LIGHT-EMITTING DIODE
    57.
    发明申请
    LIGHT-EMITTING DIODE 审中-公开
    发光二极管

    公开(公告)号:US20170005227A1

    公开(公告)日:2017-01-05

    申请号:US15266249

    申请日:2016-09-15

    Abstract: A light-emitting diode, comprises an active layer for emitting a light ray; an upper semiconductor stack on the active layer, wherein the upper semiconductor stack comprises a window layer; a reflector; and a lower semiconductor stack between the active layer and the reflector; wherein the thickness of the window layer is small than or equal to 3 μm, and the thickness of the lower semiconductor stack is small than or equal to 1 μm.

    Abstract translation: 发光二极管包括用于发射光线的有源层; 在所述有源层上的上半导体堆叠,其中所述上半导体堆叠包括窗口层; 反射器 以及在所述有源层和所述反射器之间的下半导体堆叠; 其中所述窗口层的厚度小于或等于3μm,并且所述下半导体叠层的厚度小于或等于1μm。

    Semiconductor light-emitting device
    58.
    发明授权
    Semiconductor light-emitting device 有权
    半导体发光装置

    公开(公告)号:US09337394B2

    公开(公告)日:2016-05-10

    申请号:US14554488

    申请日:2014-11-26

    CPC classification number: H01L33/382 H01L33/08 H01L33/22 H01L33/46

    Abstract: A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.

    Abstract translation: 半导体发光器件包括半导体叠层,其包括侧面,第一表面和与第一表面相对的第二表面,其中半导体堆叠还包括从第一表面延伸到第二表面的导电通孔; 形成在所述第二表面上的透明导电层; 第一焊盘部分和第二焊盘部分,形成在第一表面上并电连接到半导体堆叠; 以及形成在第一焊盘部分和半导体堆叠之间以及在第二焊盘部分和半导体堆叠之间的绝缘层。

    Method of forming light-emitting diode
    59.
    发明授权
    Method of forming light-emitting diode 有权
    形成发光二极管的方法

    公开(公告)号:US09048345B2

    公开(公告)日:2015-06-02

    申请号:US14196708

    申请日:2014-03-04

    CPC classification number: H01L33/005 H01L21/02436 H01L21/02664 H01L33/0079

    Abstract: A method of forming a light-emitting diode includes: providing a substrate having one or more first openings passing through the substrate; forming a sacrificial layer on the substrate; forming an epitaxial layer on the sacrificial layer; connecting a supporting substrate with the epitaxial layer; and separating the substrate from the epitaxial layer by selectively etching the sacrificial layer.

    Abstract translation: 形成发光二极管的方法包括:提供具有穿过基板的一个或多个第一开口的基板; 在所述基板上形成牺牲层; 在牺牲层上形成外延层; 将支撑衬底与所述外延层连接; 以及通过选择性蚀刻牺牲层将衬底与外延层分离。

Patent Agency Ranking