公开(公告)号：DE10034865B4

公开(公告)日：2006-06-01

申请号：DE10034865

申请日：2000-07-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  GATTINGER PETER ,  HURT HANS ,  KUHN GERHARD ,  REILL JOACHIM ,  WAIDHAS BERND ,  WEIGERT MARTIN ,  WICKE MARKUS

IPC: G02B6/42 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/62 ,  H05K1/02 ,  H05K1/18

Abstract: An optoelectronic module is disclosed, which can be connected optically and electrically in a simply way. The optoeletronic module consists of a SMD-housing (1) for the electrical connection and a connector (5), on which a MT-plug is fitted, for the optical connection. The SMD-housing is assigned to the MT-plug. It includes a plug connector (5), which contains the optical/electrical interface and is positively fixed in the housing.

公开(公告)号：DE10144464A1

公开(公告)日：2003-04-10

申请号：DE10144464

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  STADLER BERND

IPC: H01F17/00 ,  H01F27/29 ,  H01L27/08

Abstract: Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electrically connecting through-contacts (7) are arranged through the housing between electrodes (8, 9) of the coil on the upper side and the external contacts on the lower side. An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The through-contacts have galvanically deposited metallic columns which are surrounded by a plastic housing composition (11) on the casing surfaces (12) of the columns. The through-contacts are made from nickel, gold, silver, aluminum or their alloys. The plastic housing is applied using an injection molding process.

公开(公告)号：DE10047135A1

公开(公告)日：2002-04-25

申请号：DE10047135

申请日：2000-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  HAINZ OSWALD ,  LANG DIETMAR ,  PETZ MARTIN ,  WEBER MICHAEL

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/50 ,  H01L21/58 ,  H01L21/60

Abstract: Production of a component comprises preparing an integrated circuit (1) having an active main side (5) with contact pads (11) connected to electrically conducting humps (2); applying the circuit onto a substrate, the main side of the circuit facing the substrate; enclosing the circuit using a cast mass (3); and removing parts of the substrate from the circuit. Preferred Features: The step of applying the circuit to the substrate comprises connecting the humps to the substrate by thermal compressing or alloying. The substrate is removed by etching, delaminating, grinding or sawing.

公开(公告)号：DE102010000539A1

公开(公告)日：2010-09-30

申请号：DE102010000539

申请日：2010-02-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  PAULUS STEFAN ,  SEE BENG KEH ,  WIETSCHORKE HELMUT

IPC: H01L23/31 ,  H01L21/56 ,  H01L25/16

公开(公告)号：DE102009038706A1

公开(公告)日：2010-03-04

申请号：DE102009038706

申请日：2009-08-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ELIAN KLAUS ,  AUBURGER ALBERT

IPC: G01L15/00 ,  B81B7/02 ,  B81C1/00 ,  B81C3/00 ,  G01L9/00 ,  H01L25/04 ,  H01L41/053

Abstract: A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable. A second sensor has a second sensor surface. The second sensor surface is sealed to inhibit sensing of the first variable, and a mold material is embedded in the first and second sensors.

公开(公告)号：DE10146854B4

公开(公告)日：2009-05-20

申请号：DE10146854

申请日：2001-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  THEUS HORST ,  STADLER BERND

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/04 ,  H01L23/31

Abstract: The electronic component (2) comprises the semiconductor chip (4) on a metal substrate (6), and a housing (12). There is also a screen (124) against HF electromagnetic radiation, as an integral part of the housing, forming at least one part of the housing wall (122).The screen may comprise a metal, or a non-conductor, or non-conductor with metal plating. The metal substrate may contain a wiring structure (8) round the semiconductor chip(s), whose contact faces (43) are conductively coupled by bonding wires (10) to contact pads (81) of wiring structure. Independent claims are included for mfg. method of the electronic component.

公开(公告)号：DE102006057970A1

公开(公告)日：2008-06-12

申请号：DE102006057970

申请日：2006-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT

IPC: H01L43/00

Abstract: The semiconductor component (100) has a semiconductor chip (10), which is designed as a wafer-level-package, into which a magnetic field sensor (11) is integrated. A magnet is applied on a main surface (12) of the semiconductor chip. The magnet is a layer of a permanent magnetic material isolated from the main surface of the semiconductor chip. An independent claim is also included for the method with whicha support is provided.

公开(公告)号：DE10201781B4

公开(公告)日：2007-06-06

申请号：DE10201781

申请日：2002-01-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  KLOSE FRANK ,  LEHNER RUDOLF

IPC: H01L23/36 ,  H01L21/50 ,  H01L21/60 ,  H01L23/367 ,  H01L23/433 ,  H01L23/50 ,  H01L23/64 ,  H01L23/66

Abstract: A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.

公开(公告)号：DE10144464C2

公开(公告)日：2003-07-17

申请号：DE10144464

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  STADLER BERND

IPC: H01F17/00 ,  H01F27/29 ,  H01L27/08

公开(公告)号：DE10205544A1

公开(公告)日：2003-05-15

申请号：DE10205544

申请日：2002-02-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  THEUSS HORST ,  KILGER THOMAS

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/552 ,  H01L23/48 ,  H01L23/055

Abstract: Production of an electronic semiconductor component, comprises placing and joining together insulating layers, applying a semiconductor chip to the uppermost layer, joining the contact surfaces, and encapsulating the chip and uppermost layer. Production of an electronic semiconductor component having a three dimensional wiring structure comprises: (a) placing and joining together insulating layers having passages in the form of conducting structures; (b) applying a semiconductor chip to the uppermost layer; (c) joining the contact surfaces using contact connecting surfaces of the wiring structure; and (d) encapsulating the semiconductor chip and uppermost insulating layer. An Independent claim is also included for the electronic semiconductor component produced by the above process. Preferably the lowermost insulating layer is applied on and joined to the upper surface (41) of a metallic substrate (4). After encapsulation, the substrate is removed from the lowermost insulating layer. The passages are filled with a metallic wiring structure using a galvanic method. The insulating layers are made from polyimide layers and/or films. The wiring structure is made from Ni, Ag and/or Cu.