Semiconducting component with increased breakdown voltage has active structure and edge structure, compensation field strength in edge structure lower than that in active area

    公开(公告)号:DE10061310A1

    公开(公告)日:2002-06-27

    申请号:DE10061310

    申请日:2000-12-08

    Abstract: The device has an active structure and an edge structure with edge compensation areas and floating edge compensation areas with edge compensation zones. Certain areas are fully depleted of charge carriers before reaching breakdown voltage. The compensation field strength in the edge structure is lower than that in an active area. The device has an active structure (AS) with a blocking pn-junction in a semiconducting substrate, a first zone (6) of a first conductor type connected to a first electrode (S) and bounding on a zone of opposite type forming the junction blocking zone (7) also connected to the first electrode, a second zone (1) of first type connected to a second electrode (D) and compensation areas (3') nested between the first and second zones. An edge structure (RS) has a number of first edge compensation areas (2) of the first type and a number of floating edge compensation areas (3) of the second type with edge compensation zones (4) and nested with the first areas so that the second areas are fully depleted of charge carriers before reaching the breakdown voltage. The compensation field strength in the edge structure is lower than that in an active area. Independent claims are also included for the following: a method of manufacturing a semiconducting component.

    48.
    发明专利
    未知

    公开(公告)号:DE102007041885B4

    公开(公告)日:2009-12-24

    申请号:DE102007041885

    申请日:2007-09-04

    Abstract: A method for dividing a semiconductor substrate involves providing a semiconductor substrate. At least one separating trench is produced at a front side of the semiconductor substrate. A layer is produced at least at the bottom of the at least one separating trench. The semiconductor substrate is thinned at a rear side of the semiconductor substrate at least as far as the layer at the bottom of the at least one separating trench. The layer is severed in order to divide the semiconductor substrate into individual pieces.

    50.
    发明专利
    未知

    公开(公告)号:AT334480T

    公开(公告)日:2006-08-15

    申请号:AT99929017

    申请日:1999-04-22

    Abstract: A semiconductor component has a semiconductor body comprising a blocking pn junction, a source zone of a first conductivity type connected to a first electrode and bordering on a zone forming the blocking pn junction of a second conductivity type complementary to the first conductivity type, and a drain zone of the first conductivity type connected to a second electrode. The side of the zone of the second conductivity type facing the drain zone forms a first surface, and in the region between the first surface and a second surface located between the first surface and the drain zone, comprises areas of the first and second conductivity type nested in one another. The second surface is positioned at a distance from the drain zone such that the areas of the first and second conductivity type nested in each other do not reach the drain zone.

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