公开(公告)号：US20020046995A1

公开(公告)日：2002-04-25

申请号：US09838922

申请日：2001-04-20

Inventor： Yong-Joon Andrew Chang ,  Edward Rea ,  Mark Gitin

IPC: B23K026/38

CPC classification number: B81C1/00071 ,  B23K26/382 ,  B81C2201/0143

Abstract: The present invention relates to forming microchannels with smooth bottoms and walls. In one embodiment smooth microchannels are formed by line-scanning a pulsed solid-state laser beam across a substrate such that there is a high degree of both laser pulse overlap and line overlap. In an alternative embodiment such microchannels are made by employing laser pulses whose spatial profiles have been suitably homogenized.

Abstract translation: 本发明涉及形成具有光滑底部和壁的微通道。 在一个实施例中，平滑微通道是通过在衬底上线扫描脉冲固态激光束形成的，使得存在高度的激光脉冲重叠和线重叠。 在替代实施例中，这样的微通道通过采用其空间分布已被适当地均匀化的激光脉冲来制造。

公开(公告)号：US20240337618A1

公开(公告)日：2024-10-10

申请号：US18747490

申请日：2024-06-19

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHWEN YU

IPC: G01N27/22 ,  B81C1/00

CPC classification number: G01N27/226 ,  B81C1/00531 ,  G01N27/227 ,  B81C2201/0143

Abstract: The present disclosure provides a fluid sensor and a method for fabricating a fluid sensor. The fluid sensor includes a substrate having a first surface, a second surface opposite to the first surface and a recess recessed from the first surface, a protection layer over the first surface and lining the recess, wherein the protection layer includes a material different from that of the substrate, a first conductive layer over the first surface of the substrate and lining the protection layer in the recess, a membrane over the second surface of the substrate and contacting the first conductive layer and the protection layer at the second surface of the substrate, and a through via connected to the recess and penetrating the first conductive layer.

公开(公告)号：US20240253977A1

公开(公告)日：2024-08-01

申请号：US18414932

申请日：2024-01-17

Applicant: Infineon Technologies AG

Inventor： Hutomo Suryo Wasisto ,  Sebastian Anzinger ,  Fabian Streb

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00182 ,  B81B3/0027 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C2201/0109 ,  B81C2201/0143 ,  B81C2201/0149 ,  B81C2201/0154

Abstract: In accordance with an embodiment, a method producing a microelectromechanical system (MEMS) device includes: providing a substrate comprising a first substrate surface and an opposite second substrate surface, wherein the substrate comprises a sacrificial layer arranged at the first substrate surface; depositing a membrane material layer onto the sacrificial layer; the membrane material layer forms a free-standing membrane structure covering the cavity; and creating nanostructures in at least one of a first membrane surface or an opposite second membrane surface of the membrane material layer, wherein the nanostructures protrude from the respective membrane surface of the membrane material layer, and the nanostructures are created by applying a laser structuring process.

公开(公告)号：US20240253976A1

公开(公告)日：2024-08-01

申请号：US18417792

申请日：2024-01-19

Applicant: Infineon technologies AG

Inventor： Hutomo Suryo Wasisto ,  Sebastian Anzinger ,  Fabian Streb

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0029 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/11 ,  B81C2201/0108 ,  B81C2201/0123 ,  B81C2201/0143

Abstract: In accordance with an embodiment a microelectromechanical system (MEMS) device including a substrate comprising a vertically extending through hole and a horizontally extending membrane structure covering the through hole, where the membrane structure comprises a plurality of upright nanostructures for providing a liquid repellent membrane surface. In other embodiments, certain methods are used for fabricating MEMS devices.

公开(公告)号：US20240019249A1

公开(公告)日：2024-01-18

申请号：US18209454

申请日：2023-06-13

Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN

Inventor： Khalil NAJAFI ,  Sajal SINGH ,  Jae Yoong CHO

IPC: G01C19/5783 ,  G01C19/00 ,  B81B3/00 ,  H03H3/007 ,  G01C19/5691 ,  H03H9/02 ,  G01C19/5684 ,  B81C1/00 ,  H03H9/24

CPC classification number: G01C19/5783 ,  G01C19/005 ,  B81B3/0021 ,  H03H3/0072 ,  G01C19/5691 ,  H03H9/02259 ,  G01C19/5684 ,  B81C1/00444 ,  H03H9/2405 ,  B81B2201/0242 ,  H03H2009/02496 ,  B81B2201/0271 ,  B81C2201/0143

Abstract: Three-dimensional (3D) micro-scale shells are presented with selectively removed regions/openings and which can be used in sensors and actuators, including gyroscopes. Example shells consisting of a suspended ring-shaped resonator that is supported using multiple beams that are not in the plane of the ring and are attached to a support post can be formed. Shells with various sizes and geometries of selectively removed regions and openings allow the creation of micro electromechanical systems (MEMS) sensors and actuators with a wide range of engineered mechanical and electrical properties. These shells can be used to form stacked 3D structures for various types of MEMS sensor and actuator devices, such as resonant gyroscopes, with sense and drive electrodes that conform to the curved profile of the resonant shell using for gyroscopes. 3D shells formed from a starting parent substrate are released and separated from their parent substrate using a number of techniques.

公开(公告)号：US20190148566A1

公开(公告)日：2019-05-16

申请号：US16185837

申请日：2018-11-09

Applicant: Infineon Technologies AG

Inventor： Franz-Peter Kalz ,  Jochen Dangelmaier

IPC: H01L31/0216 ,  H01L31/18 ,  B81B7/02 ,  B81C1/00

CPC classification number: H01L31/0216 ,  B81B7/0025 ,  B81B7/02 ,  B81B2201/02 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00047 ,  B81C2201/0143 ,  B81C2203/0109 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/18

Abstract: A semiconductor sensor device includes a substrate including a first main face and a second main face opposite the first main face, a semiconductor element including a sensing region, the semiconductor element on the first main face of the substrate and being electrically coupled to the substrate, a lid on the first main face of the substrate and forming a cavity, wherein the semiconductor element is in the cavity, and a vapor deposited dielectric coating covering the semiconductor element and the first main face of the substrate, the vapor deposited dielectric coating having an opening over the sensing region, wherein the second main face of the substrate is at least partially free of the vapor deposited dielectric layer.

公开(公告)号：US20190062157A1

公开(公告)日：2019-02-28

申请号：US16015640

申请日：2018-06-22

Applicant: HITACHI, LTD.

Inventor： Keiji WATANABE ,  Hiroyasu SHICHI ,  Misuzu SAGAWA ,  Toshiyuki MINE ,  Daisuke RYUZAKI

IPC: B81C99/00 ,  B81C1/00 ,  H01J37/317 ,  H01J37/304 ,  H01J37/147 ,  G03F7/20

CPC classification number: B81C99/0025 ,  B81C1/00412 ,  B81C99/0065 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  G03F7/2059 ,  H01J37/1474 ,  H01J37/304 ,  H01J37/3056 ,  H01J37/3174 ,  H01J2237/28 ,  H01J2237/31749 ,  H01J2237/31755 ,  H01J2237/31776

Abstract: The invention is to reduce non-uniformity of a processing shape over a wide range of a single field-of-view.The invention is directed to a method of processing micro electro mechanical systems with a first step and a second step in a processing apparatus including an irradiation unit that irradiates a sample with a charged particle beam, a shape measuring unit that measures a shape of the sample, and a control unit. In the first step, the irradiation unit irradiates a plurality of single field-of-view points with the charged particle beam in a first region of the sample, the shape measuring unit measures the shape of a spot hole formed in the first region of the sample, and the control unit sets, based on measurement results of the shape of the spot hole, a scan condition of the charged particle beam or a forming mask of the charged particle beam at each of the single field-of-view points. In the second step, the irradiation unit irradiates, based on the scan condition or the forming mask set in the first step, a second region of the sample with the charged particle beam.

公开(公告)号：US09925769B2

公开(公告)日：2018-03-27

申请号：US15174275

申请日：2016-06-06

Applicant: OCE-TECHNOLOGIES B.V.

Inventor： Hans Reinten ,  Hendrik J. Stolk ,  Alex N. Westland

IPC: B41J2/14 ,  H01L23/00 ,  B41J2/16 ,  B81C1/00

CPC classification number: B41J2/14201 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2002/14362 ,  B81C1/00269 ,  B81C2201/0143 ,  B81C2203/032 ,  H01L24/03

Abstract: A MEMS chip having at least two chip components bonded together by means of an adhesive layer that is applied to at least one of two mating bonding surfaces of the two components, wherein a pattern of finely distributed micro-cavities is formed in at least one of the two mating bonding surfaces, said micro-cavities being arranged to accommodate a major part of the adhesive.

公开(公告)号：US09824859B1

公开(公告)日：2017-11-21

申请号：US14980884

申请日：2015-12-28

Applicant: Multibeam Corporation

Inventor： Michael C. Smayling ,  Kevin M. Monahan ,  David K. Lam ,  Theodore A. Prescop

IPC: H01J37/30 ,  H01J37/317 ,  H01L21/3065 ,  H01L21/308 ,  H01J37/244

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for targeted, maskless modification of material on or in a substrate using charged particle beams. Electrostatically-deflected charged particle beam columns can be targeted in direct dependence on the design layout database to perform direct and knock-on ion implantation, producing patterned material modifications with selected chemical and 3D-structural profiles. The number of required process steps is reduced, reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Local gas and photon injectors and detectors are local to corresponding individual columns, and support superior, highly-configurable process execution and control. Targeted implantation can be used to prepare the substrate for patterned blanket etch; patterned ALD can be used to prepare the substrate for patterned blanket deposition; neither process requiring photomasks or resist. Arrays of highly configurable beam columns can also be used to perform both positive and negative tone lithography in a single pass.

公开(公告)号：US09760084B2

公开(公告)日：2017-09-12

申请号：US14169336

申请日：2014-01-31

Applicant: PowerPhotonic Ltd.

Inventor： Matthew Oren Currie ,  Simon Clovis Younger ,  Roy McBride

IPC: G06F19/00 ,  G05B19/418

CPC classification number: G05B19/41865 ,  B81C2201/0143 ,  Y02P90/20 ,  Y02P90/26 ,  Y10S977/889

Abstract: A process for the manufacture of custom freeform optical elements utilizing parameterized modelling. A system for the automatic manufacture of a custom optical element is also described with the manufacturing being by laser micro-machining. The process and system allow customers to specify and order via a web interface and so reduce engineering time, overhead and cost.