SEMICONDUCTOR INTEGRATED CHIP
    1.
    发明专利

    公开(公告)号:JP2000150564A

    公开(公告)日:2000-05-30

    申请号:JP31978699

    申请日:1999-11-10

    Abstract: PROBLEM TO BE SOLVED: To reduce various modes of a test program for testing a semiconductor chip and a time required for it by connecting all bonding pads to an external terminal, so that a bonding pad which is not used during normal operation is used only for exchanging an input data and an output data during test operation. SOLUTION: A semiconductor chip is provided with a bonding pad IOP for changing the organization mode of data input/data output, and all the bonding pads IOP are connected to an external terminal. A bonding option pad BOPi is wire-connected to an external electric potential as well as bonding option pads BOP1-5. At the test operation of a chip A, all bondings IOP0-7 for exchanging input data and output data are used. In short, a bonding pad IOP which is not used in the organization state of DQ4 in normal operation is used for test operation.

    DECODER CONNECTING DEVICE
    3.
    发明专利

    公开(公告)号:JP2000243933A

    公开(公告)日:2000-09-08

    申请号:JP2000038344

    申请日:2000-02-16

    Abstract: PROBLEM TO BE SOLVED: To provide a decoder connecting device for a memory chip having a long bit line. SOLUTION: A dummy region 7 of a decoder 2 based on a bit line twist 8 is provided between a current supply line 3 and a decoder 2. In this case, bit lines BL form a line twist in a bit line twist region 8 in a memory cell field 1. Additional through holes 6 between two metallized surfaces are made in a zone of the decoder region 2 adjacent to the bit line twist region 8.

    READ AMPLIFIER
    4.
    发明专利

    公开(公告)号:JP2000286345A

    公开(公告)日:2000-10-13

    申请号:JP2000069416

    申请日:2000-03-13

    Abstract: PROBLEM TO BE SOLVED: To adjust and set the turn-on voltage to a specified value even when using a short channel transistor in a read amplifier by installing a field-effect transistor having a variable bus tab potential in a bus tab separated from the other elements in a semiconductor substrate. SOLUTION: On an n--type semiconductor substrate 4, a p-type epitaxial layer 5 is disposed. Between the semiconductor substrate 4 and the epitaxial layer 5, an n+-type buried layer 6 is formed. The n+-type buried layer 6 forms a bus tab 9 together with an n-type drain D and n-type diffusion regions 7, 8. The diffusion regions are disposed in the bus tab 9, separating a field-effect transistor 10 having the n-type drain D, the source S, and the gate G made of polycrystalline silicon from the other elements. The bus tab potential is supplied to the field-effect transistor 10 through a p+-type region having a connection terminal B to set the turn-on voltage to a specified value.

    SEMICONDUCTOR INTEGRATED MEMORY DEVICE

    公开(公告)号:JP2000243925A

    公开(公告)日:2000-09-08

    申请号:JP2000038348

    申请日:2000-02-16

    Abstract: PROBLEM TO BE SOLVED: To supply power required for activating a memory cell field immediately with simple structure via a short power feed line by setting a first electrical connection line to a high ohmic state and a second electrical connection line to a low ohmic state. SOLUTION: A semiconductor integrated memory device consists of memory cell fields 1-8, and the cell fields 1-8 are arranged in a line and are interconnected via power feed lines 11 and 12 with low ohmic at both sides. Also, a power feed line 13 with low ohmic is connected to the surrounding of each of memory cell fields 1-8. Then, a sense amplifier 5 exists at regions among the memory cell fields 1-8. The power feed lines 11, 12, and 13 with low ohmic form a low-ohmic power supply circuit network, and the circuit network is connected to a power supply generator 9 via a high-ohmic line 10.

    CIRCUIT DEVICE FOR PROGRAMMING OF ELECTRICALLY PROGRAMMABLE ELEMENT

    公开(公告)号:JP2000353749A

    公开(公告)日:2000-12-19

    申请号:JP2000133724

    申请日:2000-05-02

    Abstract: PROBLEM TO BE SOLVED: To obtain a circuit device, which can supervise patterning process of an element capable of being electrically programmed in a programming process and is used for programming the electrically programmable element. SOLUTION: Resistance of a conductor path of an element, capable of being programmed in a circuit device has an element T1, which can be continuously changed by a current or a voltage and can be switched for programming the programmable element. Both of the elements are series-connected and are connected with a first feeder potential or a second feeder potential. A supervisory circuit 1 is series-connected with a series circuit, connecting the programmable element with the element T1 which is capable of being switched between a terminal for the first feeder potential and a terminal for the second feeder potential for making the measurement of the amount of electrical characteristics to characterize a programming process. Hereby, the operating process of an electrically programmable element can be supervised in the programming process.

    SEMICONDUCTOR MEMORY DEVICE
    8.
    发明专利

    公开(公告)号:JP2000252440A

    公开(公告)日:2000-09-14

    申请号:JP2000046287

    申请日:2000-02-23

    Abstract: PROBLEM TO BE SOLVED: To avoid the affect of unevenness of the element at edge part on a crossover region or twist region of a bit line by providing with a bit line comprising no bit line twist part with a dummy contact communicated with another plane. SOLUTION: Bit lines BL1, BL2; BL5, BL6; BL9, BL10 comprise a bit line twist part. Bit lines BL3, BL4, BL7, and BL8 comprise no bit line twist part. In order to avoid a proximity effect caused by discontinuity or unevenness in a region near the word lines, even the bit lines BL3, BL4, BL7, and BL8 comprising no crossover or twist part are provided with dummy contacts 8-11. The dummy contacts 8-11 are connected to a word line plane from upward from a bit line plane, and terminate there. Thus, the effect of unevenness of word line is avoided.

    SENSE AMPLIFIER DEVICE COMPRISING MOLTEN DIFFUSION REGION AND DISTRIBUTED DRIVER SYSTEM

    公开(公告)号:JP2000252439A

    公开(公告)日:2000-09-14

    申请号:JP2000045945

    申请日:2000-02-23

    Abstract: PROBLEM TO BE SOLVED: To avoid a critical diffusion region interval between sense amplifier transistor groups for optimum combination with a sense amplifier transistor by arranging a driver for the sense amplifier transistor parallel to a diffusion region while directly adjacent to it. SOLUTION: For a transistor 6 of each conductive type, one diffusion region 8 extending as band is provided, respectively. For the diffusion region 8 for the sense amplifier transistor 6, one driver 5 is provided parallel to it, respectively. Thus, a critical diffusion region interval is avoided at completion. An optimum combination between the driver 5 and the sense amplifier transistor 6 is possible, with no such large wiring resistance as to delay an electric-charge transfer. Thus, an optimum combination to the driver 5 of the sense amplifier transistor is performed with no large wiring resistance accompanied, allowing a perfect molten structure of the diffusion region 8 of the sense amplifier transistor 6.

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