开(公告)号：EP2068603A3

公开(公告)日：2009-10-21

申请号：EP08163498.2

申请日：2008-09-02

Applicant: Delphi Technologies, Inc.

Inventor： Kerr, Geoffrey Howard ,  Hogan, Michael P.

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/301 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10583 ,  H05K2201/10969 ,  H05K2201/2045

Abstract: An electronic assembly having a large or massive electronic component mounted to a circuit substrate is stabilized against movement due to shock and/or vibration by an elastic dampening member disposed between the large electronic component and a clamping member that compresses the dampening member between the clamping member and the electronic component and urges opposite end walls of the dampening member against opposite sidewalls of the electronic component to securely grip the electronic component between the opposite end walls of the dampening member. The arrangement is effective for reducing and/or eliminating damage and subsequent failure due to exposure of the electronic assembly to shock and/or vibration.

公开(公告)号：EP1996000A2

公开(公告)日：2008-11-26

申请号：EP08155194.7

申请日：2008-04-25

Applicant: Delphi Technologies, Inc.

Inventor： Sailor, Steven L. ,  Hunkeler, Hugh R. ,  Hinze, Lee R.

IPC: H05K3/00

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus (10/50/80) includes an insulative carrier (12/52/82) for off-board mounting of leaded or surface-mount components (18, 20/58-62/92-96), particularly large temperature-sensitive discrete components such as capacitors. The carrier (12/52/82) has a component-mounting surface that is elevated relative to the circuit board (14), and is positioned with respect to the circuit board (14) such that the circuit board area under the mounting surface of the carrier (12/52/82) is available for the placement of smaller non-temperature-sensitive components. The off-board components (18, 20/58-62/92-96) are mounted on the component-mounting surface of the carrier (12/52/82), and the carrier (82) may include support features (102) for providing additional mechanical support for the components (92-96). Electrical leads (16/56/88) for electrically coupling the elevated components (18, 20/58-62/92-96) to the circuit board (14) may be insert-molded in the carrier (12/52), or may be inserted into plated through-holes (110) in the carrier (82).

Abstract translation: 一种支架安装装置（10/50/80）包括用于板外安装有铅或表面安装部件（18,20 / 58-62 / 92-96）的绝缘载体（12/52/82） 特别是大的温度敏感分立元件，如电容器。 载体（12/52/82）具有相对于电路板（14）升高的部件安装表面，并且相对于电路板（14）定位，使得电路板面积在 载体（12/52/82）可用于放置较小的非温度敏感组件。 车外部件（18,20 / 58-62 / 92-96）安装在载体（12/52/82）的部件安装表面上，并且载体（82）可以包括支撑特征（102） 用于为部件（92-96）提供额外的机械支撑。 用于将升高的部件（18,20 / 58-62 / 92-96）电连接到电路板（14）的电引线（16/56/88）可以嵌入成型在载体（12/52）中，或 可插入载体（82）中的电镀通孔（110）中。

公开(公告)号：EP1983810A2

公开(公告)日：2008-10-22

申请号：EP08153927.2

申请日：2008-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Venkatesan, Sathur ,  Wittmer, Philip W.

IPC: H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

Abstract translation: 一种用于稳定具有主体的电气部件和从主体突出并被接收在限定在基板中的通孔中的电引线的方法，同时避免了在组装电气封装期间分配热熔粘合剂相关的缺点，包括提供 具有用于接收引线电气部件的引线的通孔的电路基板，提供具有主体的电气部件和从主体延伸的引线，将预成型的热熔粘合剂定位在电路基板上或电气部件上， 电子元件，使得引线延伸到通孔中，使得预成型的热熔性粘合剂位于电气部件的主体和基板之间并填充电气部件的主体之间的间隙，并且激活和固化热熔粘合剂， 熔融粘合剂以将电组件的主体牢固地粘附到基底上。

公开(公告)号：EP1338182B1

公开(公告)日：2007-06-27

申请号：EP01982246.9

申请日：2001-09-05

Applicant: EPCOS AG

Inventor： BOY, Jürgen ,  RUND, Klaus ,  BOTHE, Frank

IPC: H05K1/18

CPC classification number: H05K3/303 ,  H01L2924/0002 ,  H01T4/06 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an electrical component comprising a base body (3) which has two insulating bodies (1, 2) with curved outer surfaces, and an outer electrode (4, 5) is arranged respectively on the end surfaces thereof. A central electrode (7) is disposed in a central section (6) of the base body along the lateral surface thereof, whereby the central electrode (7) comprises a flat mounting surface (8) on the outer side of the component. The invention also relates to an arrangement for said component and to a method for the production thereof. The component can be effectively prevented from rolling away from the top surface of a circuit board (10) by means of the flat mounting surface (8) on the central electrode (7). A retaining surface (9) enables the component to be held in place by suction with the aid of a suction nozzle (11).

公开(公告)号：EP1513179B1

公开(公告)日：2006-12-20

申请号：EP03023293.8

申请日：2003-10-15

Applicant: KYOSHIN KOGYO CO., LTD

Inventor： Kitajima, Yoshikazu, Kawagoe Plant ,  Nishimura, Iwao, Goshogawara Plant ,  Ito, Koji, Goshogawara Plant

IPC: H01H85/20

CPC classification number: H01R43/205 ,  H01H85/202 ,  H01H2085/2085 ,  H01R4/4809 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/10181 ,  H05K2201/1031 ,  H05K2201/10583 ,  H05K2201/1084 ,  Y02P70/611

公开(公告)号：EP1338182A1

公开(公告)日：2003-08-27

申请号：EP01982246.9

申请日：2001-09-05

Applicant: EPCOS AG

Inventor： BOY, Jürgen ,  RUND, Klaus ,  BOTHE, Frank

IPC: H05K1/18

CPC classification number: H05K3/303 ,  H01L2924/0002 ,  H01T4/06 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an electrical component comprising a base body (3) which has two insulating bodies (1, 2) with curved outer surfaces, and an outer electrode (4, 5) is arranged respectively on the end surfaces thereof. A central electrode (7) is disposed in a central section (6) of the base body along the lateral surface thereof, whereby the central electrode (7) comprises a flat mounting surface (8) on the outer side of the component. The invention also relates to an arrangement for said component and to a method for the production thereof. The component can be effectively prevented from rolling away from the top surface of a circuit board (10) by means of the flat mounting surface (8) on the central electrode (7). A retaining surface (9) enables the component to be held in place by suction with the aid of a suction nozzle (11).

公开(公告)号：EP1008156A1

公开(公告)日：2000-06-14

申请号：EP98904601.6

申请日：1998-01-21

Applicant: PULSE ENGINEERING, INC.

Inventor： ABRAMOV, Igor

IPC: H01F27/29 ,  H01F17/00

CPC classification number: H01F27/292 ,  H01F17/0033 ,  H05K1/0233 ,  H05K3/3442 ,  H05K2201/0792 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10583 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4902

Abstract: A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14 and 16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).

公开(公告)号：EP0836372A3

公开(公告)日：1998-07-01

申请号：EP97117153.3

申请日：1997-10-02

Applicant: Hagn, Erwin

Inventor： Hagn, Erwin

IPC: H05K13/04

CPC classification number: H01G2/065 ,  H01L2924/0002 ,  H05K3/303 ,  H05K13/0417 ,  H05K13/046 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2924/00

Abstract: Offenbart wird ein Verfahren und eine Vorrichtung zur Herstellung einer Ansaugfläche 6 auf einem Gegenstand, der vorzugsweise ein für die SMD-Montagetechnik vorgesehenes elektrisches Bauteil ist. Dabei wird die plane Ansaugfläche 6 auf der der Montageseite 5 gegenüberliegenden Oberfläche des Bauteils 1 dadurch ausgebildet, daß auf dem Bauteil 1 eine adhäsionsfähige Masse 21 aufgebracht und ein darüber angeordnetes Deckband 13 durch einen Stempel 40 derart auf die Masse 21 gedrückt wird, daß sich diese unter Ausbildung einer planen Fläche verformt. Nach dem Aushärten der adhäsionsfähigen Masse 21 wird das Deckband 13 von der Masse 21 abgetrennt und es entsteht ein Bauteil 1 mit einer planen Ansaugfläche 6 welche zum Beispiel von einer Saugpipette zuverlässig und problemlos angesaugt, dadurch aufgenommen und transportiert werden kann. Die adhäsionsfähige Masse 21 kann hierbei aus einem zu verflüssigenden oder verflüchtigenden Material wie beispielsweise Wachs, Kollophonium oder Kunststoff bestehen.

公开(公告)号：EP0797379A2

公开(公告)日：1997-09-24

申请号：EP97101240.6

申请日：1997-01-28

Applicant: KRONE Aktiengesellschaft

Inventor： Busse, Ralf-Dieter, Dipl.-Ing. ,  Storbeck, Carsten, Dipl.-Ing. ,  Lade, Thomas, Dipl.-Ing.

IPC: H05K1/18 ,  H01T4/06 ,  H05K5/02

CPC classification number: H05K3/3442 ,  H05K1/183 ,  H05K5/0091 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09427 ,  H05K2201/10583 ,  H05K2201/10727 ,  Y02P70/613

Abstract: Die Erfindung betrifft eine Leiterplatte (1) und ein Verfahren zum lagegenauen Bestücken derselben mit elektronischen Bauelementen auf der Oberfläche (12) der Leiterplatte (1), wobei die elektronischen Bauelemente mit einer Reflow-Löttechnik elektrisch leitend und stabil mit der Leiterplatte (1) verbunden werden sollen. Hierfür wird eine Leiterplatte (1) verwendet, die auf der Oberfläche (12) der Außenkontur der jeweiligen Bauelemente zumindest teilweise angepaßte Bereiche (2,3) zur Aufnahme der elektronischen Bauelemente aufweist. Die Bereiche, die als Schlitzkonturen (3) oder eingearbeitete Nuten (2) ausgebildet sind, sichern, daß die nach dem Aufbringen von Lötpaste aufgesetzten elektronischen Bauelemente vor der eigentlichen Verlötung in der gewünschten Position gehalten werden.
Zusätzlich läßt sich die bestückte Leiterplatte durch ein Gehäuse, das mit domartig ausgebildeten Ansätzen (14) aus zumindest einem teilweise verformbaren Material besteht, verbinden. Dabei werden die Ansätze die Leiterplatte, diese durchdringend, in dort eingearbeitete Ausnehmungen (14,15 oder 17) eingeführt und form- und/oder kraftschlüssig eine Gehäuse-Leiterplatten-Verbindung durch Verformung der Ansätze (14) erreicht. Außerdem kann ein Überspannungs-Schutzstecker für Anschlußleisten der Fernmeldetechnik mit einem Überspannungsableiter (4) aufgesetzt sein, der die beiden Funktionen "Erdkontakt" und "Fail-Safe-Kontakt" in einem Teil vereinigt und mit geringem Montageaufwand eine Bestückung erreicht werden kann.

Abstract translation: 本发明涉及一种印刷电路板（1）和位置精确安装在印刷电路板（1）的表面（12）上的相同的电子组件的方法，其中（1），其连接有回流焊接技术的电子元件导电和稳定的与所述电路板 是。 为了这个目的，一个印刷电路板（1）被用于其中至少具有各个部件的外轮廓的表面（12）上，用于接收所述电子部件部分地匹配的区域（2,3）。 可有效用作形成以确保焊料的涂布后的贴片粘贴电子元件的槽轮廓（3）或（2）结合的槽的区域之前将在期望的位置的实际焊接保持。 此外，该印刷电路板通过与至少一种部分地可变形材料的圆顶形突起（14）形成的壳体，连接。 的方法是在印刷电路板，介绍了该贯通，在并入其中的凹口（14,15或17）和阳性和/或力配合通过凸耳的变形的壳体对板连接（14）达到。 此外，用于连接的电涌放电器（4）电信的条带的过电压保护插头可被放置，它结合了两个函数“接地触头”，并且在一个部件“故障安全接触”和一个放置可很少安装工作量来实现。