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公开(公告)号:US20220392876A1
公开(公告)日:2022-12-08
申请号:US17830268
申请日:2022-06-01
Applicant: EPISTAR CORPORATION , Yenrich Technology Corporation
Inventor: Min-Hsun HSIEH , Hsin-Mao LIU , Li-Yuan HUANG , Tzu-Hsiang WANG , Chi-Chih PU , Ya-Wen LIN , Hsiao-Pei CHIU , Pei-Yu LI
IPC: H01L25/075 , H01L33/62
Abstract: A light-emitting device includes a first carrier, which includes a side surface between a first surface and a second surface, upper conductive pads on the first surface, and lower conductive pads under the second surface; a RDL pixel package includes a RDL which includes bonding pads and bottom electrodes, and the light-emitting units on the RDL, and connected to the bonding pads. A light-transmitting layer on the RDL and covers the light-emitting units, an upper surface, a lower surface, and a lateral surface between the upper surface and the lower surface. The RDL pixel package is on the first surface and electrically connected to the upper conductive pads. A protective layer covers the first surface and contacting the side surface of the RDL pixel package. The lower electrodes and the upper conductive pads are connected, and the distance between two adjacent bonding pads is less than 30 μm.
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公开(公告)号:US20200313051A1
公开(公告)日:2020-10-01
申请号:US16900557
申请日:2020-06-12
Applicant: EPISTAR CORPORATION
Inventor: Cheng-Nan HAN , Tsung-Xian LEE , Min-Hsun HSIEH , Hung-Hsuan CHEN , Hsin-Mao LIU , Hsing-Chao CHEN , Ching-San TAO , Chih-Peng NI , Tzer- Perng CHEN , Jen-Chau WU
Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
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公开(公告)号:US20190355863A1
公开(公告)日:2019-11-21
申请号:US15984950
申请日:2018-05-21
Applicant: EPISTAR CORPORATION
Inventor: Hsin-Mao LIU , Hung-Chi WANG , Zong-Xi CHEN
IPC: H01L31/12 , H01L31/153 , H01L31/0352 , H01L31/109 , H01L31/024 , H01L31/0224 , H01L49/02
Abstract: A sensing apparatus includes a sensing device having a hetero-junction structure, a light coupler connected to the sensing device and a readout device connected to the light coupler.
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公开(公告)号:US20190229098A1
公开(公告)日:2019-07-25
申请号:US16254229
申请日:2019-01-22
Applicant: EPISTAR CORPORATION
Inventor: Min-Hsun HSIEH , Hsin-Mao LIU , Ying-Yang SU
Abstract: A light-emitting device includes a light-emitting element, a supporting structure, a first wavelength conversion structure, and a light-absorbing layer. The light-emitting element includes a plurality of active stacks separated from each other, a first-type semiconductor layer continuously arranged on the plurality of active stacks, and a plurality of second-type semiconductor layers under the plurality of active stacks. The supporting structure is disposed on the light-emitting element and includes a first opening. The first wavelength conversion structure disposed in the first opening. The light-absorbing layer disposed on the top surface of the supporting structure.
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公开(公告)号:US20190035846A1
公开(公告)日:2019-01-31
申请号:US16037862
申请日:2018-07-17
Applicant: EPISTAR CORPORATION
Inventor: Chien-Fu SHEN , Chao-Hsing CHEN , Tsun-Kai KO , Schang-Jing HON , Sheng-Jie HSU , De-Shan KUO , Hsin-Ying WANG , Chiu-Lin YAO , Chien-Fu HUANG , Hsin-Mao LIU , Chien-Kai CHUNG
Abstract: Disclosed herein is a light-emitting device. The light-emitting device includes a substrate with a top surface; a first light-emitting structure unit and a second structure light-emitting unit disposed on the top surface, the first light-emitting structure unit and the second light-emitting structure unit being spaced apart from each other, wherein each of the first light-emitting structure unit and the second light-emitting structure unit includes a lower layer having a first conductivity and an upper layer having a second conductivity; a trench between the first light-emitting structure unit and the second light-emitting structure unit, including a bottom portion which is a part of the top surface; an isolation layer, disposed on the trench and covering the bottom portion; and an electrical connection, electrically connecting the first light-emitting structure unit and the second light-emitting structure unit; wherein the lower layer includes an inclined sidewall and the electrical connection contacts the inclined sidewall.
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公开(公告)号:US20180128761A1
公开(公告)日:2018-05-10
申请号:US15804455
申请日:2017-11-06
Applicant: EPISTAR CORPORATION
Inventor: Kunal KASHYAP , Kun-Wei KAO , Yih-Hua RENN , Meng-Lun TSAI , Zong-Xi CHEN , Hsin-Mao LIU , Jui-Hung YEH , Hung-Chi WANG
IPC: G01N27/02 , H01L29/778 , H01L29/20 , H01L29/205 , H01L23/34
CPC classification number: G01N27/414 , G01N27/02 , G01N27/4141 , H01L23/3171 , H01L23/345 , H01L29/1029 , H01L29/2003 , H01L29/205 , H01L29/7786 , H01L29/7787
Abstract: A sensing device includes a first III-V compound stack and a second III-V compound stack. The first III-V compound stack has a first sensing area, and the second III-V compound stack has a second sensing area. A passivation layer fully covers the second sensing area. The first III-V compound stack is physically separated from the second III-V compound stack, and has material compositions and structures same as the second III-V compound stack.
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公开(公告)号:US20170365750A1
公开(公告)日:2017-12-21
申请号:US15678885
申请日:2017-08-16
Applicant: Epistar Corporation
Inventor: Cheng-Nan HAN , Tsung-Xian LEE , Min-Hsun HSIEH , Hung-Hsuan CHEN , Hsin-Mao LIU , Hsing-Chao CHEN , Ching San TAO , Chih-Peng NI , Tzer-Perng CHEN , Jen-Chau WU , Masafumi SANO , Chih-Ming WANG
Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
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公开(公告)号:US20170324009A1
公开(公告)日:2017-11-09
申请号:US15657399
申请日:2017-07-24
Applicant: EPISTAR CORPORATION
Inventor: Min-Hsun HSIEH , Cheng-Nan HAN , Steve Meng-Yuan HONG , Hsin-Mao LIU , Tsung-Xian LEE
IPC: H01L33/50 , H01L33/48 , H01L23/00 , H01L21/683 , H01L33/56 , H01L33/38 , H01L33/40 , H01L33/00 , H01L25/075
CPC classification number: H01L33/504 , H01L21/6835 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/96 , H01L25/0753 , H01L25/0756 , H01L33/0079 , H01L33/385 , H01L33/405 , H01L33/486 , H01L33/507 , H01L33/508 , H01L33/56 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4918 , H01L2224/82 , H01L2224/92 , H01L2224/96 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/10349 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
Abstract: An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a top surface, a bottom surface, a plurality of lateral surfaces arranged between the top surface and the bottom surface, and a first electrode arranged on the bottom surface; a wavelength converting material covering a plurality of lateral surfaces; and a reflecting layer, formed on the wavelength converting material which is arranged on the top surface.
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公开(公告)号:US20160307961A1
公开(公告)日:2016-10-20
申请号:US15196717
申请日:2016-06-29
Applicant: EPISTAR CORPORATION
Inventor: Chien-Fu SHEN , Chao-Hsing CHEN , Tsun-Kai KO , Schang-Jing HON , Sheng-Jie HSU , De-Shan KUO , Hsin-Ying WANG , Chiu-Lin YAO , Chien-Fu HUANG , Hsin-Mao LIU , Chien-Kai CHUNG
CPC classification number: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed herein is a light-emitting device. The light-emitting device includes a substrate; a first light-emitting unit and a second light-emitting unit, separately formed on the substrate; a trench between the first and the second light-emitting units, including a bottom portion exposing the substrate; an insulating layer, conformably formed on the trench and covering the bottom portion and sidewalls of the first and the second light-emitting units; and an electrical connection, formed on the insulating layer and electrically connecting the first and the second light-emitting units. The electrical connection includes a bridging portion covering the trench and a joining portion extending from the bridging portion and formed on the first and the second light-emitting units; wherein the bridging portion is wider than the joining portion; wherein a part of the insulating layer is formed under the joining portion.
Abstract translation: 这里公开了一种发光装置。 发光装置包括:基板; 分别形成在基板上的第一发光单元和第二发光单元; 在第一和第二发光单元之间的沟槽,包括露出衬底的底部; 绝缘层,顺应地形成在沟槽上并覆盖第一和第二发光单元的底部和侧壁; 以及形成在绝缘层上并电连接第一和第二发光单元的电连接。 电气连接包括覆盖沟槽的桥接部分和从桥接部分延伸并形成在第一和第二发光单元上的接合部分; 其中所述桥接部分比所述接合部分宽; 其中,所述绝缘层的一部分形成在所述接合部的下方。
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公开(公告)号:US20150188003A1
公开(公告)日:2015-07-02
申请号:US14657975
申请日:2015-03-13
Applicant: EPISTAR CORPORATION
Inventor: Min-Hsun HSIEH , Cheng-Nan HAN , Steve Meng-Yuan HONG , Hsin-Mao LIU , Tsung-Xian LEE
CPC classification number: H01L33/504 , H01L21/6835 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/96 , H01L25/0753 , H01L25/0756 , H01L33/0079 , H01L33/385 , H01L33/405 , H01L33/486 , H01L33/507 , H01L33/508 , H01L33/56 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4918 , H01L2224/82 , H01L2224/92 , H01L2224/96 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/10349 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
Abstract: An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a first width; an adhesive material enclosing the optoelectronic element and having a second width larger than the first width; a phosphor structure formed between the optoelectronic element and the adhesive material; and a transparent substrate formed on the adhesive material.
Abstract translation: 本发明的实施例公开了一种光电子系统。 光电子系统包括具有第一宽度的光电子元件; 封闭光电子元件并且具有大于第一宽度的第二宽度的粘合剂材料; 在所述光电元件和所述粘合剂材料之间形成的荧光体结构; 以及形成在粘合材料上的透明基板。
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