Abstract:
An electron beam inspecting apparatus is a map projection type and comprises a primary electro-optical system which molds an electron beam emitted from an electron gun into a rectangular form and irradiates the surface of a sample to be inspected with the molded electron beam, a secondary electro-optical system which converges secondary electrons emitted from the sample, a detector which converts the converged secondary electrons into an optical image via a fluorescent plate to focus them to a line sensor, and a controller which controls the charge transfer time to transfer a line image captured by a pixel array provided in the line sensor by interlocking with the transfer speed of stage which moves the sample.
Abstract:
An electron beam apparatus for evaluating a sample face which comprises a primary electro-optical system irradiating the sample with primary electron beams, a detection system, and a secondary electro-optical system directing the secondary electron beam generated from the sample face by irradiation with the primary electron beam to the detection system. The electron beam apparatus is characterized by comprising a multi-beam generator included in the primary electro-optical system to generate electrons emitted from an electron gun as primary electron beams, a scanning deflector included in the primary electro-optical system to scan the sample simultaneously with the primary electron beams, an objective lens included in common in the primary electro-optical system and the secondary electro-optical system to irradiate the sample with decelerated primary electron beams and to accelerate the secondary electron beams emitted from the irradiated point on the sample with the primary electron beams, a secondary electron beam separator included in the primary and secondary electro-optical systems to deflect the secondary electron beams passing through the objective lens from the primary electro-optical system to the secondary electro- optical system, a magnifying lens of at least one stage included in the secondary electro-optical lens to magnify the deflected secondary electron beams, and detectors included in the detection system and provided in accordance with the secondary electron beams for the secondary electro-optical system to detect secondary electron beams.
Abstract:
An electron beam device for applying a primary electron beam onto a sample, and detecting a secondary electron beam produced from a sample surface by the irradiation to evaluate the sample surface, characterized in that the cathode of an electron gun for emitting primary electron beam have a plurality of emitters disposed at intervals on one circle centered on the optical axis of a primary electron optical system and emitting a primary electron beam, and the plurality of emitters are disposed so that points projected on a line parallel to the scanning direction of the primary electron beam are arranged at equal intervals.
Abstract:
An electron beam inspection apparatus comprising an electrooptical unit (70) comprising an electrooptical system for irradiating an object with a primary electron beam from an electron source and projecting the image of secondary electrons emitted from the object and a detector for detecting the image of secondary electrons projected from the electrooptical system, a stage unit (50) for moving the object relatively to the electrooptical system while holding it a mini-environment unit (20) for blocking adhesion of dust to the object by supplying cleaning gas thereto, a working chamber (31) containing the stage unit and controllable to vacuum atmosphere, at least two loading chambers (41, 42) disposed between the mini-environment unit and the working chamber and controllable independently to vacuum atmosphere, and a loader (60) for feeding the object to the stage unit through the loading chambers.
Abstract:
A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 25·1, then forms an image under a desired magnification in the direction of a sample W to produce a crossover. When the crossover is passed, electrons as noises are removed from the crossover with an aperture, an adjustment is made so that the crossover becomes a parallel electron beam to irradiate the substrate in a desired sectional form. The electron beam is produced such that the unevenness of illuminance is 10% or less. Electrons emitted from the sample W are detected by a detector 25·11.
Abstract:
An electron device capable of evaluating a sample at high throughput and high S/N. An electron beam emitted from an electron gun is irradiated, through an electrostatic lens (4-1), an objective lens (11-1), etc., in a diagonal direction on a sample (W) placed on an X-Y-theta stage (9-1), and secondary electrons or reflected electrons are discharged from the sample (W). The incident angle of the primary electron beam is set to about not less than 35º and less than 90º by controlling a polarizer (8-1). The electrons discharged from the sample (W) are guided in the vertical direction to form an image on a detector.