公开(公告)号：KR101021552B1

公开(公告)日：2011-03-16

申请号：KR1020090089666

申请日：2009-09-22

Applicant: 삼성전기주식회사

Inventor： 봉강욱 ,  김한 ,  한미자

IPC: H05K1/02 ,  H05K9/00 ,  H05K3/46

CPC classification number: H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627

Abstract: PURPOSE: A printed circuit board for reducing EMI noise is provided to insert an electromagnetic band gap structure into an edge, thereby preventing noise in the board. CONSTITUTION: The first area(100) comprises a ground layer and a power layer. The second area(200) prevents EMI noise emitted through a side of the first area. The second conductive plate(220) is overlapped with the first conductive plate. A through via(250) connects the first and second conductive plates. The first area and the second area are made of at least four layers. A connection line(260) electrically connects the first conductive plate with a ground layer.

Abstract translation: 目的：提供一种用于降低EMI噪声的印刷电路板，用于将电磁带隙结构插入边缘，从而防止电路板中的噪声。 构成：第一区域（100）包括接地层和功率层。 第二区域（200）防止通过第一区域的一侧发射的EMI噪声。 第二导电板（220）与第一导电板重叠。 通孔（250）连接第一和第二导电板。 第一区域和第二区域由至少四层制成。 连接线（260）将第一导电板与接地层电连接。

公开(公告)号：KR1020100060825A

公开(公告)日：2010-06-07

申请号：KR1020080119584

申请日：2008-11-28

Applicant: 삼성전기주식회사

Inventor： 구자부 ,  한미자 ,  김한

IPC: H05K1/02

CPC classification number: H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

Abstract: PURPOSE: A band gap structure and a circuit board are provided to shield a conductive noise without a decoupling capacitor or bypass capacitor by arranging an electromagnet band gap structure inside the circuit board. CONSTITUTION: An electromagnetic band gap structure comprises a dielectric layer(420), a plurality of conductive plates(430), a via(440) and a conductive wire(450). The plurality of conductive plates is positioned on the different plane from the dielectric layer. The via is formed to pass through the dielectric layer. One end of the via is connected to each conductive plate. The conductive wire connects the other end of the vias to electrically connect the plurality of conductive plates.

Abstract translation: 目的：提供带隙结构和电路板，通过在电路板内布置电磁带带隙结构来屏蔽导电噪声，而不需要去耦电容或旁路电容。 构成：电磁带隙结构包括电介质层（420），多个导电板（430），通孔（440）和导线（450）。 多个导电板位于与电介质层不同的平面上。 形成通孔以通过电介质层。 通孔的一端连接到每个导电板。 导线连接通孔的另一端以电连接多个导电板。

公开(公告)号：KR100867150B1

公开(公告)日：2008-11-06

申请号：KR1020070097722

申请日：2007-09-28

Applicant: 삼성전기주식회사

Inventor： 김한 ,  유제광 ,  한미자 ,  박대현

IPC: H05K1/16

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: A printed circuit board with an embed chip capacitor and a method for embedding the chip capacitor are provided to shield the noise of a specific frequency by using the series connection structure of a via and the chip capacitor as an EBG(Electromagnetic Band Gap) structure. A printed circuit board includes a first conductor layer(310), a second conductor layer(320), a capacitor(340), and a via. A second conductor layer is separately positioned on the first conductor layer. A capacitor is positioned between the first conductor layer and the second conductor layer. The second electrode is connected to the second conductor layer. The via connects the first electrode of the chip capacitor and the first conductor layer. The chip capacitor is embedded in the printed circuit board.

Abstract translation: 提供具有嵌入式芯片电容器的印刷电路板和嵌入片式电容器的方法，通过使用通孔和片式电容器的串联连接结构作为EBG（电磁带隙）结构来屏蔽特定频率的噪声。 印刷电路板包括第一导体层（310），第二导体层（320），电容器（340）和通路。 第二导体层分别位于第一导体层上。 电容器位于第一导体层和第二导体层之间。 第二电极连接到第二导体层。 通孔连接片式电容器的第一电极和第一导体层。 芯片电容器嵌入印刷电路板。

公开(公告)号：KR100851065B1

公开(公告)日：2008-08-12

申请号：KR1020070041993

申请日：2007-04-30

Applicant: 삼성전기주식회사

Inventor： 박대현 ,  김한 ,  한미자 ,  구자부

IPC: H05K1/02

CPC classification number: H05K1/0236 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T428/12465

Abstract: An electromagnetic band gap structure and a printed circuit board are provided to prevent a mixed signal in an electronic device having an RF circuit and a digital circuit on the same substrate. An electromagnetic band gap structure includes first to third metal layers(210-1,210-2,210-3), first to third dielectric layers(220a,220b,220c), a metal plate(330), and first and second vias(340,360). The first dielectric layer is formed on the first metal layer. The second metal layer is formed on the first dielectric layer and has a hole(350). The second dielectric layer is formed on the second metal layer. The metal plate is formed on the second dielectric layer. The first via connects the first metal layer and the metal plate through the hole. The third dielectric layer is formed on the metal plate and the second dielectric layer. The third metal layer is formed on the third dielectric layer. The second via connects the metal layer and the third metal layer.

Abstract translation: 提供电磁带隙结构和印刷电路板以防止具有RF电路和数字电路的电子设备中的混合信号在同一基板上。 电磁带隙结构包括第一至第三金属层（210-1,210-2,210-3），第一至第三电介质层（220a，220b，220c），金属板（330）以及第一和第二通孔（340,360）。 第一介电层形成在第一金属层上。 第二金属层形成在第一介电层上并具有孔（350）。 第二介电层形成在第二金属层上。 金属板形成在第二电介质层上。 第一通孔通过孔连接第一金属层和金属板。 第三电介质层形成在金属板和第二电介质层上。 第三金属层形成在第三介电层上。 第二通孔连接金属层和第三金属层。

公开(公告)号：KR100850759B1

公开(公告)日：2008-08-06

申请号：KR1020070056601

申请日：2007-06-11

Applicant: 삼성전기주식회사

Inventor： 정찬엽 ,  김한 ,  한미자 ,  김근호 ,  양덕진

IPC: H05K1/02

CPC classification number: H05K1/0236 ,  H05K1/0201 ,  H05K1/115

Abstract: A printed circuit board and a manufacturing method thereof are provided to discharge heat by interposing an electromagnetic band gap structure having a heat sink between an analog circuit and a digital circuit. A printed circuit board(200) includes a first heat sink(210), a first dielectric layer(220), a second heat sink(230), a via(235), a second dielectric layer(240), and a metal layer(250). The first dielectric layer is formed on the first heat sink. The second heat sink is patterned with unit patterns repeatedly arranged on the second heat sink and is formed on the first dielectric layer. The via electrically connects the first and second heat sinks through the first dielectric layer. The second dielectric layer is formed on the second heat sink. The metal layer is patterned and is formed on the second dielectric layer.

Abstract translation: 提供印刷电路板及其制造方法，通过在模拟电路和数字电路之间插入具有散热器的电磁带隙结构来放电。 印刷电路板（200）包括第一散热器（210），第一介电层（220），第二散热器（230），通孔（235），第二电介质层（240）和金属层 （250）。 第一电介质层形成在第一散热器上。 第二散热器被图案化，重复地布置在第二散热器上并且形成在第一介电层上。 通孔电连接第一和第二散热器穿过第一介电层。 第二介电层形成在第二散热器上。 金属层被图案化并形成在第二介电层上。

公开(公告)号：KR100843388B1

公开(公告)日：2008-07-03

申请号：KR1020060083583

申请日：2006-08-31

Applicant: 삼성전기주식회사

Inventor： 김한 ,  이양제 ,  오상진 ,  한미자

IPC: H01R12/57 ,  H05K1/02

CPC classification number: H01R13/2407 ,  H01R12/58 ,  H05K3/365 ,  H05K2201/10295

Abstract: 본 발명은 접속부를 구비한 회로기판을 개시한다.
본 발명의 접속부를 구비한 회로기판은, 회로기판의 일측에 형성되는 단자홀을 갖는 단자부 및 상기 단자홀에 일단이 삽입되고 타단은 외측으로 돌출 연장되면서 수회 굽힘되어 탄성 변형되는 접점부를 형성하여 다른 회로기판의 패드부와 전기적으로 접점되는 커넥터핀으로 구성된다.
상기에서와 같이 구성된 접속부를 구비한 회로기판에 의하면, 회로기판에 단자홀을 형성하고 이에 커넥터핀을 삽입시키는 간소한 구조를 통해 기판과 기판을 전기적으로 연결할 수 있게 되므로 양호한 신호전달 특성을 보장하므로 이를 채용한 전자기기의 신뢰성을 높일 수 있으며 아울러 생산원가의 절감을 도모할 수 있는 이점을 제공한다. 특히, 기판과 기판 사이의 간격이 커넥터핀의 접점부 돌출 높이에 불과하므로 종전에 비해 그 두께가 대폭적으로 감소됨에 따라 이를 채용한 전자기기에 대한 설계의 자유도를 한층 높일 수 있는 산업상 유용한 효과가 있다.
회로기판, 커넥터, 핀, 단자부

公开(公告)号：KR1020080009967A

公开(公告)日：2008-01-30

申请号：KR1020060069811

申请日：2006-07-25

Applicant: 삼성전기주식회사

Inventor： 한미자 ,  박대현 ,  김한

IPC: C25D17/06

CPC classification number: C25D17/06 ,  H05K3/022

Abstract: A jig for plating a PCB is provided to compensate dispersion of the PCB size by allowing the PCB to be elastically extended. A jig for plating a PCB(10) comprises horizontal frames(11,13) and vertical frames(15,17), and an elastic member(30). The horizontal frames are aligned at predetermined distance from each other. The vertical frames are vertically connected at two ends of the horizontal frame. One end of an elastic member is hung to a standard hole of the PCB and the other end of the elastic member is connected with the horizontal frame or the vertical frame. The elastic member is a coil spring of which one end is forming a hook-shaped hanging piece and being inserted to the standard hole of the PCB.

Abstract translation: 提供用于电镀PCB的夹具，以通过允许PCB弹性伸长来补偿PCB尺寸的分散。 用于电镀PCB（10）的夹具包括水平框架（11,13）和垂直框架（15,17）和弹性构件（30）。 水平框架彼此以预定距离对齐。 垂直框架在水平框架的两端垂直连接。 弹性构件的一端悬挂在PCB的标准孔上，弹性构件的另一端与水平框架或垂直框架连接。 弹性构件是螺旋弹簧，其一端形成钩形悬挂件并插入到PCB的标准孔中。