22.
    发明专利
    未知

    公开(公告)号:DE2753658A1

    公开(公告)日:1978-06-22

    申请号:DE2753658

    申请日:1977-12-02

    Applicant: IBM

    Inventor: HATZAKIS MICHAEL

    Abstract: Polymethyl methacrylate methacrylic acid (P[MMA/MAA]) copolymer powder is prebaked above 200 DEG C. The prebaked powder is dissolved in a suitable casting solvent. The insoluble material produced during prebaking is removed by filtration. Then the solution remaining is applied to a substrate, post-baked at a temperature less than or equal to the prebaking temperature to drive off the solvent, exposed to electron beam radiation, and developed in a developing solvent.

    26.
    发明专利
    未知

    公开(公告)号:DE69024452T2

    公开(公告)日:1996-07-11

    申请号:DE69024452

    申请日:1990-10-08

    Applicant: IBM

    Abstract: An ultraviolet light sensitive photoinitiator composition that includes at least one anthracene derivative represented by the formula: wherein X is CH=CH2 or -(-CH2-)-n0-(-R) with R being H or wherein each R , R and R individually is selected from the group of alkyl, alkenyl, aryl, wherein each R , R and R individually is selected from the group of alkyl, alkenyl and aryl; wherein m is an integer of 0 to 4, p is an integer of 0 to 4; and is n being 1 to 2; and onium salt; and an organic solvent. The composition is used for cationic polymerization of cationic polymerizable materials including in the formation of a pattern of a photoresist. Also certain novel epoxy-functionalized organosilicons are provided that are sensitive to radiation including E-beam radiation and exhibit resistance to oxygen reactive ion etching.

    28.
    发明专利
    未知

    公开(公告)号:DE69024452D1

    公开(公告)日:1996-02-08

    申请号:DE69024452

    申请日:1990-10-08

    Applicant: IBM

    Abstract: An ultraviolet light sensitive photoinitiator composition that includes at least one anthracene derivative represented by the formula: wherein X is CH=CH2 or -(-CH2-)-n0-(-R) with R being H or wherein each R , R and R individually is selected from the group of alkyl, alkenyl, aryl, wherein each R , R and R individually is selected from the group of alkyl, alkenyl and aryl; wherein m is an integer of 0 to 4, p is an integer of 0 to 4; and is n being 1 to 2; and onium salt; and an organic solvent. The composition is used for cationic polymerization of cationic polymerizable materials including in the formation of a pattern of a photoresist. Also certain novel epoxy-functionalized organosilicons are provided that are sensitive to radiation including E-beam radiation and exhibit resistance to oxygen reactive ion etching.

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