公开(公告)号：WO1997041713A1

公开(公告)日：1997-11-06

申请号：PCT/US1997007191

申请日：1997-05-01

Applicant: ALLIEDSIGNAL INC.

Inventor： ALLIEDSIGNAL INC. ,  FATCHERIC, John, F. ,  CARBIN, Derek, C.

IPC: H05K03/02

CPC classification number: H05K3/025 ,  H05K3/108 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0317 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/10477 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/0726

Abstract: A new method of forming circuit lines on a substrate by applying conductive metal(s) using copper foil as a carrier. The copper foil is etched away, leaving the conductive metals embedded in the surface of the substrate. A photoresist is used to expose trenches which define the desired circuit and copper is applied onto the exposed conductive metals. The method is particularly suited to manufacturing the outer layers of multi-layer circuit boards.

Abstract translation: 一种通过使用铜箔作为载体施加导电金属在基板上形成电路线的新方法。 蚀刻铜箔，留下导电金属嵌入基片的表面。 使用光致抗蚀剂来暴露限定所需电路的沟槽，并且将铜施加到暴露的导电金属上。 该方法特别适用于制造多层电路板的外层。

公开(公告)号：EP2007931B1

公开(公告)日：2018-10-31

申请号：EP06848028.4

申请日：2006-12-21

Applicant: MacDermid, Incorporated

Inventor： WOJTASZEK, Mark ,  WATKOWSKI, James ,  LARSON, Gary, B. ,  KUKANSKIS, Peter

IPC: C23C18/32

CPC classification number: H05K3/181 ,  C08J7/12 ,  C08J7/123 ,  C08J2379/08 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  H05K1/0346 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/097

Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

公开(公告)号：EP2120520B1

公开(公告)日：2012-03-07

申请号：EP09000433.4

申请日：2009-01-14

Applicant: LG Electronics Inc.

Inventor： Yum, Jungsup ,  Ko, Dongki

IPC: H05K3/18 ,  H05K3/42 ,  H05K1/14 ,  H05K1/00

CPC classification number: H05K3/181 ,  H05K1/0393 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/09827 ,  Y10T428/12375 ,  Y10T428/12396 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12771 ,  Y10T428/12847 ,  Y10T428/12889 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944

公开(公告)号：EP1667506B1

公开(公告)日：2012-02-01

申请号：EP06003716.5

申请日：1999-09-14

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

公开(公告)号：EP1919266A2

公开(公告)日：2008-05-07

申请号：EP08150255.1

申请日：1999-09-14

Applicant: Ibiden Co., Ltd.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An electroless plating solution comprises an aqueous solution containing 0.025 to 0.25 mol/L of a basic compound, 0.03 to 0.15 mol/L of a reducing agent, 0.02 to 0.06 mol/L of copper ion and 0.05 to 0.3 mol/L of tartaric acid or a salt thereof. Another electroless plating solution comprises an aqueous solution containing a basic compound, a reducing agent, copper ion, tartaric acid or a salt thereof and at least one metal ion species selected from the group consisting of nickel ion, cobalt ion and iron ion. The electroless plating solution is used in an electroless plating process performing electroless copper plating, more specifically in a process for manufacturing a printed circuit board which comprises immersing a resin insulating substrate board in the electroless plating solution. The electroless plated film has a stress of 0 to +10 kg/mm 2 when formed on a roughened surface of the resin insulating substrate board.

Abstract translation: 无电镀液包含含有0.025〜0.25mol / L碱性化合物，0.03〜0.15mol / L还原剂，0.02〜0.06mol / L铜离子和0.05〜0.3mol / L酒石酸的水溶液 或其盐。 另一种化学镀溶液包含含有碱性化合物，还原剂，铜离子，酒石酸或其盐的水溶液和至少一种选自镍离子，钴离子和铁离子的金属离子。 化学镀溶液用于执行无电镀铜的化学镀处理，更具体地，在印刷电路板的制造方法中，包括将树脂绝缘基板浸入化学镀溶液中。 当形成在树脂绝缘基板的粗糙表面上时，无电镀膜具有0至+ 10kg / mm 2的应力。

公开(公告)号：EP1360720A4

公开(公告)日：2007-01-10

申请号：EP02702009

申请日：2002-01-15

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  FRITZ DENNIS ,  DURSO FRANK ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H01L23/48 ,  B44C1/22 ,  C23F1/00

CPC classification number: H01C17/24 ,  H01C17/242 ,  H05K1/167 ,  H05K3/027 ,  H05K3/064 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K2203/171

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

公开(公告)号：EP1667506A1

公开(公告)日：2006-06-07

申请号：EP06003716.5

申请日：1999-09-14

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An electroless plating solution comprises an aqueous solution containing 0.025 to 0.25 mol/L of a basic compound, 0.03 to 0.15 mol/L of a reducing agent, 0.02 to 0.06 mol/L of copper ion and 0.05 to 0.3 mol/L of tartaric acid or a salt thereof. Another electroless plating solution comprises an aqueous solution containing a basic compound, a reducing agent, copper ion, tartaric acid or a salt thereof and at least one metal ion species selected from the group consisting of nickel ion, cobalt ion and iron ion. The electroless plating solution is used in an electroless plating process performing electroless copper plating, more specifically in a process for manufacturing a printed circuit board which comprises immersing a resin insulating substrate board in the electroless plating solution. The electroless plated film has a stress of 0 to +10 kg/mm 2 when formed on a roughened surface of the resin insulating substrate board.

Abstract translation: 无电镀液包含含有0.025〜0.25mol / L碱性化合物，0.03〜0.15mol / L还原剂，0.02〜0.06mol / L铜离子和0.05〜0.3mol / L酒石酸的水溶液 或其盐。 另一种化学镀溶液包含含有碱性化合物，还原剂，铜离子，酒石酸或其盐的水溶液和至少一种选自镍离子，钴离子和铁离子的金属离子。 化学镀溶液用于执行无电镀铜的化学镀处理，更具体地，在印刷电路板的制造方法中，包括将树脂绝缘基板浸入化学镀溶液中。 当形成在树脂绝缘基板的粗糙表面上时，无电镀膜具有0至+ 10kg / mm 2的应力。

公开(公告)号：EP1117283A4

公开(公告)日：2004-06-23

申请号：EP99943326

申请日：1999-09-14

Applicant: IBIDEN CO LTD

Inventor： EN HONCHIN ,  NAKAI TOHRU ,  OKI TAKEO ,  HIROSE NAOHIRO ,  NODA KOUTA

IPC: C23C18/34 ,  C25D5/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a printed wiring board having a high-density wiring and a highly-reliable connection between conductor layers even if the annealing process is omitted because a conductor circuit made of an electroplating layer excellent in crystallinity and uniform electrodepositability and formed on a base sheet and a via hole are provided. The method comprising forming an interlayer resin insulating layer on a conductor wiring forming board, making an opening for making a via hole in the interlayer resin insulating layer, forming an electroless plating layer (1008) on the interlayer resin insulating layer, applying a resist film (1003) to the layer (1008), forming an electroplating film thereon, removing the resist film, and removing the electroless plating layer by etching so as to form a conductor wiring and a via hole characterized in that the electroless plating layer (1008) serves as a cathode, the plating metal serves as an anode, and electroplating is performed intermittently while maintaining the voltage between the anode and cathode at a constant value.

Abstract translation: 即使省略退火处理，由于由结晶性和电沉积性均匀性优异的电镀层构成的导体电路形成于基体上，因此即使省略退火处理，也能够提供具有高密度布线和导体层间的可靠性高的连接的印刷布线板的制造方法 薄片和通孔。 该方法包括：在导体布线形成板上形成层间树脂绝缘层，在层间树脂绝缘层上形成用于形成通孔的开口，在层间树脂绝缘层上形成化学镀层（1008），将抗蚀剂膜 （1008），在其上形成电镀膜，去除抗蚀剂膜，并且通过蚀刻除去化学镀层，从而形成导体布线和通孔，其特征在于，无电镀层（1008） 用作阴极，电镀金属用作阳极，并且在将阳极和阴极之间的电压保持在恒定值的同时间歇地执行电镀。

公开(公告)号：EP1295337A1

公开(公告)日：2003-03-26

申请号：EP01914736.2

申请日：2001-03-07

Applicant: MacDermid, Incorporated

Inventor： KUKANSKIS, Peter ,  LARSON, Gary, B. ,  BENGSTON, Jon ,  SCHWEIKHER, William

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/20 ,  H01L21/44 ,  H01L21/302 ,  H01L21/461 ,  H01L21/31 ,  H01L21/469

CPC classification number: H01C17/18 ,  H01C17/065 ,  H01L24/05 ,  H01L2924/12042 ,  H05K1/167 ,  H05K3/064 ,  H05K3/184 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1453 ,  H01L2924/00

Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization of the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

公开(公告)号：EP1117283A1

公开(公告)日：2001-07-18

申请号：EP99943326.1

申请日：1999-09-14

Applicant: IBIDEN CO., LTD.

Inventor： EN, Honchin ,  NAKAI, Tohru ,  OKI, Takeo ,  HIROSE, Naohiro ,  NODA, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a printed wiring board having a high-density wiring and a highly-reliable connection between conductor layers even if the annealing process is omitted because a conductor circuit made of an electroplating layer excellent in crystallinity and uniform electrodepositability and formed on a base sheet and a via hole are provided. The method comprising forming an interlayer resin insulating layer on a conductor wiring forming board, making an opening for making a via hole in the interlayer resion insulating layer, forming an electroless plating layer (1008) on the interlayer resin insulating layer, applying a resist film (1003) to the layer (1008), forming an electroplating film thereon, removing the resist film, and removing the electroless plating layer by etching so as to form a conductor wiring and a vai hole characterzed in that the electroless plating layer (1008) serves as a cathode, the plating metal serves as an anode, and electroplating is performed intermittently while maintaining the voltage between the anode and cathode at a constant value.

Abstract translation: 即使省略退火处理，由于由结晶性和电沉积性均匀性优异的电镀层构成的导体电路形成于基体上，因此即使省略退火处理，也能够提供具有高密度布线和导体层间的可靠性高的连接的印刷布线板的制造方法 薄片和通孔。 该方法包括在导体布线形成板上形成层间树脂绝缘层，在层间树脂绝缘层上形成用于制作通孔的开口，在层间树脂绝缘层上形成化学镀层（1008），将抗蚀剂膜 （1008），在其上形成电镀膜，去除抗蚀剂膜，并且通过蚀刻去除化学镀层以形成导体布线和凹孔，其特征在于，无电镀层（1008） 用作阴极，电镀金属用作阳极，并且在将阳极和阴极之间的电压保持在恒定值的同时间歇地执行电镀。