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公开(公告)号：DE102004018483B4
公开(公告)日：2007-11-29
申请号：DE102004018483
申请日：2004-04-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor： BETZ BERND , MAHLER JOACHIM , PAULUS STEFAN , OTREMBA RALF
Abstract: In a device (35) and a method a thin organic or inorganic layer is applied to individual component positions of band-like structures (1). The layer can effect improved or optimized adhesion between a coated surface and a plastic housing compound. Furthermore, the layer can be used as a corrosion prevention layer, an electrical insulating layer or as a dielectric for the coated surfaces. For the selective application of the layer, the device (35) has a jet printer (2) having a plurality of electronically controllable jet heads (4-7). The jet printer (2) coats the band-like structures (1) selectively on the upper side (17) in a first coating position (15) and coats the band-like structures (1) selectively on the underside (18) in a second coating position (16).
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公开(公告)号：DE102005061248A1
公开(公告)日：2007-06-28
申请号：DE102005061248
申请日：2005-12-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor： MAHLER JOACHIM , WOMBACHER RALF , LACHMANN DIETER , BETZ BERND , PAULUS STEFAN , RIEDL EDMUND
IPC: H01L23/16 , C09D5/25 , C23C16/453 , H01L23/08
Abstract: A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.
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公开(公告)号：DE502004003309D1
公开(公告)日：2007-05-03
申请号：DE502004003309
申请日：2004-10-01
Applicant: INFINEON TECHNOLOGIES AG
Inventor： BETZ BERND , DANGELMAIER JOCHEN , PAULUS STEFAN
IPC: H01L21/00 , H01L21/48 , H01L23/495
Abstract: A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.
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公开(公告)号：DE10138659B4
公开(公告)日：2006-04-06
申请号：DE10138659
申请日：2001-08-07
Applicant: INFINEON TECHNOLOGIES AG
Inventor： FISCHER JUERGEN , PUESCHNER FRANK , STAMPKA PETER , PAULUS STEFAN
IPC: H01L21/60 , G06K19/077 , H01L21/48 , H01L23/31 , H01L25/065 , H01Q1/22 , H01Q23/00
Abstract: With this method a track structure (2) is by etching on the upper surface of a metal plate or depositing on a motherboard (6). A semiconductor chip (1) is then attached to the track structure and connected to it by the contact surfaces (3) provided on the tracks, e.g. by bond wiring or flip chip assembly. After encapsulation (5) the rear surface of the motherboard is removed down to the track structure. The track structure already include any required antenna structure.
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公开(公告)号：DE102004018483A1
公开(公告)日：2005-11-17
申请号：DE102004018483
申请日：2004-04-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor： BETZ BERND , MAHLER JOACHIM , PAULUS STEFAN , OTREMBA RALF
Abstract: In a device (35) and a method a thin organic or inorganic layer is applied to individual component positions of band-like structures (1). The layer can effect improved or optimized adhesion between a coated surface and a plastic housing compound. Furthermore, the layer can be used as a corrosion prevention layer, an electrical insulating layer or as a dielectric for the coated surfaces. For the selective application of the layer, the device (35) has a jet printer (2) having a plurality of electronically controllable jet heads (4-7). The jet printer (2) coats the band-like structures (1) selectively on the upper side (17) in a first coating position (15) and coats the band-like structures (1) selectively on the underside (18) in a second coating position (16).
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Patent Agency Ranking
公开(公告)号：DE10348715A1
公开(公告)日：2005-06-16
申请号：DE10348715
申请日：2003-10-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor： DANGELMAIER JOCHEN , PAULUS STEFAN , BETZ BERND
IPC: H01L21/48 , H01L23/495 , H01L23/50 , H01L21/56
Abstract: A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.
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公开(公告)号：DE10224124A1
公开(公告)日：2003-12-18
申请号：DE10224124
申请日：2002-05-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor： POHL JENS , PAULUS STEFAN , DANGELMAIER JOCHEN , IRSIGLER ROLAND , HEDLER HARRY
Abstract: The invention relates to an electronic device and a method for producing it having external area contacts and having a rewiring structure and also having a semiconductor chip, which has contact areas, the external area contacts being electrically connected to the contact areas at least by means of the rewiring structure, and the external area contacts and/or the rewiring structure having chemically or galvanically selectively deposited metal.
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公开(公告)号：DE10146854A1
公开(公告)日：2003-04-30
申请号：DE10146854
申请日：2001-09-24
Applicant: INFINEON TECHNOLOGIES AG
Inventor： PAULUS STEFAN , AUBURGER ALBERT , THEUS HORST , STADLER BERND
Abstract: The electronic component (2) comprises the semiconductor chip (4) on a metal substrate (6), and a housing (12). There is also a screen (124) against HF electromagnetic radiation, as an integral part of the housing, forming at least one part of the housing wall (122).The screen may comprise a metal, or a non-conductor, or non-conductor with metal plating. The metal substrate may contain a wiring structure (8) round the semiconductor chip(s), whose contact faces (43) are conductively coupled by bonding wires (10) to contact pads (81) of wiring structure. Independent claims are included for mfg. method of the electronic component.
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公开(公告)号：DE10109787A1
公开(公告)日：2002-10-02
申请号：DE10109787
申请日：2001-02-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： PETZ MARTIN , STADLER BERND , PAULUS STEFAN , SCHROEDER MARTIN , LOSEHAND REINHARD , SCHAFFER JOSEF-PAUL
IPC: H01L31/0203 , H01L31/0232 , H04N5/225 , G03B17/00 , G03B19/00 , H04N1/00
Abstract: A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.
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公开(公告)号：DE102006061722A1
公开(公告)日：2008-07-03
申请号：DE102006061722
申请日：2006-12-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： DANGELMAIER JOCHEN , PAULUS STEFAN , GHAHREMANI CYRUS , SCHINDLER UWE , LEHNER RUDOLF SIEGFRIED
Abstract: The connection module has a base plate with a contact for electrical contacting of an opto-electronic module and another contact for electronic contacting of a plate. A conductor is provided for electrically connecting both contacts at a surface of the base plate. A casting part is fitted at the base plate over a part of the surface. The base plate and the casting part define an opening for feeding a fiber. Independent claims are also included for the following: (1) a method for producing a connection module, which involves producing a base plate with a contact for electrical contacting of an opto-electronic module (2) a transmission and receiving system for transmission and receiving by a fiber, which has an opto-electronic transmission and receiving module.
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