Abstract:
A connector and circuit board assembly includes terminals in a connector that are mounted to vias in a circuit board. Signal and ground terminals are thus coupled to signal traces and ground planes in the circuit board. Additional pinning vias that are aligned with the ground vias may be provided in a circuit board to help improve electrical performance at the interface between the terminals in the connector and the signal traces in the circuit board. A signal collar may allow pairs of signal traces to be split and routed around two difference sides of a via before rejoining while maintaining close electrical proximity that provides for relatively consistent electrical coupling between the traces in the pair of signal traces.
Abstract:
A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, and (b) a mezzanine capacitor embedded within the printed circuit board (302).
Abstract:
Bei dieser Anordnung sind die Innenwände der Öffnungen einer Leiterplatte zum Durchfluss von Wärmeaustauschmitteln in die elektromagnetische Schirmung einbezogen.
Abstract:
A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate, the plurality of the conductive layer regions includes a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. Accordingly, the efficient heat radiation of the circuit board can prevent the component malfunction, the lifespan reduction, the power consumption increase, and the illuminance drop.
Abstract:
A Power Supply Board (PSB) for being used within an electronic assembly comprises a layer (1) of dielectric material with a first and a second conducting layer on each side, respectively. At least the first conducting layer has a regular pattern of openings (7), which corresponds to vias (9) in the dielectric layer (1). In the openings (7), contact pads (11) are arranged which, by the vias, are electrically connected to the second conducting layer. The first and the second conducting layer are to be kept at Vcc and GND potential, respectively.
Abstract:
A printed circuit board assembly and process for assembling such a board involving interconnecting multi-layer printed circuit or printed wiring boards by simultaneously making eletrical interconnects and filling interstitial void spaces. A plurality of printed circuits boards (102, 104) to be interconnected are provided. Each board has conductive pads (106, 108) which are to be interconnected. The boards (102, 104) are aligned so that the conductive pads (106, 108) to be interconnected are opposite each other. A z-axis conductive member (110) is provided between opposing faces of the printed circuit boards (102, 104). The printed circuit boards (102, 104) are laminated with the z-axis conductive member (110), whereby the conductive pads (106, 108) are interconnected by the z-axis conductive member (110). The z-axis conductive member (110) comprises a planar, open cell, porous material having an x, y and z-axis with a series of electrically isolated, vertically defined cross section areas that extend from one side of the material to another side of the material and are covered with conductive metal, and contains a bonding adhesive in the porous material. Electronic devices may be attached to the printed circuit board assembly.
Abstract:
An assembly of two or more microelectronic parts, wherein electrical and/or thermal interconnection between the parts is achieved by means of multiple, discrete, conductive nanoscopic fibrils (15) or tubules (15) fixed within the pores of an insulating film (16). Such a film is said to have anisotropic electrical conductivity, i.e., Z-axis conductivity, with little or no conductivity in the other directions.
Abstract:
According to a process for producing a thermal layout, not only massive heat sinks are provided for absorbing heat, but also an optimized number of thermoconductive strips which distribute the heat over the printed circuit board. In the collecting zones are arranged higher capacity sinks into which the heat is transmitted. The thermoconductive strips may be thermoconductors (TL) provided for that purpose and more massive than the conductive strips for the electric connections, or conductive strips for electric connections, the electroconductors (EL), may also be used for heat transfer. An optimum design interconnects the TL'S and EL's into a functional whole, a thermal management network. With a certain technique, which could be called pocket groove technique, "cooling channels" of a type may be created. Such thermoconductors may be included in the electric layout, so that a thermal layout is superimposed on the connection layout (TL/EL network). Heat distribution and transfer may thus be calculated and optimized by a computer in the same way as the electric distribution by the conductive strips, i.e. the known electric layout, which is produced by a computer-assisted process.
Abstract:
A multilayer printed circuit board (10) for TTL logic components provides an approximate 100 ohm characteristics impedance between external microstrip signal lines (11, 16) and internal ground (13) and voltage (14) planes. The addition of two internal microstrip signal plane lines (12, 15) permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristics.