Patent search ap:("伊利诺伊大学评议会") AND inv:"李建宰" Page 1

1.

发明授权
可印刷半导体结构以及相关制造和组装方法有权

公开(公告)号：CN102176465B

公开(公告)日：2014-05-07

申请号：CN201110077508.8

申请日：2006-06-01

Applicant: 伊利诺伊大学评议会

Inventor： R·G·纳佐 , J·A·罗杰斯 , E·梅纳德 , 李建宰 , 姜达荣 , 孙玉刚 , M·梅尔特 , 朱正涛 , 高興助 , S·麦克

IPC: H01L29/16 , H01L29/04 , H01L29/786 , H01L21/302 , H01L21/20 , H01L21/58 , H01L21/77

CPC classification number: H01L2924/0002 , H01L2924/00

Abstract: 本发明提供了一种高产率的用于加工、转移以及组装具有所选择的物理尺寸、形状、成分以及空间取向的高品质可印刷半导体元件的途径。本发明的成分以及方法提供了将微小尺寸和/或纳米尺寸的半导体结构阵列高精度配准转移和集成到基片上，所述基片包括大面积基片和/或柔性基片。此外，本发明提供了从诸如体硅晶片的低成本体材料以及智能材料处理策略来制备可印刷半导体元件的方法，该智能材料处理策略实现了一种用于制备宽范围功能半导体设备的多用途的、以及具有商业吸引力的基于印刷的制造平台。

2.

发明公开
可拉伸半导体元件、可拉伸电路及其制造方法有权

公开(公告)号：CN103633099A

公开(公告)日：2014-03-12

申请号：CN201310436116.5

申请日：2005-06-02

Applicant: 伊利诺伊大学评议会

Inventor： R·G·纳佐 , J·A·罗杰斯 , E·梅纳德 , 李建宰 , 姜达荣 , 孙玉刚 , M·梅尔特 , 朱正涛

IPC: H01L27/12 , H01L29/786 , H01L29/06 , H01L21/84 , H01L21/336 , H01L21/02 , H01L31/0392 , H01L31/18

CPC classification number: H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

Abstract: 本发明提供用于制造可印刷半导体元件并将可印刷半导体元件组装至基片表面上的方法。本发明的方法和设备组件能在含有聚合物材料的基片上产生多种柔性电子和光电子器件以及器件阵列。本发明还提供能在拉伸状态下具有良好性能的可拉伸半导体元件及可拉伸电子器件。

3.

发明公开
组装可印刷半导体元件和制造电子器件的方法有权

公开(公告)号：CN103646848A

公开(公告)日：2014-03-19

申请号：CN201310435963.X

申请日：2005-06-02

Applicant: 伊利诺伊大学评议会

Inventor： R·G·纳佐 , J·A·罗杰斯 , E·梅纳德 , 李建宰 , 姜达荣 , 孙玉刚 , M·梅尔特 , 朱正涛

IPC: H01L21/02 , H01L31/18 , H01L27/12 , H01L29/786 , H01L31/0392 , H01L29/06

CPC classification number: H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00 , H01L27/1214 , H01L31/18

Abstract: 本发明提供用于制造可印刷半导体元件并将可印刷半导体元件组装至基片表面上的方法。本发明的方法和设备组件能在含有聚合物材料的基片上产生多种柔性电子和光电子器件以及器件阵列。本发明还提供能在拉伸状态下具有良好性能的可拉伸半导体元件及可拉伸电子器件。

4.

发明授权
用于制造并组装可印刷半导体元件的方法和设备有权

公开(公告)号：CN102097458B

公开(公告)日：2013-10-30

申请号：CN201010519400.5

申请日：2005-06-02

Applicant: 伊利诺伊大学评议会

Inventor： R·G·纳佐 , J·A·罗杰斯 , E·梅纳德 , 李建宰 , 姜达荣 , 孙玉刚 , M·梅尔特 , 朱正涛

IPC: H01L29/06 , H01L29/786 , H01L21/336 , B81C1/00 , H01L21/77

CPC classification number: H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

Abstract: 本发明提供用于制造可印刷半导体元件并将可印刷半导体元件组装至基片表面上的方法。本发明的方法和设备组件能在含有聚合物材料的基片上产生多种柔性电子和光电子器件以及器件阵列。本发明还提供能在拉伸状态下具有良好性能的可拉伸半导体元件及可拉伸电子器件。

5.

发明授权
用于制造并组装可印刷半导体元件的方法有权

公开(公告)号：CN101120433B

公开(公告)日：2010-12-08

申请号：CN200580018159.5

申请日：2005-06-02

Applicant: 伊利诺伊大学评议会

Inventor： R·G·纳佐 , J·A·罗杰斯 , E·梅纳德 , 李建宰 , 姜达荣 , 孙玉刚 , M·梅尔特 , 朱正涛

IPC: H01L21/00 , H01L21/20 , H01L21/30 , H01L21/326 , H01L21/4763 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08

CPC classification number: H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

Abstract: 本发明提供用于制造可印刷半导体元件(555)和将可印刷半导体元件组装至基片表面(330)的方法和设备。本发明还提供了可拉伸的半导体结构(760)。

6.

发明公开
在用于可拉伸电子元件的半导体互连和纳米膜中的受控弯曲结构有权

公开(公告)号：CN101681695A

公开(公告)日：2010-03-24

申请号：CN200780041127.6

申请日：2007-09-06

Applicant: 伊利诺伊大学评议会

Inventor： J·A·罗杰斯 , M·梅尔特 , 孙玉刚 , 高興助 , A·卡尔森 , W·M·崔 , M·斯托伊克维奇 , H·江 , Y·黄 , R·G·诺奥 , 李建宰 , 姜晟俊 , 朱正涛 , E·梅纳德 , 安钟贤 , H-S·金 , 姜达荣

IPC: H01B7/06 , H01R35/00

CPC classification number: H01L27/0688 , B81B3/0078 , B82Y10/00 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L27/0605 , H01L27/1292 , H01L27/1446 , H01L27/281 , H01L29/0665 , H01L29/0673 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/20 , H01L29/7781 , H01L29/7842 , H01L29/78681 , H01L29/78696 , H01L31/0203 , H01L51/0097 , H01L2924/00011 , H01L2924/0002 , H01L2924/13091 , H01L2924/30105 , H05K1/0283 , H05K1/0313 , H05K3/20 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00 , H01L2224/80001 , H01L2924/00012

Abstract: 在一方面，本发明提供了可拉伸的且可选地为可印刷的组件，例如半导体或电子元件，其能够在拉伸、压缩、弯曲或变形时提供良好性能，以及制造或调节这样的可拉伸组件的相关方法。为某些应用而优选的可拉伸的半导体和电子电路为柔性，此外也是可拉伸的，且因此能够显著地沿着一个或更多个轴线延长、挠曲、弯曲或其他变形。此外，本发明的可拉伸的半导体和电子电路适于范围宽泛的器件结构，以提供完全柔性的电子和光电子器件。

7.

发明授权
组装可印刷半导体元件和制造电子器件的方法有权

公开(公告)号：CN103646848B

公开(公告)日：2018-06-05

申请号：CN201310435963.X

申请日：2005-06-02

Applicant: 伊利诺伊大学评议会

Inventor： R·G·纳佐 , J·A·罗杰斯 , E·梅纳德 , 李建宰 , 姜达荣 , 孙玉刚 , M·梅尔特 , 朱正涛

IPC: H01L21/02 , H01L31/18 , H01L27/12 , H01L29/786 , H01L31/0392 , H01L29/06

CPC classification number: H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

Abstract: 本发明提供用于制造可印刷半导体元件并将可印刷半导体元件组装至基片表面上的方法。本发明的方法和设备组件能在含有聚合物材料的基片上产生多种柔性电子和光电子器件以及器件阵列。本发明还提供能在拉伸状态下具有良好性能的可拉伸半导体元件及可拉伸电子器件。

8.

发明授权
可拉伸半导体元件、可拉伸电路及其制造方法有权

公开(公告)号：CN103633099B

公开(公告)日：2016-09-28

申请号：CN201310436116.5

申请日：2005-06-02

Applicant: 伊利诺伊大学评议会

Inventor： R·G·纳佐 , J·A·罗杰斯 , E·梅纳德 , 李建宰 , 姜达荣 , 孙玉刚 , M·梅尔特 , 朱正涛

IPC: H01L27/12 , H01L29/786 , H01L29/06 , H01L21/84 , H01L21/336 , H01L21/02 , H01L31/0392 , H01L31/18

CPC classification number: H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

Abstract: 本发明提供用于制造可印刷半导体元件并将可印刷半导体元件组装至基片表面上的方法。本发明的方法和设备组件能在含有聚合物材料的基片上产生多种柔性电子和光电子器件以及器件阵列。本发明还提供能在拉伸状态下具有良好性能的可拉伸半导体元件及可拉伸电子器件。

9.

发明公开
二维器件阵列有权

公开(公告)号：CN103213935A

公开(公告)日：2013-07-24

申请号：CN201310075846.7

申请日：2007-09-06

Applicant: 伊利诺伊大学评议会

Inventor： J·A·罗杰斯 , M·梅尔特 , 孙玉刚 , 高興助 , A·卡尔森 , W·M·崔 , M·斯托伊克维奇 , H·江 , Y·黄 , R·G·诺奥 , 李建宰 , 姜晟俊 , 朱正涛 , E·梅纳德 , 安钟贤 , H-S·金 , 姜达荣

IPC: B81B3/00 , B82Y10/00

CPC classification number: H01L27/0688 , B81B3/0078 , B82Y10/00 , H01L21/6835 , H01L21/8221 , H01L21/8258 , H01L27/0605 , H01L27/1292 , H01L27/1446 , H01L27/281 , H01L29/0665 , H01L29/0673 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/20 , H01L29/7781 , H01L29/7842 , H01L29/78681 , H01L29/78696 , H01L31/0203 , H01L51/0097 , H01L2924/00011 , H01L2924/0002 , H01L2924/13091 , H01L2924/30105 , H05K1/0283 , H05K1/0313 , H05K3/20 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00 , H01L2224/80001 , H01L2924/00012

Abstract: 本发明提供二维器件阵列。在一方面，本发明提供了可拉伸的且可选地为可印刷的组件，例如半导体或电子元件，其能够在拉伸、压缩、弯曲或变形时提供良好性能，以及制造或调节这样的可拉伸组件的相关方法。为某些应用而优选的可拉伸的半导体和电子电路为柔性，此外也是可拉伸的，且因此能够显著地沿着一个或更多个轴线延长、挠曲、弯曲或其他变形。此外，本发明的可拉伸的半导体和电子电路适于范围宽泛的器件结构，以提供完全柔性的电子和光电子器件。