公开(公告)号：DE68910215T2

公开(公告)日：1994-05-05

申请号：DE68910215

申请日：1989-05-24

Applicant: IBM

Inventor： BICKFORD HARRY R ,  MOK LAWRENCE S ,  PALMER MICHAEL J

IPC: H01L23/34 ,  H01L21/60 ,  H01L23/13 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

Abstract: A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads (31), which leads extend into the aperture and connect to a semiconductor chip (34). Thermally conductive body means (10) is provided which has a well (18) formed therein, the well defined by a lip (22) comprising the outer rim (20) of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means (10) and the flexible dielectric film (30) is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means (40, 42) are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.

公开(公告)号：GB2346239A

公开(公告)日：2000-08-02

申请号：GB0001092

申请日：2000-01-19

Applicant: IBM

Inventor： KWOK THOMAS YU-KIU ,  MOK LAWRENCE S

IPC: G09C1/00 ,  G06F1/00 ,  G06F17/00 ,  G06F21/00 ,  G06F21/20 ,  G06Q20/34 ,  G06Q20/36 ,  G06Q20/40 ,  G06T7/00 ,  G07F7/08 ,  G07F7/10 ,  H04L9/32 ,  G07F19/00 ,  G06F12/14

Abstract: A method and system are disclosed for accessing personal Web site or executing electronic commerce securely in a smart Java card. A personal Web site which includes personal or private information is stored in a personal smart Java card. Before a user can access the Web site stored in the smart Java card, the user is validated by one or a combination of PIN, facial images, hand images, eye image, voice characteristics, and finger prints. Further, an encryption engine embedded in the smart Java card decodes and compares the entered PIN combined with a secure key or security certificate to verify the user's identity. Before the bank account can be accessed freely by the user, the bank's computer system checks the combined secure data to ensure the authenticity of the card and the user's identity with multiple check points using Internet security protocols via Web browses.

公开(公告)号：DE69018806T2

公开(公告)日：1995-11-23

申请号：DE69018806

申请日：1990-12-13

Applicant: IBM

Inventor： MOK LAWRENCE S ,  SCHWALL ROBERT E ,  TONG HO-MING

IPC: H01L23/36 ,  H01L23/14 ,  H01L23/16 ,  H01L23/367 ,  H01L23/42

公开(公告)号：DE68918380T2

公开(公告)日：1995-03-30

申请号：DE68918380

申请日：1989-07-12

Applicant: IBM

Inventor： ARLDT BRIAN D ,  BRUHN PETER H ,  BULLER LAWRENCE M ,  LEDERMANN PETER G ,  LINAM STEPHEN D ,  MCNELIS BARBARA J ,  MOK LAWRENCE S ,  MOSKOWITZ PAUL A

IPC: H01L23/36 ,  H01L23/40

Abstract: An integrated circuit chip package is described wherein the chip (18) has an active face including a plurality of input and output pads (30). The chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board (26). A convective heat sink (32) is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden accelerations. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points (60) which are physically connected to the underlying circuit board via resilient connecting means.

公开(公告)号：MY118393A

公开(公告)日：2004-10-30

申请号：MYPI9502537

申请日：1995-08-25

Applicant: IBM

Inventor： MOK LAWRENCE S ,  PURUSHOTHAMAN SAMPATH ,  WILCZYNSKI JANUSZ S ,  SAMMAKIA BAHGAT G ,  WU TIEN Y

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/467

Abstract: AN ELECTRONIC PACKAGE HAVING AN ACTIVE COOLING SYSTEM FOR MAINTAINING A SEMICONDUCTOR CHIP(18) AT APPROXIMATELY A CONSTANT TEMPERATURE BY MONITORING THE PRESENT TEMPERATURE OF THE CHIP AND VARYING THE AIR FLOW OVER A HEAT SINK(13) IN THERMAL CONTACT WITH THE CHIP IN RESPONSE TO THE TEMPERATURE. IN ADDITION, THE TEMPERATURE DIFFERENCE BETWEEN THE SEMICONDUCTOR CHIP MODULE(12) AND A PRINTED CIRCUIT BOARD(11) IS ALSO MONITORED TO MAINTAIN THAT DIFFERENCE AT A PRESET VALUE. THE AIR FLOW IS VARIED BY A VARIABLE SPEED FAN(14,26) OR A VARIABLE DIRECTION BAFFLE. (FIG. 1)

公开(公告)号：SG32442A1

公开(公告)日：1996-08-13

申请号：SG1995001055

申请日：1995-08-04

Applicant: IBM

Inventor： MOK LAWRENCE S ,  PURUSHOTHAMAN SAMPATH ,  WILCZYNSKI JANUSZ S ,  SAMMAKIA BAHGAT G ,  WU TIEN Y

IPC: H01L23/34

公开(公告)号：DE68910215D1

公开(公告)日：1993-12-02

申请号：DE68910215

申请日：1989-05-24

Applicant: IBM

Inventor： BICKFORD HARRY R ,  MOK LAWRENCE S ,  PALMER MICHAEL J

IPC: H01L23/34 ,  H01L21/60 ,  H01L23/13 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

Abstract: A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads (31), which leads extend into the aperture and connect to a semiconductor chip (34). Thermally conductive body means (10) is provided which has a well (18) formed therein, the well defined by a lip (22) comprising the outer rim (20) of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means (10) and the flexible dielectric film (30) is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means (40, 42) are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.

公开(公告)号：DE60237433D1

公开(公告)日：2010-10-07

申请号：DE60237433

申请日：2002-02-25

Applicant: IBM

Inventor： BLUMRICH MATTHIAS A ,  CHEN DONG ,  CHIU GEORGE L ,  CIPOLLA THOMAS M ,  COTEUS PAUL W ,  GARA ALAN G ,  GIAMPAPA MARK E ,  HEIDELBERGER PHILIP ,  KOPSCAY GERALD V ,  MOK LAWRENCE S ,  TAKKEN TODD E

IPC: G06F11/10 ,  G06F15/16 ,  G06F9/46 ,  G06F9/52 ,  G06F11/00 ,  G06F11/20 ,  G06F12/00 ,  G06F12/02 ,  G06F12/08 ,  G06F12/10 ,  G06F13/00 ,  G06F13/24 ,  G06F13/38 ,  G06F15/00 ,  G06F15/173 ,  G06F15/177 ,  G06F15/80 ,  G06F17/14 ,  H04L1/00 ,  H04L7/02 ,  H04L7/033 ,  H04L12/28 ,  H04L12/56 ,  H04L25/02 ,  H05K7/20

公开(公告)号：GB2346239B

公开(公告)日：2003-09-10

申请号：GB0001092

申请日：2000-01-19

Applicant: IBM

Inventor： KWOK THOMAS YU-KIU ,  MOK LAWRENCE S

IPC: G09C1/00 ,  G06F1/00 ,  G06F17/00 ,  G06F21/00 ,  G06F21/20 ,  G06Q20/34 ,  G06Q20/36 ,  G06Q20/40 ,  G06T7/00 ,  G07F7/08 ,  G07F7/10 ,  H04L9/32 ,  G07F19/00 ,  G06F12/14

Abstract: A Method and system are disclosed for accessing personal Web site or executing electronic commerce with security in a smart Java card. A personal Web site which includes personal or private information is stored in a personal smart Java card. Before a user can access the Web site stored in the smart Java card, the user is validated by any one of or in combination of PIN, facial images, hand images, eye image, voice characteristics, and finger prints. In addition, an encryption engine embedded in the smart Java card decodes and compares the entered PIN combined with a secure key or security certificate to verify the identity of the user. Before the bank account can be accessed freely by the user, the bank's computer system checks the combined secure data to ensure the authenticity of the card and the user's identity with multiple check points using Internet security protocols via Web browsers.

公开(公告)号：CA2437039A1

公开(公告)日：2002-10-24

申请号：CA2437039

申请日：2002-02-25

Applicant: IBM

Inventor： BLUMRICH MATTHIAS A ,  CHIU GEORGE L ,  TAKKEN TODD E ,  CIPOLLA THOMAS M ,  CHEN DONG ,  MOK LAWRENCE S ,  COTEUS PAUL W ,  GARA ALAN G ,  KOPSCAY GERALD V ,  HEIDELBERGER PHILIP ,  GIAMPAPA MARK E

IPC: G06F11/10 ,  G06F9/46 ,  G06F9/52 ,  G06F11/00 ,  G06F11/20 ,  G06F12/00 ,  G06F12/02 ,  G06F12/08 ,  G06F12/10 ,  G06F13/00 ,  G06F13/24 ,  G06F13/38 ,  G06F15/173 ,  G06F15/177 ,  G06F15/80 ,  G06F17/14 ,  H04L1/00 ,  H04L7/02 ,  H04L7/033 ,  H04L12/28 ,  H04L12/56 ,  H04L25/02 ,  H05K7/20 ,  G06F15/16 ,  G06F15/00

Abstract: A novel massively parallel supercomputer of hundreds of teraOPS-scale includ es node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC). The ASIC nodes (20) are interconnected by multiple independent networks (26) that optimally maximizes packet communications throughput and minimizes latency. The multiple networks may include three high-speed networ ks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance.