ON-CHIP MESH INTERCONNECT
    12.
    发明公开
    ON-CHIP MESH INTERCONNECT 审中-公开
    片上GEFLECHT

    公开(公告)号:EP3014420A4

    公开(公告)日:2017-04-05

    申请号:EP13888191

    申请日:2013-06-29

    Applicant: INTEL CORP

    CPC classification number: G06F13/4031 G06F15/17381 G06F15/8023

    Abstract: A particular message is received at a first ring stop connected to a first ring of a mesh interconnect including a plurality of rings oriented in a first direction and a plurality of rings oriented in a second direction substantially orthogonal to the first direction. The particular message is injected on a second ring of the mesh interconnect. The first ring is oriented in the first direction, the second ring is oriented in the second direction, and the particular message is to be forwarded on the second ring to another ring stop of a destination component connected to the second ring.

    Abstract translation: 在连接到网状互连的第一环的第一环停止处接收特定的消息,该网状互连包括沿第一方向定向的多个环和沿与第一方向基本正交的第二方向定向的多个环。 特定的消息被注入到网状互连的第二个环上。 第一环定向于第一方向,第二环定向于第二方向,并且特定消息将在第二环上被转发至连接至第二环的目的地组件的另一环形停止。

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