公开(公告)号：EP2870599A4

公开(公告)日：2016-03-30

申请号：EP13812480

申请日：2013-06-27

Applicant: BASF SE

Inventor： REICHARDT ROBERT ,  LI YUZHUO ,  LAUTER MICHAEL

IPC: C09G1/02 ,  H01L21/321

CPC classification number: C09G1/02 ,  H01L21/3212

Abstract: A chemical mechanical polishing (CMP) composition (Q) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a non-ionic surfactant, (C) an aromatic compound comprising at least one acid group (Y), or a salt thereof, and (M) an aqueous medium.

公开(公告)号：EP2870212A4

公开(公告)日：2016-03-30

申请号：EP13812726

申请日：2013-06-21

Applicant: BASF SE

Inventor： REICHARDT ROBERT ,  LAUTER MICHAEL ,  CHIU WEI LAN WILLIAM ,  LI YUZHUO

IPC: C09G1/02 ,  H01L21/321

CPC classification number: C09G1/02 ,  H01L21/3212

Abstract: A chemical mechanical polishing (CMP) composition (Q) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a non-ionic surfactant, (C) a carbonate or hydrogen carbonate salt, (D) an alcohol, and (M) an aqueous medium.

公开(公告)号：EP2614121A4

公开(公告)日：2016-03-09

申请号：EP11823139

申请日：2011-09-06

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE

IPC: C09G1/02 ,  C08L33/24 ,  C09G1/04 ,  C09G1/18 ,  C09K3/14 ,  H01L21/3105

CPC classification number: C09K13/00 ,  C08L33/24 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

Abstract: An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical devices.

公开(公告)号：EP2614122A4

公开(公告)日：2014-01-15

申请号：EP11823140

申请日：2011-09-06

Applicant: BASF SE

Inventor： NOLLER BASTIAN ,  FRANZ DIANA ,  LI YUZHUO ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE ,  VENKATARAMAN SHYAM SUNDAR

IPC: C09G1/02 ,  H01L21/3105

CPC classification number: C09K13/00 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

公开(公告)号：EP3019569A4

公开(公告)日：2017-05-03

申请号：EP14823844

申请日：2014-07-01

Applicant: BASF SE

Inventor： REICHARDT ROBERT ,  KALLER MARTIN ,  LAUTER MICHAEL ,  LI YUZHUO ,  KLIPP ANDREAS

IPC: C09G1/02 ,  C09G1/00 ,  C09G1/04 ,  H01L21/02 ,  H01L21/321

CPC classification number: C09K3/1463 ,  C09G1/02 ,  H01L21/3212

Abstract: A chemical-mechanical polishing (CMP) composition is provided comprising (A) one or more compounds selected from the group of benzotriazole derivatives which act as corrosion inhibitors and (B) inorganic particles, organic particles, or a composite or mixture thereof. The invention also relates to the use of certain compounds selected from the group of benzotriazole derivatives as corrosion inhibitors, especially for increasing the selectivity of a chemical mechanical polishing (CMP) composition for the removal of tantalum or tantalum nitride from a substrate for the manufacture of a semiconductor device in the presence of copper on said substrate.

Abstract translation: 提供化学机械抛光（CMP）组合物，其包含（A）一种或多种选自苯并三唑衍生物（用作腐蚀抑制剂）和（B）无机颗粒，有机颗粒或其复合物或混合物的化合物。 本发明还涉及选自苯并三唑衍生物的某些化合物作为腐蚀抑制剂的用途，尤其是用于提高化学机械抛光（CMP）组合物用于从基底去除钽或氮化钽的选择性，用于制造 在所述衬底上存在铜的情况下的半导体器件。

公开(公告)号：EP2812911A4

公开(公告)日：2015-08-12

申请号：EP13746024

申请日：2013-01-25

Applicant: BASF SE ,  BASF SCHWEIZ AG

Inventor： LI YUZHUO ,  NOLLER BASTIAN MARTEN ,  LAUTER MICHAEL ,  LANGE ROLAND

IPC: H01L21/304 ,  C09G1/00 ,  H01L21/302 ,  H01L21/461 ,  H01L21/463

CPC classification number: C09G1/02 ,  C09G1/18 ,  C09K3/1463 ,  H01L21/30625 ,  H01L21/31053

公开(公告)号：EP2499210A4

公开(公告)日：2015-04-29

申请号：EP10829604

申请日：2010-11-10

Applicant: BASF SE

Inventor： LAUTER MICHAEL ,  RAMAN VIJAY IMMANUEL ,  LI YUZHUO ,  VENKATARAMAN SHYAM SUNDAR ,  SHEN DANIEL KWO-HUNG

IPC: C09G1/02 ,  C09G1/16 ,  C09K3/14

CPC classification number: C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/31053

公开(公告)号：EP2742103A4

公开(公告)日：2015-03-25

申请号：EP12819882

申请日：2012-07-30

Applicant: BASF SE

Inventor： NOLLER BASTIAN MARTEN ,  DRESCHER BETTINA ,  GILLOT CHRISTOPHE ,  LI YUZHUO ,  GAO NING

IPC: H01L21/306 ,  C09G1/02 ,  C09K3/14

CPC classification number: H01L21/30625 ,  C09G1/02 ,  C09K3/1463 ,  C23F3/00 ,  H01L21/02024 ,  H01L21/31053 ,  H01L21/3212

公开(公告)号：EP2753670A4

公开(公告)日：2015-02-25

申请号：EP12830462

申请日：2012-09-04

Applicant: BASF SE

Inventor： LI YUZHUO ,  LAUTER MICHAEL ,  LANGE ROLAND ,  GAO NING

IPC: C09G1/02

CPC classification number: C09G1/02 ,  C09G1/00 ,  C09K13/00 ,  C23F1/00 ,  H01L21/30625 ,  H01L21/31053

公开(公告)号：EP2625241A4

公开(公告)日：2014-04-23

申请号：EP11830275

申请日：2011-10-04

Applicant: BASF SE

Inventor： SCHMITT CHRISTINE ,  KARPOV ANDREY ,  ROSOWSKI FRANK ,  BRANDS MARIO ,  LI YUZHUO

IPC: C09G1/02 ,  H01L21/306 ,  H01L21/321

CPC classification number: H01L21/30625 ,  C09G1/02 ,  H01L21/3212