公开(公告)号：DE102004045947A1

公开(公告)日：2006-01-19

申请号：DE102004045947

申请日：2004-09-22

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  BOGNER GEORG ,  GROETSCH STEFAN ,  WANNINGER MARIO

IPC: G02B7/00 ,  H01L33/58 ,  H01L33/60

Abstract: The assembly has a light-emitting chip (1) with a radiation decoupling surface (2), via which the greater part of the electromagnetic radiation that is generated in the chip emerges in a primary emission direction. The chip is placed on a heat sink (4). A housing (5) laterally surrounds the chip and a reflective lens (6) is situated downstream of the surface (2) in the primary emission direction. An independent claim is also included for a utilization of the light emitting assembly in equipment such as camera mobile phone, digital camera or video camera.

公开(公告)号：DE10347737A1

公开(公告)日：2005-05-04

申请号：DE10347737

申请日：2003-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WINTER MATTHIAS ,  GRUBER STEFAN ,  BOGNER GEORG

IPC: H01L33/62 ,  H01S5/02 ,  H01S5/323 ,  H01L33/00

Abstract: Optoelectronic structural element with a semiconductor body (SCB) (1), including a substrate (2) and a layer system (3) deposited on the substrate, where the SCB is fixed to a carrier (4) with the main surface opposite the substrate by a solder bond (7) and the carrier (4) is metallized with silver-free metal on the side opposite the SCB.

公开(公告)号：DE10319782A1

公开(公告)日：2004-11-25

申请号：DE10319782

申请日：2003-04-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WINTER MATTHIAS ,  GRUBER STEFAN ,  SCHMID JOSEF ,  BOGNER GEORG

IPC: H01L23/13 ,  H01L23/498 ,  H01L33/62 ,  H01S5/022 ,  H01L23/04

Abstract: A chip carrier element (1) with a chip mounting surface (2) comprises a recessed region (3) adjacent to the surface to receive the chip fixing unit. An independent claim is also included for a component housing with a chip carrier element as above.

公开(公告)号：DE10245892A1

公开(公告)日：2004-05-13

申请号：DE10245892

申请日：2002-09-30

Applicant: SIEMENS AG ,  OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  KROMOTIS PATRICK ,  MAYER RALF ,  NOLL HEINRICH

IPC: G02F1/13357 ,  H01L25/075 ,  H01L33/60 ,  H05B44/00 ,  G09F9/00 ,  G09F9/35

Abstract: An illumination device for backlighting an image reproduction device containing light valves, the illumination device including a plurality of luminous spots arranged in grid format on a flat thermally conductive carrier. Each luminous spot having a plurality of light emitting diodes electrically insulated from one another, and a submount exhibiting good thermal conductivity and being connected to the carrier.

公开(公告)号：DE10229067A1

公开(公告)日：2004-01-22

申请号：DE10229067

申请日：2002-06-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： RUHNAU MARKUS ,  KROMOTIS PATRICK ,  BOGNER GEORG ,  BRAUNE BERT

IPC: H01L23/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/60 ,  H01L33/00

Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

公开(公告)号：DE10140831A1

公开(公告)日：2003-03-13

申请号：DE10140831

申请日：2001-08-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00 ,  H01L23/495

Abstract: Designed to go between a chip connection area and a soldered connecting strip (2a,2b), a flexible ductile element (3a) runs on one and the same surface level of a conductor frame (1) as the soldered connecting strip and enables the soldered connecting strip to move in relation to the chip connection area in a parallel direction to a mounting surface for a component casing (8). A radiation-emitting chip (16) like an LED semiconductor chip or a semiconductor LASER is fastened, soldered on or glued on with an electrically conductive bonding agent on an area that is formed by a chip connection part (14) and is part of a radiation emission window (12). Independent claims are also included for a casing for a radiation-emitting surface-mounted component, for a surface-mounted radiation-emitting component and for a structure with multiple radiation-emitting components.

公开(公告)号：DE10117889A1

公开(公告)日：2002-10-24

申请号：DE10117889

申请日：2001-04-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  HIEGLER MICHAEL ,  WAITL GUENTHER

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/00 ,  H01L23/495 ,  H01S5/022

Abstract: Leadframe (2) comprises a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b). A support part is provided which is coupled with a thermal connecting part (4). Independent claims are also included for (a) a radiation-emitting component having a radiation-emitting chip and the leadframe; and (b) a process for the production of the semiconductor component.

公开(公告)号：DE10027206A1

公开(公告)日：2001-12-13

申请号：DE10027206

申请日：2000-05-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEHN KLAUS ,  BOGNER GEORG ,  BRUNNER HERBERT

IPC: C08L63/00 ,  C08K5/00 ,  C08K5/13 ,  C08K5/17 ,  C08K5/3435 ,  H01L23/29 ,  H01L23/31 ,  H01L33/00 ,  H01L33/56 ,  C08L63/02 ,  C08L63/04 ,  H05K3/28

Abstract: The invention relates to an epoxy-resin system, in particular for cast-resin applications. Said system comprises a component A, based on a glycidyl ether or glycidyl ester and containing epoxide and a component B, containing an anhydride as the hardener, a sterically hindered amine being added to component A as a stabiliser to prevent ageing of the moulding material. Light-emitting semiconductor components which are cast using said system exhibit an improved resistance to ageing, in particular with regard to the long-term luminosity factor. The epoxy-resin system can also be used for potting and moulding compounds and in mixtures with acrylates for all applications, in particular external applications.

公开(公告)号：WO2006034668A3

公开(公告)日：2006-11-02

申请号：PCT/DE2005001582

申请日：2005-09-09

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  PATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH ,  BOGNER GEORG ,  ENGL MORITZ ,  HOFMANN MARKUS ,  REILL JOACHIM ,  REINERS THOMAS

Inventor： BOGNER GEORG ,  ENGL MORITZ ,  HOFMANN MARKUS ,  REILL JOACHIM ,  REINERS THOMAS

IPC: H01L25/16

CPC classification number: H01L25/167 ,  H01L25/0753 ,  H01L2924/0002 ,  H05B33/0854 ,  Y02B20/341 ,  H01L2924/00

Abstract: The invention relates to an LED array having at least two LED chips (2). Said LED array is characterized in that it contains a temperature sensor (3) and in that the operating current of the LED chips (2) is controlled depending on the temperature detected by the temperature sensor (3). The inventive array allows for a long operating time of the LED chips (2) with a high operating current without running the risk of thermal overload.

Abstract translation: 在具有至少两个LED芯片（2），温度传感器（3）被包含，并且意图（2）依赖于由所述温度传感器（3）检测到的温度来调节LED芯片的工作电流的LED阵列。 这允许LED芯片（2），其特征在于，一热过载的风险被降低的一个长的工作时间高的工作电流。

公开(公告)号：WO2006002603A2

公开(公告)日：2006-01-12

申请号：PCT/DE2005000904

申请日：2005-05-18

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  GROETSCH STEFAN ,  WAITL GUENTER ,  WANNINGER MARIO

Inventor： BOGNER GEORG ,  GROETSCH STEFAN ,  WAITL GUENTER ,  WANNINGER MARIO

IPC: H01L33/58 ,  H01L33/60 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a light-emitting diode assembly comprising at least one light-emitting chip (1) with a radiation disengaging surface (2), via which the greater part of the electromagnetic radiation (13) that is generated in said chip emerges in a primary emission direction, a housing (5), which laterally surrounds the light-emitting chip (1) and a reflective lens (6), which is situated downstream of the disengaging surface (2) in the primary emission direction. The light-emitting diode assembly is particularly suitable for use in equipment such as camera mobile phones, digital cameras or video cameras.

Abstract translation: 它是指定一个发光二极管阵列，包括（1）具有一个辐射输出的至少一个发光二极管芯片（2），通过该多数在LED芯片中产生的电磁辐射（13）在主发射方向射出，壳体（5）（LED芯片 包围1）侧，并布置在所述主辐射方向的辐射（2）的下游的反射光学系统（6）。 LED布置是特别适合于在设备如照相手机，数码相机或视频相机。