公开(公告)号：WO2011058879A1

公开(公告)日：2011-05-19

申请号：PCT/JP2010/069031

申请日：2010-10-27

Applicant: 日本電気株式会社 ,  中島 嘉樹 ,  山道 新太郎 ,  菊池 克 ,  森 健太郎 ,  村井 秀哉 ,  大島 大輔

Inventor： 中島　嘉樹 ,  山道　新太郎 ,  菊池　克 ,  森　健太郎 ,  村井　秀哉 ,  大島　大輔

IPC: H05K3/46 ,  H01L23/12

CPC classification number: H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/82 ,  H01L2224/2413 ,  H01L2224/24227 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/10674

Abstract: ビア密度、特に機能素子周辺の配線層間のビア密度を向上させることができる機能素子内蔵基板を提供する。 機能素子１と、複数のビア４を有し、前記機能素子を埋設する第１の絶縁材料からなる補強層３と、を含む機能素子内蔵基板であって、　前記機能素子１に近接対向するビアの少なくとも一つが前記機能素子１の側面と対向する側に平側面を有する変形ビア９である機能素子内蔵基板。

Abstract translation: 提供具有内置功能元件的基板，其中可以提高通孔密度，特别是功能元件周围的布线层之间的通孔密度。 具有内置功能元件的基板包括功能元件（1）; 以及具有多个通孔（4）的加强层（3），并且由具有埋入其中的功能元件的第一绝缘材料构成。 具有内置功能元件的基板具有至少一个通孔，在与功能元件（1）相邻的通孔中，至少一个通孔形成为变形的通孔（9），该通孔在侧面侧面具有平坦的侧面 功能元件（1）的侧面。

公开(公告)号：WO2010111379A3

公开(公告)日：2010-12-02

申请号：PCT/US2010028487

申请日：2010-03-24

Applicant: MOLEX INC ,  CASHER PATRICK R ,  REGNIER KENT E ,  LANG HAROLD KEITH

Inventor： CASHER PATRICK R ,  REGNIER KENT E ,  LANG HAROLD KEITH

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0222 ,  H01R13/6587 ,  H05K1/0245 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/10189

Abstract: A connector and circuit board assembly includes terminals in a connector that are mounted to vias in a circuit board. Signal and ground terminals are thus coupled to signal traces and ground planes in the circuit board. Additional pinning vias that are aligned with the ground vias may be provided in a circuit board to help improve electrical performance at the interface between the terminals in the connector and the signal traces in the circuit board. A signal collar may allow pairs of signal traces to be split and routed around two difference sides of a via before rejoining while maintaining close electrical proximity that provides for relatively consistent electrical coupling between the traces in the pair of signal traces.

Abstract translation: 连接器和电路板组件包括安装到电路板中的通孔的连接器中的端子。 因此，信号和接地端子耦合到电路板中的信号迹线和接地层。 可以在电路板中提供与接地通孔对准的附加的钉扎通孔，以帮助改善连接器中的端子与电路板中的信号迹线之间的接口处的电气性能。 信号环可以允许成对的信号迹线在重新连接之前绕通孔的两个不同侧被分开和布线，同时保持紧密的电接近，其提供一对信号迹线中的迹线之间的相对一致的电耦合。

公开(公告)号：WO2007075713A3

公开(公告)日：2008-10-02

申请号：PCT/US2006048471

申请日：2006-12-19

Applicant: MOTOROLA INC ,  DUNN GREGORY J ,  CROSWELL ROBERT T ,  KUMPF GEORGE H ,  SVIGELJ JOHN A

Inventor： DUNN GREGORY J ,  CROSWELL ROBERT T ,  KUMPF GEORGE H ,  SVIGELJ JOHN A

IPC: H05K1/16 ,  H01L29/76

CPC classification number: H01Q15/006 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09609

Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

Abstract translation: 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）电耦合在两个导电板（318）之间的至少一个电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）和（b）嵌入印刷电路板（302）内的夹层电容器中的至少一个。

公开(公告)号：WO2007101800A2

公开(公告)日：2007-09-13

申请号：PCT/EP2007/051801

申请日：2007-02-26

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  SEDLMEIER, Peter ,  ZETTELMEIER, Karl

Inventor： SEDLMEIER, Peter ,  ZETTELMEIER, Karl

CPC classification number: H05K1/0218 ,  H05K1/0272 ,  H05K3/42 ,  H05K9/0041 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09063 ,  H05K2201/09609

Abstract: Bei dieser Anordnung sind die Innenwände der Öffnungen einer Leiterplatte zum Durchfluss von Wärmeaustauschmitteln in die elektromagnetische Schirmung einbezogen.

Abstract translation: 在这种布置中，一个印刷电路板的热交换的流动的开口的内壁包括在电磁屏蔽装置。

公开(公告)号：WO2007091832A1

公开(公告)日：2007-08-16

申请号：PCT/KR2007/000655

申请日：2007-02-07

Applicant: INNOVATECH., LTD ,  LEE, Ki-geon

Inventor： LEE, Ki-geon

IPC: H05K7/20

CPC classification number: H05K1/0206 ,  H05K1/116 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10651

Abstract: A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate, the plurality of the conductive layer regions includes a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. Accordingly, the efficient heat radiation of the circuit board can prevent the component malfunction, the lifespan reduction, the power consumption increase, and the illuminance drop.

Abstract translation: 电路板的电路板和散热系统。 在电路基板中，在绝缘基板的两面分别形成涂布有导体的多个导电层区域，在绝缘基板的两侧的绝缘区域的两侧形成的导电层区域， 多个导电层区域包括穿过绝缘基板并在内壁上涂覆有导体的多个通孔，通孔中的导体导电多个导电层区域的涂覆导体，一个 基于绝缘区域将引线引脚连接到两侧的分离的导电层区域中的一个，另一个引脚与另一个导电层区域连接。 因此，电路板的高效散热可以防止元件故障，寿命降低，功率消耗增加和照度下降。

公开(公告)号：WO01076331A1

公开(公告)日：2001-10-11

申请号：PCT/CH2001/000203

申请日：2001-03-30

IPC: H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/04 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/162 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K1/023 ,  H05K1/0234 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A Power Supply Board (PSB) for being used within an electronic assembly comprises a layer (1) of dielectric material with a first and a second conducting layer on each side, respectively. At least the first conducting layer has a regular pattern of openings (7), which corresponds to vias (9) in the dielectric layer (1). In the openings (7), contact pads (11) are arranged which, by the vias, are electrically connected to the second conducting layer. The first and the second conducting layer are to be kept at Vcc and GND potential, respectively.

Abstract translation: 用于电子组件的电源板（PSB）包括分别在每一侧具有第一和第二导电层的电介质材料层（1）。 至少第一导电层具有开口（7）的规则图案，其对应于电介质层（1）中的通孔（9）。 在开口（7）中，设置接触焊盘（11），其通过通孔与第二导电层电连接。 第一和第二导电层分别保持在Vcc和GND电位。

公开(公告)号：WO1998020715A1

公开(公告)日：1998-05-14

申请号：PCT/US1997018992

申请日：1997-10-22

Applicant: W.L. GORE & ASSOCIATES, INC.

Inventor： W.L. GORE & ASSOCIATES, INC. ,  MEOLA, Carmine, G. ,  SUILMANN, Deanna, M.

IPC: H05K03/46

CPC classification number: H05K3/323 ,  H05K3/4614 ,  H05K3/4626 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/09609 ,  H05K2201/10378

Abstract: A printed circuit board assembly and process for assembling such a board involving interconnecting multi-layer printed circuit or printed wiring boards by simultaneously making eletrical interconnects and filling interstitial void spaces. A plurality of printed circuits boards (102, 104) to be interconnected are provided. Each board has conductive pads (106, 108) which are to be interconnected. The boards (102, 104) are aligned so that the conductive pads (106, 108) to be interconnected are opposite each other. A z-axis conductive member (110) is provided between opposing faces of the printed circuit boards (102, 104). The printed circuit boards (102, 104) are laminated with the z-axis conductive member (110), whereby the conductive pads (106, 108) are interconnected by the z-axis conductive member (110). The z-axis conductive member (110) comprises a planar, open cell, porous material having an x, y and z-axis with a series of electrically isolated, vertically defined cross section areas that extend from one side of the material to another side of the material and are covered with conductive metal, and contains a bonding adhesive in the porous material. Electronic devices may be attached to the printed circuit board assembly.

Abstract translation: 一种用于组装这种板的印刷电路板组件和工艺，其通过同时进行电气互连和填充间隙空隙来进行互连多层印刷电路或印刷线路板。 提供要互连的多个印刷电路板（102,104）。 每个板具有要互连的导电焊盘（106,108）。 板（102,104）对准，使得要互连的导电垫（106,108）彼此相对。 z轴导电构件（110）设置在印刷电路板（102,104）的相对面之间。 印刷电路板（102,104）与z轴导电构件（110）层叠，由此导电垫（106,108）通过z轴导电构件（110）互连。 z轴导电构件（110）包括具有x，y和z轴的平面开孔，多孔材料，其具有一系列电隔离的垂直限定的横截面区域，其从材料的一侧延伸到另一侧 的材料并被导电金属覆盖，并且在多孔材料中包含粘结粘合剂。 电子设备可以附接到印刷电路板组件。

公开(公告)号：WO1997012397A1

公开(公告)日：1997-04-03

申请号：PCT/US1996016023

申请日：1996-09-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： TEXAS INSTRUMENTS INCORPORATED

IPC: H01L23/34

CPC classification number: H01L25/0657 ,  H01L23/4922 ,  H01L23/49827 ,  H01L23/5385 ,  H01L24/01 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3011 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0116 ,  H05K2201/09536 ,  H05K2201/09609 ,  H05K2201/10378

Abstract: An assembly of two or more microelectronic parts, wherein electrical and/or thermal interconnection between the parts is achieved by means of multiple, discrete, conductive nanoscopic fibrils (15) or tubules (15) fixed within the pores of an insulating film (16). Such a film is said to have anisotropic electrical conductivity, i.e., Z-axis conductivity, with little or no conductivity in the other directions.

Abstract translation: 两个或多个微电子部件的组件，其中部件之间的电和/或热互连通过固定在绝缘膜（16）的孔内的多个离散的，导电的纳米级原纤（15）或小管（15）来实现， 。 据说这样的膜具有各向异性导电性，即Z轴导电性，在其它方向上几乎没有或没有导电性。

公开(公告)号：WO1993026146A1

公开(公告)日：1993-12-23

申请号：PCT/CH1993000148

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG ,  SCHMIDT, Walter ,  MARTINELLI, Marco

Inventor： DYCONEX PATENTE AG

IPC: H05K07/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: According to a process for producing a thermal layout, not only massive heat sinks are provided for absorbing heat, but also an optimized number of thermoconductive strips which distribute the heat over the printed circuit board. In the collecting zones are arranged higher capacity sinks into which the heat is transmitted. The thermoconductive strips may be thermoconductors (TL) provided for that purpose and more massive than the conductive strips for the electric connections, or conductive strips for electric connections, the electroconductors (EL), may also be used for heat transfer. An optimum design interconnects the TL'S and EL's into a functional whole, a thermal management network. With a certain technique, which could be called pocket groove technique, "cooling channels" of a type may be created. Such thermoconductors may be included in the electric layout, so that a thermal layout is superimposed on the connection layout (TL/EL network). Heat distribution and transfer may thus be calculated and optimized by a computer in the same way as the electric distribution by the conductive strips, i.e. the known electric layout, which is produced by a computer-assisted process.

公开(公告)号：WO1985001156A1

公开(公告)日：1985-03-14

申请号：PCT/US1984001388

申请日：1984-08-30

Applicant: BURROUGHS CORPORATION

Inventor： BURROUGHS CORPORATION ,  BARROW, Michael

IPC: H01P03/08

CPC classification number: H01P3/081 ,  H01P3/088 ,  H05K1/0237 ,  H05K1/024 ,  H05K1/0289 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/0191 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09609

Abstract: A multilayer printed circuit board (10) for TTL logic components provides an approximate 100 ohm characteristics impedance between external microstrip signal lines (11, 16) and internal ground (13) and voltage (14) planes. The addition of two internal microstrip signal plane lines (12, 15) permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristics.

Abstract translation: 用于TTL逻辑元件的多层印刷电路板（10）在外部微带线信号线（11,16）和内部接地（13）和电压（14）面之间提供近似100欧姆的特性阻抗。 添加两个内部微带线信号平面线（12,15）允许更大的互连能力，并且还可以节省用于部件安装的大部分空间面积，同时仍然保持100欧姆的阻抗特性。