公开(公告)号：US11772963B2

公开(公告)日：2023-10-03

申请号：US17524140

申请日：2021-11-11

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Hang Chang ,  I-Shi Wang ,  Jen-Hao Liu

IPC: B81C1/00 ,  B81C3/00

CPC classification number: B81C1/00238 ,  B81C1/00269 ,  B81C1/00888 ,  B81C3/005 ,  B81C2201/013 ,  B81C2201/0143 ,  B81C2201/0146 ,  B81C2203/035

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the second substrate. One or more recesses are arranged in the second face of the first substrate and are configured to compensate for thermal expansion or thermal contraction.

公开(公告)号：US11703356B1

公开(公告)日：2023-07-18

申请号：US18097298

申请日：2023-01-16

Applicant: NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY

Inventor： Kun Lu ,  Dingbang Xiao ,  Yan Shi ,  Xuezhong Wu ,  Xiang Xi ,  Yongmeng Zhang

IPC: G01C19/56 ,  G01C25/00 ,  B81C1/00 ,  B81B7/02

CPC classification number: G01C25/00 ,  B81B7/02 ,  B81C1/00626 ,  G01C19/56 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81C2201/0143

Abstract: An online trimming device and method for a micro-shell resonator gyroscope is provided. A micro-shell resonator gyroscope fixing fixture and a mode test circuit in the device are placed in a vacuum test cavity provided with a circuit interface. The mode test circuit and a host computer are connected through a circuit interface on the vacuum test cavity. The gyroscope fixing fixture is provided with a signal interface, and the electrodes on the gyroscope substrate are connected to the signal interface. The signal interface on the fixture is connected to the mode test circuit. The laser etching module is located at the top of the device. An opening is formed in the gyroscope fixing fixture. The vacuum test cavity is provided with a transparent trimming window. The laser acts on the edge of the resonant structure of the gyroscope through the trimming window and the through hole of the fixture.

公开(公告)号：US11644435B2

公开(公告)日：2023-05-09

申请号：US16845565

申请日：2020-04-10

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： ShuaiGang Xiao ,  David S. Kuo ,  Xiaomin Yang ,  Kim Yang Lee ,  Yautzong Hsu ,  Michael R. Feldbaum

IPC: G01R27/08 ,  G01N27/327 ,  G01N33/487 ,  C12Q1/6869 ,  C23C14/00 ,  B01L3/00 ,  G01N27/414 ,  G01N27/447 ,  B82Y5/00

CPC classification number: G01N27/3278 ,  B01L3/502707 ,  B01L3/502715 ,  B01L3/502761 ,  C12Q1/6869 ,  C23C14/00 ,  G01N27/4145 ,  G01N27/4146 ,  G01N27/44791 ,  G01N33/48721 ,  B81C2201/0143 ,  B81C2201/0176 ,  B81C2201/0181 ,  B82Y5/00

Abstract: A DNA sequencing device and methods of making. The device includes a pair of electrodes having a spacing of no greater than about 2 nm, the electrodes being exposed within a nanopore to measure a DNA strand passing through the nanopore. The device can be made by depositing a conductive layer over a sacrificial channel and then removing the sacrificial channel to form the electrode gap.

公开(公告)号：US10017380B1

公开(公告)日：2018-07-10

申请号：US15676457

申请日：2017-08-14

Applicant: Robert Bosch GmbH

Inventor： Jan-Peter Stadler ,  Jochen Reinmuth

IPC: G01L9/00 ,  B81C1/00 ,  B81B1/00

CPC classification number: B81C1/00047 ,  B81B1/004 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00293 ,  B81C2201/0116 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0198 ,  B81C2203/0145

Abstract: A micromechanical device that includes a first substrate, at least one first cavity, and a sealed inlet to the first cavity, the inlet extending through the first substrate. The inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate. A combined laser drilling and plasma etching method for manufacturing micromechanical devices is also described.

公开(公告)号：US20170372887A1

公开(公告)日：2017-12-28

申请号：US15156286

申请日：2016-05-16

Applicant: Solexel, Inc.

Inventor： David Xuan-Qi Wang ,  Mehrdad M. Moslehi

IPC: H01L21/02 ,  F16L21/035

CPC classification number: H01L21/0243 ,  B81C1/00063 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/0143 ,  F16L21/035 ,  H01L21/7806 ,  H01L21/7813 ,  H01L31/0352 ,  H01L31/1804 ,  H01L31/182 ,  H01L31/1896

Abstract: A method is provided for fabricating a thin-film semiconductor substrate by forming a porous semiconductor layer conformally on a reusable semiconductor template and then forming a thin-film semiconductor substrate conformally on the porous semiconductor layer. An inner trench having a depth less than the thickness of the thin-film semiconductor substrate is formed on the thin-film semiconductor substrate. An outer trench providing access to the porous semiconductor layer is formed on the thin-film semiconductor substrate and is positioned between the inner trench and the edge of the thin-film semiconductor substrate. The thin-film semiconductor substrate is then released from the reusable semiconductor template.

公开(公告)号：US20170246611A1

公开(公告)日：2017-08-31

申请号：US15444010

申请日：2017-02-27

Applicant: SMARTTIP BV

Inventor： Edin Sarajlic

IPC: B01J19/08 ,  C01B21/068 ,  B81C1/00

CPC classification number: B81C1/0015 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150396 ,  A61B5/150511 ,  A61B5/150519 ,  A61B5/150984 ,  A61B5/15142 ,  A61M37/0015 ,  B81B2201/057 ,  B81B2201/12 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00111 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0198 ,  C01B21/0687

Abstract: A method of manufacturing a plurality of through-holes in a layer of first material by subjecting part of the layer of said first material to ion beam milling.For batch-wise production, the method comprises after a step of providing the layer of first material and before the step of ion beam milling, providing a second layer of a second material on the layer of first material, providing the second layer of the second material with a plurality of holes, the holes being provided at central locations of pits in the first layer, and subjecting the second layer of the second material to said step of ion beam milling at an angle using said second layer of the second material as a shadow mask.

公开(公告)号：US20170233891A1

公开(公告)日：2017-08-17

申请号：US15519220

申请日：2015-10-15

Applicant: The University of Melbourne

Inventor： Afaq Habib Piracha ,  Steven Prawer ,  Kumaravelu Ganesan ,  Snjezana Tomljenovic-Hanic ,  Desmond Lau

IPC: C30B25/20 ,  B23K26/00 ,  C23C16/27 ,  C23C16/04 ,  C23C16/44 ,  B81C3/00 ,  C25F3/02 ,  C30B29/04 ,  C30B25/04 ,  C30B33/10 ,  C30B33/12 ,  B23K26/362 ,  C23C16/56

CPC classification number: C30B25/20 ,  B23K26/0006 ,  B23K26/362 ,  B23K2103/50 ,  B81C3/001 ,  B81C2201/0143 ,  B81C2201/0146 ,  B81C2201/0187 ,  B81C2201/0198 ,  C23C16/042 ,  C23C16/274 ,  C23C16/279 ,  C23C16/4408 ,  C23C16/56 ,  C25F3/02 ,  C30B25/04 ,  C30B25/18 ,  C30B29/04 ,  C30B33/10 ,  C30B33/12

Abstract: The present disclosure provides a method of fabricating a diamond membrane. The method comprises providing a substrate and a support structure. The substrate comprises a diamond material having a first surface and the substrate further comprises a sub-surface layer that is positioned below the first surface and has a crystallographic structure that is different to that of the diamond material. The sub-surface layer is positioned to divide the diamond material into first and second regions wherein the first region is positioned between the first surface and the sub-surface layer. The support structure also comprises a diamond material and is connected to, and covers a portion of, the first surface of the substrate. The method further comprises selectively removing the second region of the diamond material from the substrate by etching away at least a portion of the sub-surface layer of the substrate.

公开(公告)号：US09466464B1

公开(公告)日：2016-10-11

申请号：US14694710

申请日：2015-04-23

Applicant: Multibeam Corporation

Inventor： David K. Lam ,  Kevin M. Monahan ,  Michael C. Smayling ,  Theodore A. Prescop

IPC: H01J37/30 ,  H01J37/305 ,  H01J37/22 ,  H01J37/05 ,  H01J37/304 ,  H01J37/317

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be removed from a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beams. Reducing the number of process steps, and eliminating lithography steps, in localized material removal has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material removal allows for controlled variation of removal rate and enables creation of 3D structures or profiles. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted substrate processing.

Abstract translation: 用于使用没有光掩模并且没有抗蚀剂层的带电粒子束来图案化衬底的方法，装置和系统。 材料可以从设计布局数据库指导的基板上移除，该设计布局数据库被定位到由多个匹配的带电粒子束瞄准的位置。 在局部材料去除中减少工艺步骤的数量和消除光刻步骤具有减少制造周期时间并通过降低缺陷引入概率来提高产量的双重优点。 此外，高度局部化的精密材料去除允许控制的去除速率的变化，并且能够创建3D结构或轮廓。 本地气体注入器和检测器以及本地光子注入器和检测器对应于相应的列是局部的，并且可以用于促进快速，准确的靶向基板处理。

公开(公告)号：US20160279944A1

公开(公告)日：2016-09-29

申请号：US15174275

申请日：2016-06-06

Applicant: OCE-TECHNOLOGIES B.V.

Inventor： Hans REINTEN ,  Hendrik J. STOLK ,  Alex N. WESTLAND

IPC: B41J2/14 ,  B81C1/00

CPC classification number: B41J2/14201 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2002/14362 ,  B81C1/00269 ,  B81C2201/0143 ,  B81C2203/032 ,  H01L24/03

Abstract: A MEMS chip having at least two chip components bonded together by means of an adhesive layer that is applied to at least one of two mating bonding surfaces of the two components, wherein a pattern of finely distributed micro-cavities is formed in at least one of the two mating bonding surfaces, said micro-cavities being arranged to accommodate a major part of the adhesive.

Abstract translation: 一种具有至少两个芯片部件的MEMS芯片，其通过粘合剂层粘合在一起，所述粘合剂层被施加到两个部件的两个匹配粘合表面中的至少一个上，其中精细分布的微型腔的图案形成在 所述两个配合结合表面，所述微腔被布置成容纳粘合剂的主要部分。

公开(公告)号：US09453281B1

公开(公告)日：2016-09-27

申请号：US14745463

申请日：2015-06-21

Applicant: Multibeam Corporation

Inventor： Theodore A. Prescop ,  Kevin M. Monahan ,  David K. Lam ,  Michael C. Smayling

IPC: C23C16/48 ,  H01J37/08 ,  H01J37/30 ,  H01J37/244 ,  H01J37/06

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be deposited onto a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beam columns. Reducing the number of process steps, and eliminating lithography steps, in localized material addition has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material deposition allows for controlled variation of deposition rate and enables creation of 3D structures. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted, highly configurable substrate processing, advantageously using large arrays of said beam columns.

Abstract translation: 用于使用没有光掩模并且没有抗蚀剂层的带电粒子束来图案化衬底的方法，装置和系统。 材料可以沉积到衬底上，如设计布局数据库所指示的那样，被定位到由多个匹配的带电粒子束柱靶向的位置上。 减少工艺步骤的数量和消除光刻步骤在局部化材料添加中具有减少制造周期时间并通过降低缺陷引入概率来提高产量的双重优点。 此外，高度局部化的精密材料沉积允许沉积速率的受控变化并且能够创建3D结构。 局部气体注入器和检测器以及本地光子注入器和检测器对于相应的列是局部的，并且可以用于促进快速，准确，有针对性的高度可配置的衬底处理，有利地使用所述束柱的大阵列。