公开(公告)号：WO2012046640A1

公开(公告)日：2012-04-12

申请号：PCT/JP2011/072510

申请日：2011-09-30

Applicant: 日本特殊陶業株式会社 ,  吉田美隆 ,  山本宏明

Inventor： 吉田美隆 ,  山本宏明

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: 　分割時や該分割前において分割溝付近からの破損や欠けや割れが生じにくく、高い信頼性を有する多数個取り配線基板、およびその製造方法を提供する。　複数のセラミック層ｓ１，ｓ２を積層してなり、表面２および裏面３を有し、平面視で長方形（矩形）を呈し且つキャビティ５を有する複数の配線基板部分４を縦横に配列した製品領域４ａと、該製品領域４ａの周囲に沿って位置する耳部６と、配線基板部分４，４間の境界および配線基板部分４と耳部６との境界に沿って表面２および裏面３の少なくとも一方に形成した分割溝８，９と、を備える多数個取り配線基板１であって、分割溝８，９は、長手方向と直交する断面において、該分割溝８，９の最深部８ｂが円弧形で、且つ該最深部８ｂと溝入口８ｃとの間に中間部８ａを有し、最深部８ｂの幅ｗ２は、溝入口８ｃの幅ｗ３よりも大きく、中間部８ａの幅ｗ１は、溝入口８ｃの幅ｗ３と同じかこれよりも小さい、多数個取り配線基板１。

Abstract translation: 提供一种多分隔线路板，其在分割时或分割前几乎不会从分隔槽附近破裂，破碎或开裂，并且具有高可靠性及其制造方法。 多空腔布线板（1）包括：通过层叠具有前表面（2）和后表面（3）的多个陶瓷层（s1），（s2）构成的产品区域（4a） 具有布置成矩阵状的多个布线板部分（4），平面图中每个布线板部分（4）具有矩形（长方形）形状和空腔（5）; 位于产品区域（4a）周边的耳部（6）; 以及分别形成在所述前表面（2）和所述后表面（3）中的至少一个上的划分槽（8），（9），沿着所述布线板部件（4），（4） 接线板部件（4）和耳部（6）。 在垂直于分隔槽（8），（9）的纵向的截面中，分隔槽（8），（9）的最深部分（8b）为弧形，分隔槽（8） （9）在最深部分（8b）和凹槽入口（8c）之间具有中间部分（8a），最深部分（8b）的宽度（w2）大于凹槽入口宽度（w3） 8c），并且中间部分（8a）的宽度（w1）与凹槽入口（8c）的宽度（w3）相同或更小。

公开(公告)号：WO2007007861A1

公开(公告)日：2007-01-18

申请号：PCT/JP2006/314015

申请日：2006-07-07

Applicant: イビデン株式会社 ,  高橋 通昌 ,  三門 幸信 ,  中村 武信 ,  青山 雅一

Inventor： 高橋 通昌 ,  三門 幸信 ,  中村 武信 ,  青山 雅一

IPC: H05K3/46

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: 絶縁層と導体層とが交互に積層され、導体層同士が絶縁層に設けたバイアホールを介して電気的に接続されてなる多層プリント配線板は、そのバイアホールは、少なくともその一部において、絶縁層の厚み方向に対してほぼ垂直な方向に膨らみを有して形成され、落下した際の衝撃力等の外部応力を抑制して、絶縁基板が反りにくくして、導体回路のクラックや、断線等を防止し、実装基板の信頼性や耐落下性の低下を軽減することができる。

Abstract translation: 在多层印刷布线板中，绝缘层和导体层交替层叠，并且导体层通过布置在绝缘层上的通孔电连接。 通孔形成为在与绝缘层的厚度方向大致垂直的方向上至少其一部分具有膨胀。 外部应力（例如下落时的冲击力）受到抑制以使绝缘基板不易翘曲，并且防止导体电路的断裂等。 因此，可以降低安装基板的可靠性和耐跌落冲击强度的劣化。

公开(公告)号：WO99018633A1

公开(公告)日：1999-04-15

申请号：PCT/US1998/021222

申请日：1998-10-07

IPC: H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  H01R9/09

CPC classification number: H05K3/005 ,  H05K1/095 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction (10) includes at least one microvia (12) disposed in a base substrate (14) and includes a deep imprinted cup shaped in the top surface thereof (24). A conductor material is disposed within the recess (26), and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion (31) helps to complete an electrically conductive path through the substrate.

Abstract translation: 布线板结构（10）包括设置在基底基板（14）中的至少一个微孔（12），并且包括形成在其顶表面（24）中的深刻印刷杯。 导体材料设置在凹部（26）内，并且具有设置在其底部的部分。 设置在与导体材料底部（31）相对的基板的底表面处的导体有助于完成穿过基板的导电路径。

公开(公告)号：US20190207334A1

公开(公告)日：2019-07-04

申请号：US16125895

申请日：2018-09-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-wan KOH ,  Seok-heon LEE ,  Seok-jae Han

IPC: H01R12/71 ,  H05K1/11 ,  H01R12/70 ,  H01R13/24

CPC classification number: H01R12/714 ,  H01R12/7005 ,  H01R13/2442 ,  H05K1/11 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/10159

Abstract: A memory card includes a substrate, first row terminals and second row terminals. The substrate has a first pair of side edges extending in a first direction and a second pair of side edges extending in a second direction perpendicular to the first direction. The first row terminals are arranged adjacent to an insertion side edge of the substrate, the first row terminals including a first power terminal, the insertion side edge being one of the first pair of side edges. The second row terminals are arranged further from the insertion side edge than the first row terminals, the second row terminals including a second power terminal. At least one terminal among the first and second row terminals includes a recess area in an exposed surface of the at least one terminal.

公开(公告)号：US09937528B2

公开(公告)日：2018-04-10

申请号：US15095264

申请日：2016-04-11

Applicant: Texas Instruments Incorporated

Inventor： Peter B. Johnson ,  Ira Oaktree Wygant

IPC: H01B13/00 ,  B06B1/02 ,  H02N1/00 ,  H04R19/00 ,  B81C1/00 ,  B81B7/00

CPC classification number: B06B1/0292 ,  B06B2201/76 ,  B81B7/007 ,  B81B2203/0127 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/036 ,  H02N1/006 ,  H04R19/005 ,  H05K2201/09845 ,  H05K2201/09863

Abstract: A Capacitive Micromachined Ultrasonic Transducer (CMUT) device including at least one CMUT element with at least one CMUT cell is formed. A patterned dielectric layer thereon including a thick and a thin dielectric region is formed on a top side of a single crystal material substrate. A second substrate is bonded to the thick dielectric region to provide at least one sealed micro-electro-mechanical system (MEMS) cavity. The second substrate is thinned to reduce a thickness of said second substrate to provide a membrane layer. The membrane layer is etched to form a movable membrane over said MEMS cavity and to remove said membrane layer over said top side substrate contact area. The thin dielectric region is removed from over said top side substrate contact area. A top side metal layer is formed including a trace portion coupling said top side substrate contact area to said movable membrane. From a bottom side surface of said first substrate, etching is performed to open an isolation trench around said single crystal material to form a through-substrate via (TSV) plug of said single crystal material at least under said top side substrate contact area which is electrically isolated from surrounding regions of said single crystal material.

公开(公告)号：US20160150642A1

公开(公告)日：2016-05-26

申请号：US14779232

申请日：2014-03-26

Applicant: KYOCERA CORPORATION

Inventor： Satoshi KAJITA ,  Mitsuhiro HAGIHARA ,  Yuuhei MATSUMOTO

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.

Abstract translation: 布线板包括：无机绝缘层，其具有形成为在其厚度方向上穿透无机绝缘层的通孔; 设置在无机绝缘层上的导电层; 以及通孔导体，其粘附到通孔的内壁并与导电层连接。 无机绝缘层包括：第一部分，其包括彼此部分连接的多个无机绝缘颗粒，以及位于无机绝缘颗粒之间的间隙中的树脂部分和介于第一部分和通孔导体之间的第二部分， 包括彼此部分连接的多个无机绝缘颗粒和由位于无机绝缘颗粒之间的间隙中的通孔导体的一部分组成的导电部分。

公开(公告)号：US20140216794A1

公开(公告)日：2014-08-07

申请号：US14169314

申请日：2014-01-31

Applicant: IBIDEN CO., LTD.

Inventor： Toshiaki HIBINO

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/429 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/108 ,  H05K2203/1476

Abstract: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions.

Abstract translation: 印刷布线板包括：绝缘基板，具有穿过该基板形成的贯通孔，形成在基板的第一面上的第一导体图案，形成在基板的与第一面相反一侧的第二面上的第二导电图案;以及 形成在所述基板的所述贯通孔中的通孔导体，使得所述导体将所述基板的第一表面上的所述第一导电图案与所述基板的所述第二表面上的所述第二导电图案连接。 所述贯通孔具有在所述基板的第一面上开口的第一开口部，在所述基板的第二面上开口的第二开口部，以及连接所述第一开口部和所述第二开口部的第三开口部， 其直径大于第一和第二开口部分的最小直径。

公开(公告)号：US07415761B2

公开(公告)日：2008-08-26

申请号：US10356464

申请日：2003-02-03

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07312400B2

公开(公告)日：2007-12-25

申请号：US10505094

申请日：2003-02-21

Applicant: Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

Inventor： Shoji Ito ,  Osamu Nakao ,  Reiji Higuchi ,  Masahiro Okamoto

IPC: H05K1/00

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

Abstract: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.

Abstract translation: 多层布线基板组件包括：绝缘基板部件（绝缘树脂层111）。 以电极图案的形式形成在所述绝缘基板部件111的一个表面上的导电层112; 形成在所述绝缘基板部件111的另一个表面上的粘合层113; 以及导电树脂组合物115，其填充有穿过所述绝缘基板部件111，所述粘合剂层和所述导电层的通孔，以形成层间互连。 通孔114的导电层部分114b的孔径小于绝缘树脂层部分和粘合剂层部分114a的孔径，以通过以下方式建立导电树脂组合物115和导电层112之间的电连接： 导电层112的稀有表面112a。

公开(公告)号：US07188412B2

公开(公告)日：2007-03-13

申请号：US10662368

申请日：2003-09-16

Applicant: Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

Inventor： Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

IPC: H01K3/10

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Abstract translation: 含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。 当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。 同时，通孔周围的树脂膜突出到通孔中。 因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。 因此，可以防止由于板的变形引起的应力集中。