HIGH DATA RATE CONNECTOR SYSTEM
    182.
    发明申请
    HIGH DATA RATE CONNECTOR SYSTEM 审中-公开
    高数据速率连接器系统

    公开(公告)号:WO2010111379A3

    公开(公告)日:2010-12-02

    申请号:PCT/US2010028487

    申请日:2010-03-24

    Abstract: A connector and circuit board assembly includes terminals in a connector that are mounted to vias in a circuit board. Signal and ground terminals are thus coupled to signal traces and ground planes in the circuit board. Additional pinning vias that are aligned with the ground vias may be provided in a circuit board to help improve electrical performance at the interface between the terminals in the connector and the signal traces in the circuit board. A signal collar may allow pairs of signal traces to be split and routed around two difference sides of a via before rejoining while maintaining close electrical proximity that provides for relatively consistent electrical coupling between the traces in the pair of signal traces.

    Abstract translation: 连接器和电路板组件包括安装到电路板中的通孔的连接器中的端子。 因此,信号和接地端子耦合到电路板中的信号迹线和接地层。 可以在电路板中提供与接地通孔对准的附加的钉扎通孔,以帮助改善连接器中的端子与电路板中的信号迹线之间的接口处的电气性能。 信号环可以允许成对的信号迹线在重新连接之前绕通孔的两个不同侧被分开和布线,同时保持紧密的电接近,其提供一对信号迹线中的迹线之间的相对一致的电耦合。

    HIGH IMPEDANCE ELECTROMAGNETIC SURFACE AND METHOD
    183.
    发明申请
    HIGH IMPEDANCE ELECTROMAGNETIC SURFACE AND METHOD 审中-公开
    高阻抗电磁表面和方法

    公开(公告)号:WO2007075713A3

    公开(公告)日:2008-10-02

    申请号:PCT/US2006048471

    申请日:2006-12-19

    Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

    Abstract translation: 高阻抗表面(300)具有带有第一表面(314)和第二表面(316)的印刷电路板(302)和设置在印刷的第二表面(316)上的连续导电板(319) 电路板(302)。 多个导电板(318)设置在印刷电路板(302)的第一表面(314)上,同时还提供多个元件。 每个元件包括(1)至少一个电耦合在至少两个导电板(318)之间并嵌入印刷电路板(302)内的多层电感器(330,331)中的至少一个,和(2 )电耦合在两个导电板(318)之间的至少一个电容器(320)。 电容器(320)包括设置在相邻导电板之间的(a)介电材料(328)和(b)嵌入印刷电路板(302)内的夹层电容器中的至少一个。

    CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD
    185.
    发明申请
    CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD 审中-公开
    电路板电路板和放电加热系统

    公开(公告)号:WO2007091832A1

    公开(公告)日:2007-08-16

    申请号:PCT/KR2007/000655

    申请日:2007-02-07

    Inventor: LEE, Ki-geon

    Abstract: A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate, the plurality of the conductive layer regions includes a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. Accordingly, the efficient heat radiation of the circuit board can prevent the component malfunction, the lifespan reduction, the power consumption increase, and the illuminance drop.

    Abstract translation: 电路板的电路板和散热系统。 在电路基板中,在绝缘基板的两面分别形成涂布有导体的多个导电层区域,在绝缘基板的两侧的绝缘区域的两侧形成的导电层区域, 多个导电层区域包括穿过绝缘基板并在内壁上涂覆有导体的多个通孔,通孔中的导体导电多个导电层区域的涂覆导体,一个 基于绝缘区域将引线引脚连接到两侧的分离的导电层区域中的一个,另一个引脚与另一个导电层区域连接。 因此,电路板的高效散热可以防止元件故障,寿命降低,功率消耗增加和照度下降。

    INTERCONNECTED MULTI-LAYER CIRCUIT BOARDS
    187.
    发明申请
    INTERCONNECTED MULTI-LAYER CIRCUIT BOARDS 审中-公开
    互连多层电路板

    公开(公告)号:WO1998020715A1

    公开(公告)日:1998-05-14

    申请号:PCT/US1997018992

    申请日:1997-10-22

    Abstract: A printed circuit board assembly and process for assembling such a board involving interconnecting multi-layer printed circuit or printed wiring boards by simultaneously making eletrical interconnects and filling interstitial void spaces. A plurality of printed circuits boards (102, 104) to be interconnected are provided. Each board has conductive pads (106, 108) which are to be interconnected. The boards (102, 104) are aligned so that the conductive pads (106, 108) to be interconnected are opposite each other. A z-axis conductive member (110) is provided between opposing faces of the printed circuit boards (102, 104). The printed circuit boards (102, 104) are laminated with the z-axis conductive member (110), whereby the conductive pads (106, 108) are interconnected by the z-axis conductive member (110). The z-axis conductive member (110) comprises a planar, open cell, porous material having an x, y and z-axis with a series of electrically isolated, vertically defined cross section areas that extend from one side of the material to another side of the material and are covered with conductive metal, and contains a bonding adhesive in the porous material. Electronic devices may be attached to the printed circuit board assembly.

    Abstract translation: 一种用于组装这种板的印刷电路板组件和工艺,其通过同时进行电气互连和填充间隙空隙来进行互连多层印刷电路或印刷线路板。 提供要互连的多个印刷电路板(102,104)。 每个板具有要互连的导电焊盘(106,108)。 板(102,104)对准,使得要互连的导电垫(106,108)彼此相对。 z轴导电构件(110)设置在印刷电路板(102,104)的相对面之间。 印刷电路板(102,104)与z轴导电构件(110)层叠,由此导电垫(106,108)通过z轴导电构件(110)互连。 z轴导电构件(110)包括具有x,y和z轴的平面开孔,多孔材料,其具有一系列电隔离的垂直限定的横截面区域,其从材料的一侧延伸到另一侧 的材料并被导电金属覆盖,并且在多孔材料中包含粘结粘合剂。 电子设备可以附接到印刷电路板组件。

    PRINTED CIRCUIT BOARD MAXIMIZING AREAS FOR COMPONENT UTILIZATION
    190.
    发明申请
    PRINTED CIRCUIT BOARD MAXIMIZING AREAS FOR COMPONENT UTILIZATION 审中-公开
    印刷电路板最大限度地利用组件使用领域

    公开(公告)号:WO1985001156A1

    公开(公告)日:1985-03-14

    申请号:PCT/US1984001388

    申请日:1984-08-30

    Abstract: A multilayer printed circuit board (10) for TTL logic components provides an approximate 100 ohm characteristics impedance between external microstrip signal lines (11, 16) and internal ground (13) and voltage (14) planes. The addition of two internal microstrip signal plane lines (12, 15) permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristics.

    Abstract translation: 用于TTL逻辑元件的多层印刷电路板(10)在外部微带线信号线(11,16)和内部接地(13)和电压(14)面之间提供近似100欧姆的特性阻抗。 添加两个内部微带线信号平面线(12,15)允许更大的互连能力,并且还可以节省用于部件安装的大部分空间面积,同时仍然保持100欧姆的阻抗特性。

Patent Agency Ranking