公开(公告)号：EP1446237A2

公开(公告)日：2004-08-18

申请号：EP02789762.8

申请日：2002-11-19

Applicant: Graphic Packaging International, Inc.

Inventor： LAI, Laurence, M., C. ,  RUSSELL, Anthony ,  SHAW, Michael, J.

IPC: B05D5/00 ,  B32B7/00 ,  C23F1/02 ,  G08B13/14 ,  H05K3/06 ,  H01G7/00 ,  H04R9/00

CPC classification number: H05K1/0265 ,  B32B15/04 ,  C23F1/02 ,  H04R7/04 ,  H04R31/003 ,  H05K1/09 ,  H05K1/165 ,  H05K3/06 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T428/10 ,  Y10T428/24 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: To achieve a large thickness of conductive metal-containing material in a feature of a product unit processed with a liquid-based etch process, the desired thickness of material is apportioned to the two opposing surfaces of a substrate to create a two-part feature. Conventional features are made by identically patterning two same-thickness metal-containing layers and electrically connecting the resulting patterned parts in any suitable manner. However, features may also be made that do not have identical parts on opposite sides of the substrate, the two parts being electrically connected but differing in thickness, in shape, or both. Moreover, having two metal-containing layers separated by an insulator is also useful for allowing different sections of the same feature or circuit to cross one another without shorting, or to overlap in whole or in part without shorting. A polymer substrate (1004), e.g. polyethlyene terepthalate, is covered on the top and bottom surfaces by a metal- containing layer, e.g. aluminium or copper foil, which are in turn covered by etch masks (1110, 1120, 1130, 1140, 1150, 1160, 1180), e.g. a resin formed by gravure printing or photoresist. The web is immersed in a bath or sprayed with an etchant, e.g. NaOH, to form the metal- containing web (1115, 1125, 1135, 1145, 1155, 1165, 1175, 1185).

公开(公告)号：EP0789397B1

公开(公告)日：2004-05-06

申请号：EP97300625.7

申请日：1997-01-30

Applicant: Hitachi, Ltd.

Inventor： Tanaka, Akira ,  Kushima, Tadao ,  Shimizu, Hideo ,  Okada, Sensuke ,  Koike, Yoshihiko ,  Yamada, Kazuji ,  Saito, Ryuichi

IPC: H01L23/373 ,  H01L23/15

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/498 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K3/0058 ,  H05K3/38 ,  H05K2201/09145 ,  H05K2201/098 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

公开(公告)号：EP1298968A2

公开(公告)日：2003-04-02

申请号：EP02021755.0

申请日：2002-09-25

Applicant: Dowa Mining Co., Ltd.

Inventor： Tsukaguchi, Nobuyoshi ,  Kimura, Masami

IPC: H05K1/03

CPC classification number: H05K3/38 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/706 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/244 ,  H05K2201/0355 ,  H05K2201/098 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 µm.

公开(公告)号：EP1168901A2

公开(公告)日：2002-01-02

申请号：EP01112310.6

申请日：2001-05-19

Applicant: rotra Leiterplatten Produktions- und Vetriebs-GmbH

Inventor： Opitz, Rudi Walter ,  Stuckmann, Walter Paul Fritz

IPC: H05K3/46 ,  H01F17/00

CPC classification number: H01F41/041 ,  H01F17/0013 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2203/0143 ,  H05K2203/0759

Abstract: Mehrlagen-Leiterplatten-Verbundkörper (5) mit mindestens zwei flächig übereinander angeordneten Leiterplatten (9), welche jeweils aufweisen eine elektrisch isolierende Trägerplatte (10), elektrisch leitende Leiterbahnen (11), die auf mindestens einer Seite der Trägerplatte (10) vorgesehen sind und Ausnehmungen (12), die seitlich von den Leiterbahnen (11) und zur Trägerplatte (10) hin durch die Trägerplatte (10) begrenzt werden, und mit mindestens einer zwischen den Leiterplatten (9) angeordneten Verbundfolie (14) zum Verbinden der Leiterplatten (9), wobei die zwischen den Trägerplatten (10) der jeweiligen Leiterplatten (9) angeordneten Ausnehmungen (12) im wesentlichen vollständig mit einer Kunstharz-Masse (13) ausgefüllt sind und wobei die mindestens zwei Leiterplatten (9) und die mindestens eine Verbundfolie (14) miteinander verpreßt sind.

Abstract translation: 多层电路板复合体包括具有在电两个电路板（9）绝缘支撑板（10）在所述板的一侧上，导电通路（11），和凹口（12），以晚反弹限途径; 和所述电路板之间设置一复合箔（14），以将它们连接。 所述凹部填充有人工树脂（13）。 电路板和复合箔被压在一起。 因此独立claimsoft包括用于生产多层电路板的方法。 优选的特征：所述导电通路具有的厚度为400微米米。 该凹陷都填充到99.9％以上。 人造树脂是从气泡基本上不含。 该复合箔是用人造树脂浸渍的玻璃纤维材料。

公开(公告)号：EP1114439A2

公开(公告)日：2001-07-11

申请号：EP99937726.0

申请日：1999-07-30

Applicant: Kulicke & Soffa Holdings, Inc.

Inventor： STRANDBERG, Jan, I. ,  CHAZAN, David, J. ,  SKINNER, Michael, P.

IPC: H01L21/00

CPC classification number: H01L23/5385 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2203/0353 ,  H05K2203/0585 ,  H05K2203/0759 ,  H05K2203/1476 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

Abstract: A method for forming low-impedance high density deposited-on-laminate (D/L) structures (10) having reduced stress features reducing metallization present on the laminate printed circuit board (12). In this manner, reduced is the force per unit area exerted on the dielectric material (30) disposed adjacent to the laminate material (16) which is typically present during thermal cycling of the structure.

公开(公告)号：EP1032957A2

公开(公告)日：2000-09-06

申请号：EP98956084.2

申请日：1998-11-19

Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (publ)

Inventor： BERGSTEDT, Leif ,  GEORGIAN, Spartak

IPC: H01P3/08 ,  H01Q13/20

CPC classification number: H01P3/084 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q13/206 ,  H01Q21/0081 ,  H05K1/024 ,  H05K1/0245 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/098 ,  H05K2201/09972

Abstract: The invention relates to a microstrip arrangement comprising a first and a second microstrip conductor. The two microstrip conductors have essentially the same dimensions in their longitudinal direction and transverse direction, and are galvanically interconnected by means of at least one connection. The two microstrip conductors also extend essentially parallel to one another on either side of a dielectric material. As a result of this design of the microstrip arrangement, the field losses and also other influences caused by the dielectric material will be very considerably reduced, and in practice a resultant microstrip arrangement is obtained, which, with regard to its electrical performance, appears to be suspended in the air. Preferred embodiments comprise a microstrip antenna, a circuit board and a conductor application.

Abstract translation: 本发明涉及包括第一和第二微带导体的微带装置。 两个微带导体在其纵向方向和横向方向上具有基本相同的尺寸，并且通过至少一个连接电流互连。 两个微带导体也在电介质材料的任一侧基本上彼此平行地延伸。 由于微带装置的这种设计，由介电材料引起的场损耗和其它影响将非常显着地降低，并且实际上获得了所得到的微带结构，就其电性能而言，似乎 悬浮在空中。 优选实施例包括微带天线，电路板和导体应用。

公开(公告)号：EP1026928A2

公开(公告)日：2000-08-09

申请号：EP00300553.5

申请日：2000-01-26

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandial

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/062 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  Y02P70/611

Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising:

an electrically insulative substrate surface (10), a plurality of tri-metal-layer bond pads (12) arranged in a generally straight row on the substrate surface (10) wherein the row defines a width direction therealong, and a circuit trace (20) arranged on the substrate surface (10), wherein the circuit trace (20) runs between two adjacent ones (22) of the plurality of tri-metal-layer bond pads (12). Each bond pad (12) comprises: (1) a bottom layer (14) attached to the substrate surface (10), the bottom layer (14) being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer (18) disposed above and generally concentric with the bottom layer (14), the top layer (18) being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer (16) made of a second metal connecting the bottom layer (14) and the top layer (18). The bond pads (12) are specially shaped such that W2 > W1 for at least the two adjacent bond pads (12), thus enabling the circuit trace (20) to be spaced closely to the bottom layers (14) of the two adjacent bond pads (12), while allowing the top layers (18) of the pads (12) to be made much larger so as to avoid delamination thereof from their associated middle layers (16).

Abstract translation: 蚀刻的三金属层的空气桥电路板专为细间距应用，包括：在一个基因的反弹直排布置在电绝缘衬底表面（10），的三金属层接合垫有多个（12） 配置于该基板表面（10）worin的电路迹线（20）在基片上表面（10）worin行有沿定义的宽度方向，和一个电路迹线（20）的所述多个相邻的两个（22）之间延伸 三金属层接合焊盘（12）。 每一接合垫（12）包括：（1）附连到基板表面（10）的底层（14），底层（14）由第一金属制成的，并沿宽度方向测量的具有总宽度W1 ; 上述（2）和基因反弹同心设置为与底层（14），所述顶层（18）的顶层（18）由所述第一金属的，并具有为沿宽度方向测量的总宽度W2; 和（3）由第二金属制成的连接底部层（14）和顶层（18）的中间层（16）。 的键合焊盘（12）被特殊形状搜索做W2> W1，至少在两个相邻的键合焊盘（12）从而使电路迹线（20）被紧密间隔相邻的两个键的底层（14） 垫（12），同时允许所述垫（12）的顶层（18），以进行大得多，以便从它们相关联的中间层（16），其避免脱层。

公开(公告)号：EP0969707A2

公开(公告)日：2000-01-05

申请号：EP99201699.8

申请日：1999-05-28

Applicant: Matsushita Electric Works, Ltd.

Inventor： Yoshioka, Hirokazu ,  Yoshida, Norio ,  Tanaka, Kenichiro

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K3/4652 ,  H05K1/116 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/0055 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/098 ,  H05K2201/09863 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165

Abstract: A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 µm in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.

Abstract translation: 多层印刷线路板由多个导体层整体层叠而形成，绝缘层介于其间，设置在绝缘层中的非贯通通孔，所述绝缘层由于暴露的导体层而有底，设置在通孔内用于 所述导体层之间的电连接在所述通孔的内周到底面的连续区处沿所述轴向剖视图形成为具有在20至100μm范围内的半径的凹曲面， 在电镀镀层时发生的等势表面沿着连续区域弯曲，以统一电流密度，以使电镀层在厚​​度上均匀，而不在连续区域变薄。

公开(公告)号：EP0895445A1

公开(公告)日：1999-02-03

申请号：EP98500155.1

申请日：1998-07-07

Applicant: MECANISMOS AUXILIARES INDUSTRIALES S.A. M.A.I.S.A.

Inventor： Llop Tous, Jordi

IPC: H05K1/02 ,  H05K3/06

CPC classification number: H05K1/0265 ,  H05K1/111 ,  H05K3/06 ,  H05K2201/098 ,  H05K2201/10689

Abstract: Un circuit imprimé de puissance (10) amélioré est formé à base d'un substrat diélectrique (11) sur lequel est obtenu un ensemble de pistes conductrices (12) en cuivre comme conséquence d'une attaque chimique prévue dans les zones non recouvertes d'une couche de cuivre disposée sur ce substrat diélectrique, caractérisés par le fait que la distance "c" entre les centres des pistes (12) seront de 1,27mm lorsque la distance "d" d'inter-piste entre les points inférieurs des plans (12b) est de 0,5mm et la distance "b" entre les points supérieurs de (12b) est de 0,65mm.

Abstract translation: 轨道间配置具有通过化学蚀刻形成的多个导体轨道（12）和衬底（10）的上表面。 每个轨道具有倾斜侧面，并且轨道中心（c）之间的距离可以少至1.27mm，而上轨道边缘（b）之间的间隔可以低至0.65mm，并且在下边缘之间为0.5mm。

公开(公告)号：EP0827198A3

公开(公告)日：1998-07-15

申请号：EP97810603.7

申请日：1997-08-27

Applicant: Dowa Mining Co., Ltd.

Inventor： Sakuraba, Masami ,  Kimura, Masami ,  Nakamura, Junji ,  Takahara, Masaya

IPC: H01L23/14 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L23/3735 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/70 ,  H01L23/13 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/0355 ,  H05K2201/09145 ,  H05K2201/098 ,  H05K2201/09845 ,  H01L2924/00

Abstract: A paste of active metallic brazing material is applied to the entire surface of each side of aluminum nitride or alumina ceramic substrate 1; circuit forming copper plate 3 having a thickness of 0.3 mm is placed in contact with one surface of the substrate and a heat dissipating copper plate 4 having a thickness of 0.25 mm placed in contact with the other surface; the individual members are compressed together and heated at 850°C in a vacuum furnace to form a joint; an etching resist is applied to the circuit forming copper plate and etching is performed with an iron chloride solution to form a circuit pattern and the unwanted brazing material is removed from the marginal portions; a second resist layer is applied and etched with an iron chloride solution to form a second marginal step; a third resist layer is similarly applied and etched to form a third marginal step; the completed circuit board having three marginal steps of which the lowest one is solely or partly made of the brazing material can withstand 1,500 heat cycles, which is the result that has ben unattainable by the prior art. Having such high heat cycle characteristics, the circuit board is suitable for use as semiconductor substrate in automobiles, electric trains and other applications that require high output power.

Abstract translation: 在氮化铝或氧化铝陶瓷基片1的每一侧的整个表面上涂敷一层活性金属钎焊材料; 将厚度为0.3mm的电路形成铜板3放置成与基板的一个表面接触，并将厚度为0.25mm的散热铜板4放置成与另一个表面接触; 将各个构件压缩在一起并在真空炉中在850℃下加热以形成接头; 在电路形成用铜板上涂敷抗蚀剂，用氯化铁溶液进行蚀刻而形成电路图案，从边缘部除去不需要的硬钎焊材料， 施加第二抗蚀剂层并用氯化铁溶液蚀刻以形成第二边缘步骤; 类似地施加并刻蚀第三抗蚀剂层以形成第三边缘台阶; 完成的电路板具有三个边缘台阶，其中最下面的台阶完全或部分地由钎焊材料制成，能够承受1,500次热循环，这是现有技术所不能达到的结果。 具有如此高的热循环特性，电路板适合用作汽车，电车和其他需要高输出功率的应用中的半导体基板。