Abstract:
A method for forming a conductive polymer pattern is provided to improve the adhesive strength to an oxide layer and to enhance the precision of patterning. A method for forming a conductive polymer pattern comprises the steps of forming a self-assembly monolayer(30) on a substrate(10); patterning the self-assembly monolayer; forming a catalyst layer(60) on the self-assembly monolayer; and forming a conductive polymer layer on the self-assembly monolayer. Preferably an insulation layer(20) is formed between the substrate and the self-assembly monolayer. Preferably the conductive polymer layer is made of a polythiophene-based material or a polyaniline-based material.
Abstract:
본 발명은 마이크로 컨택 프린팅 방법에 의해 기판의 일부영역을 소수성 영역으로 표면개질을 실시한 후 저온에서 선택적인 증착방법으로 금속배선을 형성하고 이를 이용하여 TFT를 제작할 수 있는 단순화된 저온 선택 증착기술을 이용한 비광학적 방식의 금속배선과 그의 형성방법, 이를 이용하여 제조된 TFT와 TFT의 제조방법, 및 TFT 기판의 제조방법에 관한 것이다. 본 발명의 금속배선은 자기조립단분자막(SAMs)을 이용한 마이크로 컨택 프린팅 방법으로 표면의 선택적인 계면 처리를 통하여 자기조립단분자막을 패턴닝 한 후, ALD 또는 MOCVD 방법으로 처리된 표면위에 선택적으로 Co 및 Cu를 증착하여 금속배선 패턴을 형성한다. 본 발명은 저온 공정이 가능하여 증착면의 종류를 글래스, 실리콘, 플라스틱기판, 전도성 폴리머 등으로 다양화 할 수 있다. 금속배선, Co 선택 증착, 자기조립단분자막, 마이크로 컨택 프린팅, 저온증착, TFT, 유연기판
Abstract:
A method for forming a metal interconnection is provided to guarantee a simplified process by forming a low-resistive multilayered thin film of a Cu/Co structure while using an ALD or MOCVD method of a Co thin film and a Cu thin film and a micro contact printing method. Metal is deposited on a substrate by a micro contact printing method wherein OTS(octadecyltrichlorosilane) of a second pattern made of a reverse pattern of a desired first pattern is formed. A Co thin film(24) is deposited on the front surface of the substrate. A Co thin film is selectively deposited only in a region where OTS(22a) is not formed, made of the same pattern as the first pattern. The substrate region of the first pattern in which the OTS is not formed is a hydrophilic region where a nucleus can easily be generated. The substrate region of the second pattern in which the OTS is formed is a hydrophobic region where a nucleus is difficult to generate.
Abstract:
PURPOSE: A strained semiconductor device manufacturing method is provided to effectively transfer stress on a substrate from a stress film by not arranging a thick etching stopping film on the substrate. CONSTITUTION: A gate structure(130) is arranged on a substrate(100). A gate insulating film(110) and a gate electrode(120) are included in the gate structure. A diffusion barrier film(160) is arranged on the substrate and the gate structure. A stress film is formed on the diffusion barrier film using metal nitride or oxide materials. The stress film is formed into a tensile stress film(170a) by heat-treating the substrate.
Abstract:
PURPOSE: An antenna bushing in a portable terminal makes the length of an antenna exposed to the outside of the terminal longer when the antenna is expanded by placing a starting point of the antenna at the top of the terminal, thereby improving the performance of the antenna. CONSTITUTION: A bushing hole (10) overlaps and is connected to a boss hole of a rear cover (22). A bushing connection part (13) connects an antenna bushing (100) to the rear cover. An antenna guide part (12) transmits a broadcast signal received through an antenna to a circuit signal part through a signal staring point (15) of the antenna. A signal contact point part (11) is connected to the antenna guide part and the bushing connection part. The signal staring point of the antenna and the signal contact point part are formed at adjacent positions.
Abstract:
PURPOSE: A portable terminal is provided to improve reception performance when implementing an LTE(Long Term Evolution) system. CONSTITUTION: A main circuit board(20) is included in a neighboring body. The main circuit board includes a connecting terminal. An antenna(30) is formed on the main circuit board. A module(40) is arranged around an antenna. A ground unit(50) is included in between the module and the neighboring body. The ground unit applies an electric current from the module to the neighboring body in order to transfer noise, which is transferred to the antenna, to the neighboring body.
Abstract:
PURPOSE: Apparatus for antenna receiving sensitivity enhancement in a portable terminal is provided to improve antenna receiving sensitivity by grounding the touch pad part around an antenna to a body around the touch pad part. CONSTITUTION: A touch pad part(50) is arranged around an antenna. The touch pad part is placed on a display unit bracket(42). A current carrying part is arranged between the display unit bracket and the touch pad part. The current carrying part leads noise flowing in from the touch pad part to the display unit bracket. The current carrying part blocks noise flowing into the antenna.
Abstract:
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve mobility of a carrier in a channel area by applying extensible stress or compressive stress in the channel area. CONSTITUTION: A gate pattern(120) is formed on a substrate(110). The gate pattern includes a gate insulation layer(121) and a gate electrode(122). A gate spacer(124) is formed on the sidewall of the gate pattern. The gate spacer includes a first spacer(124a) and a second spacer(124b). A re-crystallization area(130) is formed on the substrate around the gate pattern and includes a laminate defect.
Abstract:
PURPOSE: A non-volatile memory device and a manufacturing thereof are provided to prevent silicon migration in forming a first control gate film by crystallizing first and second reserved silicon films which have different compositions. CONSTITUTION: In a non-volatile memory device and a manufacturing thereof, a semiconductor substrate(100) is formed into a single-crystal silicon. An element isolation pattern(110) is arranged inside a trench(101). A tunnel oxide layer pattern(120) is arranged in the top side of an active region which is defined by the element isolation pattern. The top side of the tunnel oxide layer pattern is lower than that of the element isolation pattern. A Floating gate pattern(200) is arranged on a first dielectric layer pattern.