公开(公告)号：EP1624740A3

公开(公告)日：2008-07-16

申请号：EP05013421.2

申请日：2005-06-22

Applicant: ENDRESS + HAUSER WETZER GmbH + Co. KG

Inventor： Härle, Thomas ,  Konrad, Michael ,  Wührle, Markus

IPC: H05K9/00

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K2201/10068 ,  H05K2201/10727

Abstract: Die Erfindung bezieht sich auf eine Vorrichtung zur Aufnahme und zur Befestigung eines elektronischen Bauelements (9) auf einer Leiterplatte (2). Das Bauelement ist in einem Gehäuse (1) mit einer Bodenfläche (3), mit einer auf die Form der Bodenfläche (3) angepassten Anzahl von Seitenflächen (4) und mit einer entsprechenden Deckfläche (8), die aus einem elektrisch leitenden Material gefertigt ist, angeordnet. Desweiteren ist zumindest ein elektrisch leitendes Verbindungselement (7) vorgesehen, das so ausgebildet und/oder angeordnet ist, dass die Abdeckfläche (5) über das Verbindungselement (7) auf einem Bezugspotential der Leiterplatte (2) liegt.

公开(公告)号：EP0736242A4

公开(公告)日：1998-09-23

申请号：EP95930944

申请日：1995-08-25

Applicant: BAIER & BAIER INC DOING BUSINE

Inventor： BREE DANIEL R ,  LEM RAFAEL

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K1/0243 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613

Abstract: The method of surface mounting radio frequency components includes using at least one radio frequency component (300, 810, 850) having a pair of input/output contact points (330, 332, 830, 832, 870, 872) or areas at corners on the underside of the component, wherein each of the input/output contact points or areas abuts the adjoining edges of the corners. The component is positioned relative to a pair of traces (846, 856, 858, 860) on a circuit for enabling an electrical connection thereto in a range of angular dispositions. By using a single non-customized component, adjacent components can be configured with a signal flow path of a range between about 0 degree (a chain configuration) and about 180 degrees (a 'U' turn).

公开(公告)号：EP0736242A1

公开(公告)日：1996-10-09

申请号：EP95930944.0

申请日：1995-08-25

Applicant: BAIER & BAIER, INC. doing business as LARK ENGINEERING

Inventor： BREE, Daniel, R. ,  LEM, Rafael

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/0243 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613

Abstract: The method of surface mounting radio frequency components includes using at least one radio frequency component (300, 810, 850) having a pair of input/output contact points (330, 332, 830, 832, 870, 872) or areas at corners on the underside of the component, wherein each of the input/output contact points or areas abuts the adjoining edges of the corners. The component is positioned relative to a pair of traces (846, 856, 858, 860) on a circuit for enabling an electrical connection thereto in a range of angular dispositions. By using a single non-customized component, adjacent components can be configured with a signal flow path of a range between about 0 degree (a chain configuration) and about 180 degrees (a 'U' turn).

公开(公告)号：EP1949492A1

公开(公告)日：2008-07-30

申请号：EP06837393.5

申请日：2006-11-13

Applicant: CTS Corporation

Inventor： KNECHT, Thomas, A. ,  JACOBSON, Robert ,  REESER, Glen

IPC: H01P7/04 ,  H03B5/18 ,  H05K1/00 ,  H03L7/06

CPC classification number: H03B5/1805 ,  H03B5/1221 ,  H03B5/1231 ,  H03B5/1243 ,  H03L7/06 ,  H03L7/099 ,  H03L7/16 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10689

Abstract: A synthesizer module/oscillator assembly includes a voltage controlled oscillator with a coaxial resonator. In one embodiment, the module measures 20.3mm x 14.8mm x 3.9mm and the coaxial resonator is positioned on the circuit board of the module between a phase locked loop integrated circuit and a main section of the voltage controlled oscillator. The phase locked loop circuit includes a loop filter and is adapted to receive the frequency signal generated by the voltage controlled oscillator and generate an adjusted frequency signal.

公开(公告)号：EP1598931A1

公开(公告)日：2005-11-23

申请号：EP05253115.9

申请日：2005-05-19

Applicant: Nihon Dempa Kogyo Co., Ltd.

Inventor： Ito, Manabu ,  Fukudu, Minoru ,  Kudo, Tetuo ,  Uchida, Takeshi

IPC: H03B5/36 ,  H03B5/04 ,  H03L1/04

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

Abstract: The present invention is one where, in a lead wire led-out type crystal oscillator of constant temperature type for high stability, comprising: a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant; an oscillating element that constitutes an oscillating circuit together with the crystal resonator; a temperature control element that constitutes a temperature control circuit for controlling the temperature of the crystal resonator; and a circuit board for mounting the heat supply body, the oscillating element, and the temperature control element, and through which lead wires of the crystal resonator are passed through for mounting, the heat supply body comprises: a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator; and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract translation: 本发明是一种在高稳定性的恒温型铅丝引出型晶体振荡器中，其特征在于，包括：向多个引线引出的晶体谐振器供热的供热体， 保持温度恒定; 与晶体谐振器一起构成振荡电路的振荡元件; 构成用于控制晶体谐振器的温度的温度控制电路的温度控制元件; 以及用于安装供热体，振荡元件和温度控制元件的电路板，并且晶体谐振器的引线通过该电路板通过以进行安装，所述供热体包括：导热板， 用于引线的孔，并安装在电路板上，并且面向并直接热连接到晶体谐振器; 以及与导热板相邻地安装在电路基板上并与导热板热接合的用于加热的片状电阻器。

公开(公告)号：EP1428418A1

公开(公告)日：2004-06-16

申请号：EP02772850.0

申请日：2002-09-12

Applicant: Nec Schott Components Corporation

Inventor： FUKUSHIMA, Daisuke,NEC SCHOTT COMPONENTS CORP.

IPC: H05K3/34

CPC classification number: H03H9/1021 ,  H01L23/04 ,  H01L23/045 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material filling in an internal space defined by the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface on the internal space side of the metal lead. The internal space is held at an air-tight atmosphere. The metal base has a lower surface positioned on the same plane as a lower surface of the metal lead or the insulating material, the same plane forming a plane to be attached to a mounting board.

公开(公告)号：EP1065915A2

公开(公告)日：2001-01-03

申请号：EP00113282.8

申请日：2000-06-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Suemasa, Hajime ,  Maruyama, Takashi

IPC: H05K3/40 ,  H05K3/34

CPC classification number: H05K3/3442 ,  H01P1/2053 ,  H01P1/2136 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09736 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2203/0353 ,  Y02P70/613

Abstract: There is disclosed an electronic part comprising: a printed circuit board (1') including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit board (1'); a terminal electrode (2) disposed on the second major surface of the printed circuit board (1') and including a major surface opposed to the second major surface of the printed circuit board (1'); a soldering-resistant film (3) disposed on the second major surface of the printed circuit board (1') and including a major surface opposed to the second major surface of the printed circuit board (1'); wherein the distance between the major surface of the terminal electrode (2) and the second major surface of the printed circuit board (1') is substantially equal to or larger than the distance between the major surface of the soldering-resistant film (3) in the vicinity of the terminal electrode (2) and the second major surface of the printed circuit board (1').

Abstract translation: 有盘在电子部件，其包括游离缺失：一个印刷电路板（1“），其包括第一主表面和第二主表面; 设置在印刷电路板（1“）的所述第一主表面上的电路元件; 设置在印刷电路板（1“）的所述第二主表面上的端子电极（2），并且包括相对的印刷电路板（1的第二主表面的主表面”）; 设置在印刷电路板（1“）的所述第二主表面上的阻焊膜 - （3），并且包括相对的印刷电路板（1的第二主表面的主表面”）; worin端子电极（2）和所述印刷电路板的第二主表面的主表面之间的距离（1“）基本上大于阻焊成膜的主表面之间的距离等于或大于（3） 在端子电极（2）和所述印刷电路板（1“）的所述第二主表面的附近。

公开(公告)号：EP0437976B1

公开(公告)日：1995-08-30

申请号：EP90314303.0

申请日：1990-12-27

Applicant: NEC CORPORATION

Inventor： Norimatsu, Hidehiko, c/o NEC Corporation

IPC: H05K1/18 ,  H01L23/64

CPC classification number: H05K1/025 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174

公开(公告)号：WO2013156309A1

公开(公告)日：2013-10-24

申请号：PCT/EP2013/057042

申请日：2013-04-03

Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： BALLANDRAS, Sylvain ,  FRANCOIS, Bruno

IPC: G01K11/26 ,  H05K1/02

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2201/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Dispositif électrique et procédé de fabrication de celui-ci Le dispositif électrique (2, 202) comprend un premier composant électrique (4) et un deuxième composant électrique (6) reliés entre eux par l'intermédiaire d'un moyen de connexion électrique (26) ayant une plaque support (24) électriquement isolante, et un joint de soudure (22) déposé sur la plaque support (24). Le joint de soudure (22) possède une température de fusion (Tf) nettement inférieure à une température ambiante (Ta) de fonctionnement à laquelle est prévu d'être soumis au moins un des deux composants électriques et le moyen de connexion électrique (26). Le dispositif électrique (2) comprend un ciment (28) qui recouvre dans sa totalité le joint de soudure (22) exposé, le matériau du ciment (28) étant choisi pour maintenir son adhésion et son étanchéité vis-à-vis du joint de soudure (22) lorsque la température ambiante (Ta) de fonctionnement est appliquée. Le dispositif électrique (2, 202) comprend un premier composant électrique (4) et un deuxième composant électrique (6) reliés entre eux au travers d'un moyen de connexion électrique (26) ayant une plaque support (24) électriquement isolante, et un joint de soudure (22) déposé sur la plaque support (24). Le joint de soudure (22) possède une température de fusion (Tf) nettement inférieure à une température ambiante (Ta) de fonctionnement à laquelle est prévu d'être soumis au moins un des deux composants électriques et le moyen de connexion électrique (26). Le dispositif électrique (2) comprend un ciment (28) qui recouvre dans sa totalité le joint de soudure (22) exposé, le matériau du ciment (28) étant choisi pour maintenir son adhésion et son étanchéité vis-à-vis du joint de soudure (22) lorsque la température ambiante (Ta) de fonctionnement est appliquée.

Abstract translation: 一种电气装置及其制造方法。 电气设备（2,202）包括通过具有电绝缘支撑板（24）的电连接装置（26）彼此连接的第一电气部件（4）和第二电气部件（6），以及焊接接头 （22）沉积在所述支撑板（24）上。 焊接接头（22）的熔融温度（Tf）明显低于期望两个电气部件和电气连接装置（26）中的至少一个受到的环境工作温度（Ta）。 电气设备（2）包括完全覆盖暴露的焊接接头（22）的水泥（28），当水泥材料（28）被选择为在焊接接头（22）上保持与焊接接头（22）的粘合和密封时 施加环境工作温度（Ta）。 电气设备（2,202）包括通过具有电绝缘支撑板（24）的电连接装置（26）彼此连接的第一电气部件（4）和第二电气部件（6），以及焊接接头 （22）沉积在所述支撑板（24）上。 焊接接头（22）的熔融温度（Tf）明显低于期望两个电气部件和电气连接装置（26）中的至少一个受到的环境工作温度（Ta）。 电气设备（2）包括完全覆盖暴露的焊接接头（22）的水泥（28），当水泥材料（28）被选择为在焊接接头（22）上保持与焊接接头（22）的粘合和密封时 施加环境工作温度（Ta）。

公开(公告)号：WO2009029209A1

公开(公告)日：2009-03-05

申请号：PCT/US2008/009983

申请日：2008-08-22

Applicant: CTS CORPORATION

Inventor： MCCRACKEN, Jeffrey ,  KNECHT, Thomas

IPC: H03L1/04 ,  H03L1/02 ,  H03B5/04

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including a ball grid array substrate seated on a circuit board, a heater and a temperature sensor mounted on the ball grid array substrate, and a crystal package mounted to the ball grid array substrate and overlying at least the heater. A layer of thermally conductive epoxy or adhesive material couples the heater to the crystal package. Stabilizer posts, which are made of an insulative adhesive or epoxy material, are formed between the ball grid array substrate and the circuit board for stabilizing and relieving the stress on the ball grid array substrate. A lid is seated on the circuit board and covers and defines an oven for the ball grid array substrate.

Abstract translation: 包括安置在电路板上的球栅阵列基板，安装在球栅阵列基板上的加热器和温度传感器的加热振荡器封装以及安装到球栅阵列基板并至少覆盖加热器的晶体封装。 一层导热环氧树脂或粘合剂材料将加热器与晶体封装相结合。 在球栅阵列基板和电路板之间形成由绝缘粘合剂或环氧材料制成的稳定柱，用于稳定和减轻球栅阵列基板上的应力。 盖子安置在电路板上并覆盖并限定了用于球栅阵列基板的烘箱。