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公开(公告)号：US20240188229A1
公开(公告)日：2024-06-06
申请号：US18442659
申请日：2024-02-15
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Woo RYOU
CPC classification number: H05K3/4691 , H04N23/54 , H04N23/55 , H04N23/57 , H05K1/02 , H05K1/0281 , H05K1/14 , H05K1/147 , H05K1/144 , H05K3/365 , H05K2201/056 , H05K2201/09163 , H05K2201/10121
Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
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公开(公告)号：US11917784B2
公开(公告)日：2024-02-27
申请号：US17806276
申请日：2022-06-10
Inventor： Chi-Yu Huang , Hsu-Kai Tsai
CPC classification number: H05K7/06 , H05K1/02 , H05K1/141 , H05K2201/09027 , H05K2201/09063 , H05K2201/09163 , H05K2201/10409 , H05K2201/10424 , H05K2201/2018 , H05K2201/2027
Abstract: A fixing device includes a circuit board, an insertion slot, and a fixing bracket. The circuit board has a peripheral recess, and the insertion slot is disposed on the circuit board. The fixing bracket is fixed in the peripheral recess, and the fixing bracket has a board, two lateral arms, and two guiding rails. The two lateral arms are connected to two corresponding sides of the board, and the two lateral arms are integrally formed from the board. In addition, the two guiding rails are respectively disposed at the two lateral arms, in which the two guiding rails extend towards the insertion slot.
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公开(公告)号：US20240008174A1
公开(公告)日：2024-01-04
申请号：US17852698
申请日：2022-06-29
Applicant: Microsoft Technology Licensing, LLC
Inventor： Stephen Edward HODGES , Michal J. MOSKAL , Gabriele D'AMONE , James Alexander DEVINE , Jonathan Paul DE HALLEUX , Thomas Jaudon BALL
CPC classification number: H05K1/0292 , H05K1/117 , H05K1/0293 , H05K2201/09163 , H05K2201/09236 , H05K2201/09245 , H05K2201/09027 , H05K2201/09127
Abstract: The description relates to prototyping systems, including hubs for electrically connecting devices. One example can include an electrically insulative substrate and at least two connector tabs defined by the substrate, each connector tab including a data contact, a power contact, and a ground contact positioned over the substrate. A data bus can be positioned relative to the substrate and electrically connect all of the data contacts, a power bus can be positioned relative to the substrate and electrically connect all of the power contacts, and a ground bus can be positioned relative to the substrate and electrically connect all of the ground contacts.
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公开(公告)号：US11709079B2
公开(公告)日：2023-07-25
申请号：US17395519
申请日：2021-08-06
Applicant: Seiko Epson Corporation
Inventor： Masayasu Sakuma , Yoshihiro Kobayashi , Shojiro Kitamura , Taketo Chino
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/166 , H01R12/72 , H05K1/148 , G01D11/30 , H05K2201/09163
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US20180310419A1
公开(公告)日：2018-10-25
申请号：US15769476
申请日：2016-10-21
Inventor： Gernot Grober , Sabine Liebfahrt , Marco Gavagnin
CPC classification number: H05K3/4614 , H05K1/0237 , H05K1/0271 , H05K1/14 , H05K1/185 , H05K3/36 , H05K3/4694 , H05K3/4697 , H05K2201/048 , H05K2201/086 , H05K2201/09136 , H05K2201/09163
Abstract: A method of manufacturing a component carrier is disclosed. The method includes providing a first component carrier body having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, providing a second component carrier body having at least one second electrically insulating layer structure and at least one second electrically conductive layer structure, providing at least a part of at least one of the first component carrier body and the second component carrier body of an at least partially uncured material, and interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material.
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Patent Agency Ranking
公开(公告)号：US20180065538A1
公开(公告)日：2018-03-08
申请号：US15808542
申请日：2017-11-09
Applicant: UUSI, LLC
Inventor： David W. Shank
CPC classification number: B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
Abstract: A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.
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公开(公告)号：US09853377B2
公开(公告)日：2017-12-26
申请号：US15037612
申请日：2014-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yeon Woo Kim , Kyung Gu Kim , Gyu Sub Kim , Se Hyun Park , Jin Woo Jung , Jae Bong Chun
CPC classification number: H01R12/7076 , H05K1/02 , H05K3/325 , H05K2201/09163 , H05K2201/09209 , H05K2201/10083 , H05K2201/10098 , H05K2201/10446
Abstract: A connecting member for electrically connecting a circuit board and a component in an electronic device is provided. The connecting member includes at least one bending part configured to comprise elasticity, a pad part connected to the bending part and configured to be attached to one surface of the circuit board, and a fixing part extending from the pad part and configured to fix the connecting member to the circuit board.
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公开(公告)号：US09840185B2
公开(公告)日：2017-12-12
申请号：US15362703
申请日：2016-11-28
Applicant: UUSI, LLC
Inventor： David W. Shank
CPC classification number: B60Q1/0088 , H01R12/62 , H05B33/0803 , H05B33/0845 , H05B33/0854 , H05B33/086 , H05B37/0227 , H05K1/02 , H05K1/117 , H05K1/14 , H05K1/142 , H05K1/16 , H05K2201/04 , H05K2201/09027 , H05K2201/09045 , H05K2201/09081 , H05K2201/09154 , H05K2201/09163 , H05K2201/097 , H05K2201/09709 , H05K2201/0979 , H05K2201/0999 , H05K2201/10053 , H05K2201/10151 , H05K2201/10356
Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.
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公开(公告)号：US09831144B2
公开(公告)日：2017-11-28
申请号：US14428376
申请日：2013-08-28
Applicant: QUBEICON LTD.
Inventor： Shimon Podval
IPC: H05K1/18 , H01L23/13 , H01L23/498 , H01L25/065 , H05K1/11 , H05K1/14 , H05K1/02 , H01L23/00 , H05K3/34
CPC classification number: H01L23/13 , H01L23/49838 , H01L23/49855 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/06135 , H01L2224/131 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/49113 , H01L2224/49177 , H01L2224/73265 , H01L2224/81203 , H01L2224/81205 , H01L2224/81385 , H01L2924/00014 , H01L2924/15162 , H01L2924/15192 , H05K1/0204 , H05K1/117 , H05K1/141 , H05K3/3415 , H05K3/3442 , H05K2201/041 , H05K2201/09063 , H05K2201/09154 , H05K2201/09163 , H05K2201/0939 , H05K2201/09472 , Y02P70/613 , H01L2924/014 , H01L2224/32225 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.
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120.发明授权公开(公告)号：US09653826B2
公开(公告)日：2017-05-16
申请号：US14612978
申请日：2015-02-03
Inventor： Yong-Nian Chen , Li-Fu Xu , Chun-Wei Yang
CPC classification number: H01R12/7076 , H05K1/18 , H05K1/184 , H05K2201/09163 , H05K2201/10189 , H05K2201/10446
Abstract: An interface mounting device includes a circuit board with a connector and a bracket configured to receive an interface device and including a hook. The circuit board defines an installation opening and a cutout extending from an edge of the installation opening. The bracket is received in the installation opening. The hook is engaged with the circuit board through the cutout. The bracket defines a guiding slot aligned with the connector. The guiding slot is configured for a coupling portion of the interface device to pass through and coupling to the connector. A printed circuit board assembly with the interface mounting device is also provided.
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