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公开(公告)号:GB2500851B
公开(公告)日:2015-02-04
申请号:GB201313089
申请日:2012-01-10
Applicant: IBM
Inventor: LIN YU-MING , YAU JENG-BANG
IPC: H01L29/786
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公开(公告)号:GB2515948A
公开(公告)日:2015-01-07
申请号:GB201418568
申请日:2012-01-10
Applicant: IBM
Inventor: LIN YU-MING , YAU JENG-BANG
IPC: H01L29/786
Abstract: A radiation hard substrate comprising a silicon wafer coated with a layer of SiC, CaF2 or fluorinated silicon oxide is provided. A carbon-based material of graphene or carbon nanotubes is formed on the substrate, which serves as the actve material used to fabricate the transistor. Contacts are formed to the portions of the carbon-based material that serve as the source and drain regions of the transistor. A gate dielectric is deposited over the portion of the carbon based material that serves as the channel region of the transistor. A top-gate contact is formed on the gate dielectric.
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公开(公告)号:DE112010004367B4
公开(公告)日:2014-08-07
申请号:DE112010004367
申请日:2010-08-31
Applicant: IBM
Inventor: LIN YU-MING , JENKINS KEITH AELWYN , VALDES GARCIA ALBERTO
IPC: H01L29/786 , H01L29/49
Abstract: Graphen-Feldeffekttransistor, welcher das Folgende umfasst: einen Gate-Stapel, wobei der Gate-Stapel eine Keimschicht (504), ein über der Keimschicht ausgebildetes Gate-Oxid (502) und ein über dem Gate-Oxid ausgebildetes Gate-Metall (402) umfasst; eine isolierende Schicht (104); und eine Graphenschicht (106), welche zwischen der Keimschicht und der isolierenden Schicht angeordnet ist; und einen Abstandhalter (602), der auf einer oberen Seite und auf beiden Seiten des Gate-Stapels ausgebildet ist.
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公开(公告)号:GB2493238A
公开(公告)日:2013-01-30
申请号:GB201208558
申请日:2011-04-26
Applicant: IBM
Inventor: CHEN KUAN-NENG , LIN YU-MING , AVOURIS PHAEDON , FARMER DAMON BROOKS
IPC: H01L21/822 , B82Y10/00 , H01L27/06 , H01L27/12 , H01L29/16 , H01L29/786
Abstract: Graphene-channel based devices and techniques for the fabrication thereof are provided. In one aspect, a semiconductor device includes a first wafer having at least one graphene channel formed on a first substrate, a first oxide layer surrounding the graphene channel and source and drain contacts to the graphene channel that extend through the first oxide layer; and a second wafer having a CMOS device layer formed in a second substrate, a second oxide layer surrounding the CMOS device layer and a plurality of contacts to the CMOS device layer that extend through the second oxide layer, the wafers being bonded together by way of an oxide-to-oxide bond between the oxide layers. One or more of the contacts to the CMOS device layer are in contact with the source and drain contacts. One or more other of the contacts to the CMOS device layer are gate contacts for the graphene channel.
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公开(公告)号:GB2507686B
公开(公告)日:2014-07-16
申请号:GB201402301
申请日:2011-04-26
Applicant: IBM
Inventor: CHEN KUAN-NENG , LIN YU-MING , AVOURIS PHAEDON , FARMER DAMON BROOKS
IPC: H01L29/16 , H01L21/822
Abstract: Graphene-channel based devices and techniques for the fabrication thereof are provided. In one aspect, a semiconductor device includes a first wafer having at least one graphene channel formed on a first substrate, a first oxide layer surrounding the graphene channel and source and drain contacts to the graphene channel that extend through the first oxide layer; and a second wafer having a CMOS device layer formed in a second substrate, a second oxide layer surrounding the CMOS device layer and a plurality of contacts to the CMOS device layer that extend through the second oxide layer, the wafers being bonded together by way of an oxide-to-oxide bond between the oxide layers. One or more of the contacts to the CMOS device layer are in contact with the source and drain contacts. One or more other of the contacts to the CMOS device layer are gate contacts for the graphene channel.
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公开(公告)号:GB2507686A
公开(公告)日:2014-05-07
申请号:GB201402301
申请日:2011-04-26
Applicant: IBM
Inventor: CHEN KUAN-NENG , LIN YU-MING , AVOURIS PHAEDON , FARMER DAMON BROOKS
IPC: H01L29/16 , H01L21/822
Abstract: Graphene-channel based transistor comprising a substrate with a source and a drain contact 2102, and a graphene channel 2502 formed on the substrate 1704 which connects the contacts. A gate contact 2902 over the graphene channel, separated from the channel with a dielectric. The gate contact is positioned in a non-overlapping position with the source and drain contacts; this leaves exposed sections 3102 of the graphene channel, which can then be doped with an n-type or p-type dopant 3302. A capping layer may be provided over the source, drain and gate contacts, as well as the exposed sections of the graphene channel. The substrate may comprise an insulating layer on the channel. The substrate may comprise an insulating wafer or a wafer having an insulating over layer or a silicon carbide layer. The capping layer may comprise an oxide or a nitride material. There may be more than one layer of graphene on the substrate and this may be deposited using exfoliation or by silicon sublimation with epitaxy.
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17.
公开(公告)号:DE102012222116A1
公开(公告)日:2013-08-14
申请号:DE102012222116
申请日:2012-12-04
Applicant: IBM
Inventor: DIMITRAKOPOULOS CHRISTOS D , FARMER DAMON B , GRILL ALFRED , LIN YU-MING , NEUMAYER DEBORAH A , PFEIFFER DIRK , ZHU WENJUAN
IPC: H01L29/786 , H01L21/20 , H01L29/16
Abstract: Auf einer Oberseite einer Graphenschicht wird eine Siliciumnitridschicht bereitgestellt, und dann wird auf einer Oberseite der Siliciumnitridschicht eine Hafniumdioxidschicht bereitgestellt. Die Siliciumnitridschicht wirkt als ein Benetzungsmittel für die Hafniumdioxidschicht und verhindert dadurch die Bildung von diskontinuierlichen Hafniumdioxidsäulen über der Graphenschicht. Die Siliciumnitridschicht und die Hafniumdioxidschicht, die zusammen ein Doppelschicht-Gate-Dielektrikum mit geringer äquivalenter Oxiddicke (EOT) bilden, weisen über der Graphenschicht eine kontinuierliche Morphologie auf.
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公开(公告)号:SG184823A1
公开(公告)日:2012-11-29
申请号:SG2012075578
申请日:2011-04-26
Applicant: IBM
Inventor: CHEN KUAN-NENG , LIN YU-MING , AVOURIS PHAEDON , FARMER DAMON BROOKS
Abstract: Graphene-channel based devices and techniques for the fabrication thereof are provided. In one aspect, a semiconductor device includes a first wafer having at least one graphene channel formed on a first substrate, a first oxide layer surrounding the graphene channel and source and drain contacts to the graphene channel that extend through the first oxide layer; and a second wafer having a CMOS device layer formed in a second substrate, a second oxide layer surrounding the CMOS device layer and a plurality of contacts to the CMOS device layer that extend through the second oxide layer, the wafers being bonded together by way of an oxide-to-oxide bond between the oxide layers. One or more of the contacts to the CMOS device layer are in contact with the source and drain contacts. One or more other of the contacts to the CMOS device layer are gate contacts for the graphene channel.
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公开(公告)号:GB2497248B
公开(公告)日:2014-12-31
申请号:GB201305445
申请日:2011-07-20
Applicant: IBM
Inventor: AVOURIS PHAEDON , FARMER DAMON BROOKS , LIN YU-MING , ZHU YU
IPC: H01L29/16 , H01L29/417 , H01L29/423 , H01L29/778 , H01L29/786
Abstract: A method of forming a transistor structure is provided. The method includes forming a graphene layer on an insulating layer; forming a stack of a first metal portion and a second metal portion over the graphene layer, wherein sidewalls of the first metal portion are vertically coincident with sidewalls of the second metal portion; and laterally offsetting the sidewalls of the first metal portion relative to the sidewalls of the second metal portion by a lateral distance.
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公开(公告)号:GB2499311B
公开(公告)日:2014-12-17
申请号:GB201300509
申请日:2013-01-11
Applicant: IBM
Inventor: DIMITRAKOPOULOS CHRISTOS , GRILL ALFRED , NEUMAYER DEBORAH ANN , PFEIFFER DIRK , ZHU WENJUAN , FARMER DAMON BROOKS , LIN YU-MING
IPC: H01L29/786 , B82Y40/00 , H01L21/02 , H01L29/16 , H01L29/66
Abstract: A silicon nitride layer is provided on an uppermost surface of a graphene layer and then a hafnium dioxide layer is provided on an uppermost surface of the silicon nitride layer. The silicon nitride layer acts as a wetting agent for the hafnium dioxide layer and thus prevents the formation of discontinuous columns of hafnium dioxide atop the graphene layer. The silicon nitride layer and the hafnium dioxide layer, which collectively form a low EOT bilayer gate dielectric, exhibit continuous morphology atop the graphene layer.
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