公开(公告)号：US20180077789A1

公开(公告)日：2018-03-15

申请号：US15558940

申请日：2016-04-26

Applicant: CANON KABUSHIKI KAISHA

Inventor： Keita Yamazaki

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/09372 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/10553 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/611

Abstract: A land group with which a terminal group of a semiconductor package has been jointed, a conductor pattern which has been arranged in a mounting area where the semiconductor package was mounted and which has been jointed with a heat radiation plate of the semiconductor package, a conductor pattern at least a part of which has been arranged on the outside of the mounting area, and a conductor pattern which connects the conductor patterns are formed on a printed-wiring board. The land group includes a land adjacent to the conductor pattern and a land which is not adjacent to the conductor pattern. The land is formed in a shape different from that of the land so as to be away from the conductor pattern.

公开(公告)号：US20170318679A1

公开(公告)日：2017-11-02

申请号：US15523472

申请日：2015-10-29

Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA

Inventor： Yoshiki SANTO

IPC: H05K1/18 ,  B25J9/16

CPC classification number: H05K1/181 ,  B25J9/16 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/09372 ,  H05K2201/09436 ,  H05K2201/09445 ,  H05K2201/10212 ,  H05K2201/10545 ,  H05K2201/10704

Abstract: A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other. A plurality of signal input pins are provided to the first edge portion, a plurality of signal output pins are provided to the third edge portion, a plurality of between-element communication input pins are provided to the second edge portion, and a plurality of between-element communication output pins are provided to the fourth edge portion, respectively. A common signal is input to the first and second elements and a communication is performed between the first element and the second element. Loss of control function can be surely prevented while suppressing enlargement of the board and increase of development/production cost.

公开(公告)号：US09648742B2

公开(公告)日：2017-05-09

申请号：US15105723

申请日：2014-10-14

Applicant: Auto-Kabel Management GmbH

Inventor： Wacim Tazarine ,  Simon Betscher ,  Frank Gronwald

IPC: H05K7/10 ,  H05K1/14 ,  H05K1/05 ,  H05K3/36 ,  H05K7/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/28 ,  H01L23/14 ,  C23C14/04 ,  H01L23/367 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/145 ,  C23C14/042 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/056 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K1/181 ,  H05K1/182 ,  H05K3/28 ,  H05K3/282 ,  H05K3/368 ,  H05K2201/09372 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1377 ,  H01L2924/00

Abstract: Circuit having a first printed circuit board and a second printed circuit board. In the circuit, the printed circuit boards spaced apart from one another by means of an air gap are mechanically connected together by at least one power semiconductor.

公开(公告)号：US20170094771A1

公开(公告)日：2017-03-30

申请号：US15272201

申请日：2016-09-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Koji Noguchi

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/09372 ,  H05K2201/10015 ,  H05K2201/10545

Abstract: A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.

公开(公告)号：US20170064821A1

公开(公告)日：2017-03-02

申请号：US14840979

申请日：2015-08-31

Applicant: Kristof Darmawikarta ,  Daniel Sobieski ,  Kyu Oh Lee ,  Sri Ranga Sai Boyapati

Inventor： Kristof Darmawikarta ,  Daniel Sobieski ,  Kyu Oh Lee ,  Sri Ranga Sai Boyapati

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K3/18 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/113 ,  H05K3/0041 ,  H05K3/181 ,  H05K3/188 ,  H05K3/4038 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/09218 ,  H05K2201/09372 ,  H05K2201/095 ,  H05K2201/096 ,  H05K2201/09654 ,  H05K2203/0548

Abstract: Some example forms relate to an electronic package. The electronic package includes a first dielectric layer that includes an electrical trace formed on a surface of the first dielectric layer and a second dielectric layer on the surface of the first dielectric layer. The second dielectric layer includes an opening. The electrical trace is within the opening. The electronic package includes an electrical interconnect that fills the opening and extends above an upper surface of the second dielectric layer such that the electrically interconnect is electrically connected to the electrical trace on the first dielectric layer.

Abstract translation: 一些示例形式涉及电子包装。 电子封装包括第一电介质层，其包括形成在第一电介质层的表面上的电迹线和在第一电介质层的表面上的第二电介质层。 第二电介质层包括开口。 电迹线在开口内。 电子封装包括电互连，其填充开口并且在第二电介质层的上表面上方延伸，使得电互连电连接到第一电介质层上的电迹线。

公开(公告)号：US20150034375A1

公开(公告)日：2015-02-05

申请号：US14520294

申请日：2014-10-21

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： KAI-WEN WU

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/0253 ,  H01R12/53 ,  H01R13/6474 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/111 ,  H05K1/117 ,  H05K3/40 ,  H05K2201/09372 ,  H05K2201/10287 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.

Abstract translation: 电路板组件包括电路板，形成在电路板上的至少一个焊盘和至少一个连接线。 所述至少一个连接线中的每一个包括连接到所述至少一个焊盘中的相应一个焊盘并且具有与相应焊盘相同的电阻值的连接端。

公开(公告)号：WO2017039866A1

公开(公告)日：2017-03-09

申请号：PCT/US2016/043397

申请日：2016-07-21

Applicant: INTEL CORPORATION

Inventor： DARMAWIKARTA, Kristof ,  SOBIESKI, Daniel ,  LEE, Kyu Oh ,  BOYAPATI, Sri Ranga Sai

IPC: H01L23/00 ,  H01L23/532

CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/113 ,  H05K3/0041 ,  H05K3/181 ,  H05K3/188 ,  H05K3/4038 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/09218 ,  H05K2201/09372 ,  H05K2201/095 ,  H05K2201/096 ,  H05K2201/09654 ,  H05K2203/0548

Abstract: Some example forms relate to an electronic package. The electronic package includes a first dielectric layer that includes an electrical trace formed on a surface of the first dielectric layer and a second dielectric layer on the surface of the first dielectric layer. The second dielectric layer includes an opening. The electrical trace is within the opening. The electronic package includes an electrical interconnect that fills the opening and extends above an upper surface of the second dielectric layer such that the electrically interconnect is electrically connected to the electrical trace on the first dielectric layer.

Abstract translation: 一些示例形式涉及电子包装。 电子封装包括第一电介质层，其包括形成在第一电介质层的表面上的电迹线和在第一电介质层的表面上的第二电介质层。 第二电介质层包括开口。 电迹线在开口内。 电子封装包括电互连，其填充开口并且在第二电介质层的上表面上方延伸，使得电互连电连接到第一电介质层上的电迹线。

公开(公告)号：WO2015104072A1

公开(公告)日：2015-07-16

申请号：PCT/EP2014/071994

申请日：2014-10-14

Applicant: AUTO-KABEL MANAGEMENT GMBH ,  TAZARINE, Wacim ,  BETSCHER, Simon ,  GRONWALD, Frank

Inventor： TAZARINE, Wacim ,  BETSCHER, Simon ,  GRONWALD, Frank

IPC: H05K1/02 ,  H05K1/05 ,  H01L23/367 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/145 ,  C23C14/042 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/056 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K1/181 ,  H05K1/182 ,  H05K3/28 ,  H05K3/282 ,  H05K3/368 ,  H05K2201/09372 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1377 ,  H01L2924/00

Abstract: Schaltung mit einer ersten Leiterplatte (2a) und einer zweiten Leiterplatte (2b). Die erste Leiterplatte ist mit einer metallischen Trägerplatte (14) und einer die metallische Trägerplatte auf einer Oberfläche elektrisch isolierenden Isolationsschicht (8) versehen, wobei die Trägerplatte in zumindest einem Anschlussbereich (10a-10d) frei von der Isolationsschicht ist. Die Trägerplatte ist im Anschlussbereich metallisch beschichtet (12) und auf der metallischen Beschichtung des Anschlussbereichs ist ein Kontakt (30a) eines Halbleiters (30) elektrisch kontaktiert. Die zweite Leiterplatte ist mit einer metallischen Trägerplatte (2b), einen die metallische Trägerplatte (24) auf einer Oberfläche elektrisch isolierenden Isolator (16) und einer auf dem Isolator aufgebrachten Leitschicht (18) versehen. Der Isolator, sowie die Leitschicht sind in zumindest einem Kontaktbereich durchbrochen (21) un in dem Kontaktbereich ist zumindest ein metallisches Kontaktpad (20) auf der Trägerplatte derart angeordnet, dass das Kontaktpad umlaufend beabstandet dem Isolator und der Leitschicht ist. Bei der Schaltung sind die Leiterplatten voneinander durch einen Luftspalt (28) beabstandet und durch zumindest einen Leistungshalbleiter (30) mechanisch miteinander verbunden.

Abstract translation: 包括第一电路板（2a）和第二电路板（2b）的电路。 第一印刷电路板设置有一个金属Tr的AUML;承载板（14）和一个金属Tr的AUML;上的表面BEAR承载板设置枝电绝缘的绝缘层（8），其中，所述Tr的AUML;在至少一个连接部分（10A-10D）承载板是自由的 绝缘层是。 载体板在连接区域（12）中金属涂覆并且半导体（30）的触点（30a）电连接在连接区域的金属涂层上。 第二电路板设置有金属支撑板（2b），在表面上使金属支撑板（24）电绝缘的绝缘体（16）以及应用于绝缘体的导电层（18）。 绝缘体和导电层中的至少一个接触区域被穿孔（21）中的接触面积un为在载体BEAR承载板的至少一个金属接触垫（20），被布置为使得周向间隔开的接触焊盘是绝缘体和导电层。 在该电路中，电路板通过气隙（28）彼此隔开并且通过至少一个功率半导体（30）机械互连，

公开(公告)号：WO2013029041A2

公开(公告)日：2013-02-28

申请号：PCT/US2012/052503

申请日：2012-08-27

Applicant: AMPHENOL CORPORATION ,  PANIAGUA, Jose Ricardo

Inventor： PANIAGUA, Jose Ricardo

IPC: G06F17/50

CPC classification number: H05K1/116 ,  G06F17/5081 ,  G06F2217/82 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/0005 ,  H05K3/0047 ,  H05K3/10 ,  H05K3/42 ,  H05K2201/0784 ,  H05K2201/09372 ,  H05K2201/095 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2203/0207 ,  H05K2203/0242 ,  Y10T29/49165

Abstract: A printed circuit board for carrying high frequency signals. Conducting structures of the printed circuit board are shaped within breakout regions to limit impedance discontinuities in the signal paths between vias and conductive traces within the printed circuit board. Values of parameters of traces or anti-pads, for example, may be adjusted to provide a desired impedance. The specific values selected as part of designing a printed circuit board may match the impedance of the breakout region to that of the via. The parameters for which values are selected may include the trace width, thickness, spacing, length over an anti-pad or angle of exit from the breakout region.

Abstract translation: 用于承载高频信号的印刷电路板。 印刷电路板的导电结构在突出区域内成形，以限制印刷电路板内的通孔和导电迹线之间的信号路径中的阻抗不连续性。 痕迹或抗焊盘参数的值可以被调整以提供所需的阻抗。 选择作为设计印刷电路板的一部分的具体值可以将突破区域的阻抗与通孔的阻抗匹配。 选择值的参数可以包括迹线宽度，厚度，间隔，防焊盘上的长度或从断裂区域的出口角度。

公开(公告)号：JP2016021475A

公开(公告)日：2016-02-04

申请号：JP2014144323

申请日：2014-07-14

Applicant: イビデン株式会社

Inventor： 足立 武馬 ,  中村 航 ,  平林 智義

IPC: H05K3/46 ,  H05K3/34 ,  H01L23/12

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L25/105 ,  H05K1/09 ,  H05K1/185 ,  H05K3/4007 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/81 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/09372 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/0723

Abstract: 【課題】POPパッケージを構成する第1の半導体パッケージと第2の半導体パッケージの物性が一致しないことにより熱応力が働いても、高い信頼性を有するPOP基板を製造するための金属ポストを有するプリント配線板を提供する。 【解決手段】プリント配線板は第1回路基板101と第1回路基板101上の金属ポスト77で形成されている。金属ポスト77の高さh1と第1回路基板101の厚みbとの比(h1/b)は、0.1より大きく1.0より小さい。 【選択図】図1

Abstract translation: 要解决的问题：提供一种印刷线路板，其具有用于制造具有高可靠性的POP基板的金属柱，即使由于构成POP的第一半导体封装和第二半导体封装的物理性质不匹配而施加热应力 封装。解决方案：印刷电路板由第一电路板101上的第一电路板101和金属柱77形成。金属柱77的高度h1和厚度b的比率（h1 / b） 第一电路板101大于0.1且小于1.0。选择图：图1