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    PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING
    21.
    发明专利
    PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING 未知

    公开(公告)号：SG10201407683UA

    公开(公告)日：2014-12-30

    申请号：SG10201407683U

    申请日：2010-12-10

    Applicant: LAM RES CORP

    Inventor： WANG YAXIN ,  LI SHIJIAN ,  REDEKER FRITZ ,  PARKS JOHN ,  KOLICS ARTUR ,  YOON HYUNGSUK ALEXANDER ,  DE FILIPE TAREK SUWWAN ,  KOROLIK MIKHAIL

    Abstract: PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING Methods and systems for handling a substrate through processes including an integrated electro less deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electro less deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate. FIG.4B

    23.
    发明专利
    未知

    公开(公告)号：DE602005002782T2

    公开(公告)日：2008-07-17

    申请号：DE602005002782

    申请日：2005-03-30

    Applicant: LAM RES CORP

    Inventor： WOODS CARL ,  PARKS JOHN ,  SMITH MICHAEL G R

    IPC: H01L21/00 ,  B05D1/00 ,  B08B3/00 ,  B08B3/02 ,  B08B3/04 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306

    Abstract: An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process configuration receiving region that is surrounded by the housing surface. The apparatus also includes a process configuration insert which has an insert surface where the process configuration insert is defined to fit within the process configuration receiving region of the housing such that the insert surface and the housing surface define a proximity face that can be placed proximate to the substrate surface of the substrate.

    PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING
    26.
    发明专利
    PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING 未知

    公开(公告)号：SG181638A1

    公开(公告)日：2012-07-30

    申请号：SG2012042909

    申请日：2010-12-10

    Applicant: LAM RES CORP

    Inventor： WANG YAXIN ,  LI SHIJIAN ,  REDEKER FRITZ ,  PARKS JOHN ,  KOLICS ARTUR ,  YOON HYUNGSUK ALEXANDER ,  DE FILIPE TAREK SUWWAN ,  KOROLIK MIKHAIL

    Abstract: Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate.

    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING
    27.
    发明专利
    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING 未知

    公开(公告)号：SG174750A1

    公开(公告)日：2011-10-28

    申请号：SG2011062171

    申请日：2007-08-28

    Applicant: LAM RES CORP

    Inventor： BOYD JOHN ,  DORDI YEZDI ,  ARUNAGIRI TIRUCHIRAPALLI ,  MOORING BENJAMIN W ,  PARKS JOHN ,  THIE WILLIAM ,  REDEKER FRITZ C ,  HOWALD ARTHUR M ,  SCHOEPP ALAN ,  HEMKER DAVID

    Abstract: OF THE DISCLOSUREA cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions. The embodiments also provide for efficient methods for filling a trench of a substrate.Figure 1

    CHAMBER AND ASSOCIATED METHODS FOR WAFER PROCESSING
    28.
    发明专利
    CHAMBER AND ASSOCIATED METHODS FOR WAFER PROCESSING 未知

    公开(公告)号：MY142891A

    公开(公告)日：2011-01-31

    申请号：MYPI20041174

    申请日：2004-03-31

    Applicant: LAM RES CORP

    Inventor： PARKS JOHN

    IPC: H01L21/306 ,  B08B7/00 ,  H01L21/00 ,  H01L21/683 ,  H01L21/687

    Abstract: A WAFER PROCESSING CHAMBER (1001) IS PROVIDED FOR ALLOWING A FLUID FLOW AND A FLUID PRESSURE WITHIN THE CHAMBER TO BE CONTROLLED IN A VARIABLE MANNER. THE CHAMBER UTILIZES REMOVABLE PLATES (1091, 6011) THAT CAN BE CONFIGURED TO CONTROL THE FLUID FLOW AND THE FLUID PRESSURE IN AN INNER VOLUME (1191) WITHIN THE CHAMBER. ALSO, THE REMOVABLE PLATES CAN BE USED TO SEPARATE THA INNER VOLUME WITHIN THE CHAMBER FROM AN OUTER VOLUME (1131, 6051) WITHIN THE CHAMBER. ADDITIONALLY, A WAFER CLAMPING APPARATUS IS PROVIDED FOR USE IN THE CHAMBER (53). THE WAFER CLAMPING APPARATUS USES A PRESSURE DIFFERENTIAL BETWEEN A TOP SURFACE AND A BOTTOM SURFACE OF THE WATER TO PULL THE WAFER TOWARD SUPPORT STRUCTURE (403) IN CONTACT WITH THE WAFER BOTTOM SURFACE, WHEREBY THE WAFER IS SECURED AND MAINTAINED IN AN IMMOBILE STATE. FURTHERMORE, HIGH-PRESSURECHAMBER CONFIGURATION (2002, 3002) ARE PROVIDED.

    WAFER EDGE WHEEL WITH DRYING FUNCTION
    29.
    发明专利
    WAFER EDGE WHEEL WITH DRYING FUNCTION 未知

    公开(公告)号：SG141469A1

    公开(公告)日：2008-04-28

    申请号：SG2008025264

    申请日：2005-09-16

    Applicant: LAM RES CORP

    Inventor： PARKS JOHN

    Abstract: WAFER EDGE WHEEL WITH DRYING FUNCTION An edge wheel for supporting and rotating a disk-shaped substrate includes a wheel body having a peripheral groove configured to support an edge of a substrate and at least one radial channel extending into said wheel body from said peripheral groove. An edge wheel dryer and a method for processing a disk-shaped substrate are also described.

    30.
    发明专利
    未知

    公开(公告)号：DE602005002782D1

    公开(公告)日：2007-11-22

    申请号：DE602005002782

    申请日：2005-03-30

    Applicant: LAM RES CORP

    Inventor： WOODS CARL ,  PARKS JOHN ,  SMITH MICHAEL G R

    IPC: H01L21/00 ,  B05D1/00 ,  B08B3/00 ,  B08B3/02 ,  B08B3/04 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306

    Abstract: An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process configuration receiving region that is surrounded by the housing surface. The apparatus also includes a process configuration insert which has an insert surface where the process configuration insert is defined to fit within the process configuration receiving region of the housing such that the insert surface and the housing surface define a proximity face that can be placed proximate to the substrate surface of the substrate.

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