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公开(公告)号:DE102009020127A1
公开(公告)日:2010-09-30
申请号:DE102009020127
申请日:2009-05-06
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: SABATHIL MATTHIAS , KOCUR SIMON , GROETSCH STEFAN
IPC: H01L25/075 , H01L33/00
Abstract: Es wird eine Leuchtdiode angegeben, mit - einem ersten Halbleiterkörper (10), der zumindest einen aktiven Bereich (11) umfasst, der elektrisch kontaktiert ist, wobei im Betrieb der Leuchtdiode im akti) eines ersten Wellenlängenbereichs erzeugt wird, und - einem zweiten Halbleiterkörper (20), der an einer Oberseite (10a) des ersten Halbleiterkörpers (10) am ersten Halbleiterkörper (10) befestigt ist, wobei der zweite Halbleiterkörper (20) einen Re-Emissionsbereich (21) mit einer Mehrfachquantentopfstruktur (213) aufweist und wobei im Betrieb der Leuchtdiode im Re-Emissionsbereich (21) elektromagnetische Strahlung (110) des ersten Wellenlängenbereichs absorbiert und elektromagnetische Strahlung eines zweiten Wellenlängenbereichs (220) reemittiert wird, und - einem Verbindungsmaterial (30), das zwischen erstem (10) und zweitem Halbleiterkörper (20) angeordnet ist, wobei das Verbindungsmaterial (30) den ersten (10) und den zweiten Halbleiterkörper (20) mechanisch miteinander verbindet.
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公开(公告)号:DE102008046762A1
公开(公告)日:2010-03-18
申请号:DE102008046762
申请日:2008-09-11
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN , GUENTHER EWALD KARL MICHAEL , WILM ALEXANDER , HERRMANN SIEGFRIED
IPC: G02B27/18 , G03B21/00 , H01L25/075
Abstract: An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.
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公开(公告)号:DE102008045925A1
公开(公告)日:2010-03-11
申请号:DE102008045925
申请日:2008-09-04
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN , ZEILER THOMAS , ZITZLSPERGER MICHAEL , JAEGER HARALD
IPC: H01L25/075 , H01L23/36 , H01L33/00
Abstract: An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.
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公开(公告)号:DE102008044641A1
公开(公告)日:2009-10-29
申请号:DE102008044641
申请日:2008-08-27
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN
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公开(公告)号:DE102008017580A1
公开(公告)日:2009-10-08
申请号:DE102008017580
申请日:2008-04-07
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN , ZITZLSPERGER MICHAEL , ZEILER THOMAS , WILM ALEXANDER , SORG JOERG
Abstract: The housing arrangement has an active layer, which is suitable to emit electromagnetic radiation, and a housing lower part (1) with a circulation unit (2) for a housing upper part (4). The metallic bearing surface (22) of the circulation unit is connected with the housing upper part. The housing upper part is transparent.
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公开(公告)号:DE102007043183A1
公开(公告)日:2009-04-09
申请号:DE102007043183
申请日:2007-09-11
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN , KIRSCH MARKUS
IPC: H01L25/075 , H01L33/48 , H01S5/022
Abstract: The method involves providing an assembly of a semiconductor body (2) to generate electromagnetic radiation, in an assembly region (3) of a carrier (4). A frame (5) is formed circumstantially at the assembly region on the carrier by a photo-structure. A sealing compound is provided with a diffuser particle and is arranged inside the frame. The frame is removed after the arrangement and/or filling with the sealing compound. A window is made of glass or plastic, where the sealing compound is epoxy resin or silicone resin.
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公开(公告)号:DE102008011254A1
公开(公告)日:2009-04-02
申请号:DE102008011254
申请日:2008-02-27
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN , KUEMMLER VOLKER , MUELLER KLAUS , JAEGER HARALD , RAMIN WOLFGANG , SORG JOERG
Abstract: The method involves providing a screen (103) with openings (105) that are provided at positions at which a recess (104) of a carrier element (101) is to be closed. The recess of the carrier element is filled by the screen through screen printing of a viscous mass (102) e.g. soldering metal. The viscous mass is hardened by heating of the carrier element that is printed with soldering metal, where the viscous mass carries semiconductor components. The carrier element is preferably made of ceramic substrate.
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公开(公告)号:DE102007029391A1
公开(公告)日:2009-01-02
申请号:DE102007029391
申请日:2007-06-26
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN , LINDER NORBERT
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公开(公告)号:DE102007010244A1
公开(公告)日:2008-08-07
申请号:DE102007010244
申请日:2007-03-02
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN , BOGNER GEORG , HAHN BERTHOLD , HAERLE VOLKER , PETERSEN KIRSTIN
IPC: H01L33/50
Abstract: At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.
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公开(公告)号:DE102006046301A1
公开(公告)日:2008-04-03
申请号:DE102006046301
申请日:2006-09-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: GROETSCH STEFAN
Abstract: The optical element (1) has a base body (2), which contains a basic material, and a filling body (3), which contains a filling material (7), where the filling body adheres to the base body. The optical element is provided for the formation of radiation. The basic material contains glass and is different from the filling material, which contains silicon material. The base body has a hollow space, which is filled with filling material, where the form of the filling body is determined by the hollow space. Independent claims are also included for the following: (1) a radiation-emitting component, which has an optical element and a radiation-emitting semiconductor body (2) a method for the production of an optical element involves developing a base body and filling a filling material in the base body.
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