Abstract:
PURPOSE: A friction stir welding apparatus and method for controlling the maximum temperature and cooling speed of a junction part are provided to control the phase transition of welded materials by stopping the operation of a cooler and operating a resistance wire to control the cooling speed of the welded materials after welding. CONSTITUTION: A friction stir welding apparatus comprises a tool(10), a backing plate(30), a contact plate(32), and a cooler(38). The tool is inserted to a junction part between welded materials(20,22) and implements friction stir welding on the welded materials. The backing plate supports the welded material. The contact plate is inserted to the backing plate. The cooler is inserted to the backing plate.
Abstract:
본발명은마찰교반접합장치및 방법에관한것이다. 본발명에서는제 1부재및 제 2부재가테이블에고정된상태에서테이블의회전축에대해기울어진상태로툴을배치하여초기성형위치를조정한다. 그리고, 툴을회전시켜제 1부재및 제 2부재의접합부에삽입한후에, 테이블을회전시킨다. 다음으로, 제 1부재및 제 2부재의접합시작점에덧댐부재를고정시킨다. 그리고, 툴이접합시작점까지접합부를접합한후에, 덧댐부재에핀홀을형성하게된다. 이와같은본 발명에의하면, 접합재료, 조건등에따라툴의각도를조절하는것이용이한효과가있다. 또한, 부재에핀홀에의한손상이가지않고, 핀홀을제거하기위한용접, 절삭등의공정이삭제되므로전체공정이간소화되는효과가있다.
Abstract:
PURPOSE: A friction stir welding machine and a friction stir welding method are provided to easily adjust the angle of a tool inclinedly installed in a table. CONSTITUTION: A friction stir welding machine comprises a table(10), a first member(20), a second member(24), and a tool(30). The first and second members are fixed to the table. The tool is rotatably installed to be inclined to the rotary shaft of the table. The tool is inserted into a contact part between the first and second members and welds the contact part.
Abstract:
PURPOSE: A method for manufacturing a high-strength alloy hollow sphere is provided to regulate the density of the hollow sphere according to the sintering temperature. CONSTITUTION: A method for manufacturing a high-strength alloy hollow sphere comprises the steps of: obtaining an oxidation mixture by mixing copper oxide powder 50~95 weight% and nickel oxide powder 5~50 weight%, producing a slurry by mixing the oxidation mixture 50~80 weight% with solvent 20~50 weight%, additionally mixing polyacrylamide less than 10 weight% based on the total weight of the slurry, obtaining Cu-Ni oxide by coating and drying the slurry on a polymer ball and evaporating the solvent, and reducing the Cu-Ni oxide in the hydrogen atmosphere.
Abstract:
본 발명은 고강도 경량 소재(light material)에 사용되는 금속 중공구(hollow sphere)의 제조방법에 관한 것으로서, 보다 상세하게는 금속 산화물을 소결법을 이용하여 환원시켜 고강도 경량 특성을 지니는 발포금속 제조를 위한 금속 중공구(hollow sphere)의 제조방법에 관한 것이다. 본 발명에 따른 금속 중공구 제조 방법은 제조 공정을 단순화 및 개선함으로써 생산성 향상 및 생산 비용이 절감되고, 제조 시 사용되는 용매 선택에 제한이 적고, 표면 조도가 개선된 금속 중공구의 제조가 가능하다. 금속 중공구, 소결법, 발포 금속, 경량 재료
Abstract:
A flexible conductive polyimide substrate with a fine wiring and a method for manufacturing the same is provided to manufacture a higher value-add flexible conductive polyimide by using an electroless planting and additive method before electroplating. A photosensitive film(14) is adhered to a polyimide(10), and the photosensitive film is developed with exposure and a circuit is patterned by using a photolithography. The surface of selected patterned polyimide patterned is selectively modified, and a metal seed layer(16) is formed on the surface modified polyimide by using an electroless plating. A copper layer is formed on the metal seed layer by using the electroplating, and the photosensitive film is eliminated, and the flexible conductive polyimide substrate is washed.
Abstract:
Provided are a method for manufacturing a metal mask and a metal mask produced thereby using multi-layered photoresist film, which has excellent accuracy and minute pitch when compared to a metal mask produced by conventional process. The method for manufacturing a metal mask comprises the steps of: applying a multi-layered photoresist film onto a conductive substrate(S200,S210); exposing and developing the multi-layered photoresist film sequently via a photolithography process to perform a patterning(S220,S230); forming a metal layer via electroforming(S240); and separating the metal layer from the conductive substrate. The method further comprises the step of removing contaminants from a surface of the conductive substrate prior to the step of applying a multi-layered photoresist film onto a conductive substrate.