公开(公告)号：US5885850A

公开(公告)日：1999-03-23

申请号：US146099

申请日：1993-11-10

Applicant: Christian Val

Inventor： Christian Val

IPC: H01L23/28 ,  H01L21/48 ,  H01L23/433 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H01L21/56 ,  H01L21/60 ,  H01L21/70

CPC classification number: H05K1/185 ,  H01L21/4853 ,  H01L23/4334 ,  H01L24/97 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/09118 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/1469

Abstract: A method for the interconnection of stacked packages encapsulating, for example, a semiconductor chip containing an integrated circuit, for example a memory. Packages with connection pins (21) are stacked and fixedly joined to each other by means of a coating of resin for example. The pins of the packages are cut so as to be flush with the faces (31, 32) of the stack (3). The connection (C) of the packages with one another and their connection to connection pads (35) of the stack is done on the faces of the stack. The connection pads are, if necessary, provided with connection pins (36).

Abstract translation: PCT No.PCT / FR93 / 00239 Sec。 371日期：1993年11月10日 102（e）日期1993年11月10日PCT 1993年3月10日PCT公布。 公开号WO93 / 18549 日期1993年9月16日一种用于封装例如包含集成电路的半导体芯片（例如存储器）的堆叠封装的互连方法。 具有连接销（21）的包装通过例如树脂涂层彼此堆叠并彼此固定。 包装件的销被切割成与堆叠（3）的表面（31,32）齐平。 封装的连接（C）彼此之间的连接以及它们与堆叠的连接焊盘（35）的连接在堆叠的表面上完成。 如果需要，连接焊盘设置有连接引脚（36）。

公开(公告)号：US5831835A

公开(公告)日：1998-11-03

申请号：US808785

申请日：1997-02-28

Applicant: Josef Dirmeyer ,  Christian Plankl ,  Marten Swart ,  Alfred Gottlieb

Inventor： Josef Dirmeyer ,  Christian Plankl ,  Marten Swart ,  Alfred Gottlieb

IPC: H05K7/06 ,  H05K1/00 ,  H05K1/18 ,  H05K3/20 ,  H05K7/02 ,  H05K9/00

CPC classification number: H05K7/02 ,  H05K3/202 ,  H05K1/0284 ,  H05K1/187 ,  H05K2201/0382 ,  H05K2201/09118 ,  H05K2201/09736 ,  H05K2201/10371 ,  H05K2201/2072 ,  H05K2203/1545

Abstract: A device with an electric circuit configuration includes electrical components and a pressed grid stamped from a metal strip for electrically conductively connecting the electrical components to one another. The pressed grid has bent-over large-area peripheral regions and a plug part with connection pins stamped out of the metal strip.

Abstract translation: 具有电路配置的装置包括电气部件和从金属带冲压的用于将电气部件彼此导电连接的压制网格。 压制的格栅具有弯曲的大面积周边区域和具有从金属条冲压出的连接销的插头部分。

公开(公告)号：US5805402A

公开(公告)日：1998-09-08

申请号：US569684

申请日：1995-12-08

Applicant: H. Winston Maue ,  George A. Wooldridge

Inventor： H. Winston Maue ,  George A. Wooldridge

IPC: B60R16/02 ,  B60R16/023 ,  H01R9/24 ,  H05K1/00 ,  H05K1/14 ,  H05K3/18 ,  H02H3/00

CPC classification number: B60R16/0239 ,  B60R16/0207 ,  B60R16/0215 ,  B60R16/0238 ,  H05K1/0284 ,  H01H2011/0081 ,  H01H2011/065 ,  H01H2300/01 ,  H01R12/59 ,  H01R9/2466 ,  H05K1/144 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10053 ,  H05K3/182

Abstract: An integrated interior trim and electrical assembly for use in an automotive vehicle includes an integrated electrical junction box and an interior trim panel. The interior trim panel has a generally rigid substrate covered by an aesthetically pleasing covering material. The junction box includes a flexible printed circuit board, a rigid printed circuit board, a busbar and insulator assembly, and a conductive deposited trace. The integrated interior trim and electrical assembly employs a sheet-like electrically conductive circuit layer which distributes electricity between a switch and an electricity activated device. A sheet-like electrically conductive layer is partially external from and partially disposed inside of an electrical junction box wherein it is electrically connected to one or more of the other circuit layers also contained within the junction box. Portions of the sheet-like electrically conductive layer external to the junction box are also suitable for integration with a series of occupant operable switches. Another aspect of the present invention employs a conductive elastomeric pad between internal circuit layers. A portion of an electrical junction box is molded within an interior trim panel substrate. Integrated interior trim and electrical assembly, a sheet-like electrically conductive layer is formed and affixed within an interior trim panel.

Abstract translation: 用于机动车辆的集成内部装饰和电气组件包括集成电接线盒和内部装饰板。 内饰板具有由美学上令人满意的覆盖材料覆盖的大致刚性基底。 接线盒包括柔性印刷电路板，刚性印刷电路板，母线和绝缘体组件以及导电沉积迹线。 集成的内部装饰和电气组件采用在开关和电激活装置之间分配电力的片状导电电路层。 片状导电层部分地外部并部分地设置在电接线盒的内部，其中电连接到也包含在接线盒内的一个或多个其它电路层。 接线盒外部的片状导电层的部分也适用于与一系列乘员可操作开关的集成。 本发明的另一方面在内部电路层之间使用导电弹性垫。 电接线盒的一部分被模制在内部装饰板基板内。 集成的内部装饰和电气组件，片状导电层形成并固定在内饰板内。

公开(公告)号：US5688146A

公开(公告)日：1997-11-18

申请号：US686982

申请日：1996-07-25

Applicant: William J. McGinley ,  John R. Cannon ,  William J. Green ,  Richard P. Zanardo

Inventor： William J. McGinley ,  John R. Cannon ,  William J. Green ,  Richard P. Zanardo

IPC: C09K19/38 ,  H01R12/71 ,  H01R13/03 ,  H01R24/00 ,  H01R43/16 ,  H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R23/70

CPC classification number: H05K3/0014 ,  H01R12/716 ,  H01R13/035 ,  H05K1/119 ,  H05K3/326 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/117 ,  H05K2201/0141 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K3/366 ,  Y10S428/901 ,  Y10S439/931

Abstract: A conductive component for carrying electrical signals constructed from a molded polymer substrate and a conductive coating adhered to the substrate, the coating defining a continuous electrical pathway between at least two terminals. Preferably, molded plastic such as liquid crystal polymer is formed to make circuits having conductive ink adhered thereto in order to provide inexpensive and versatile printed circuit boards for carrying electrical traces and other components and to provide printed formed contacts. The conductive solderable inks can be adhered to the substrate, for example, via screen printing, brush, spraying, dipping, masking, vacuum plating or vacuum deposition with subsequent oven drying, reflowing in a vapor phase, post curing or plating.

公开(公告)号：US5675888A

公开(公告)日：1997-10-14

申请号：US279643

申请日：1994-07-25

Applicant: Marvin Leroy Owen ,  Mark James Miller

Inventor： Marvin Leroy Owen ,  Mark James Miller

IPC: H01R43/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/00

CPC classification number: H01R43/205 ,  H05K1/119 ,  H05K3/326 ,  H01R12/79 ,  H05K1/184 ,  H05K2201/0191 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/10189 ,  H05K2201/1059 ,  Y10T29/49124 ,  Y10T29/49158

Abstract: An automotive instrument cluster case is molded of a resin material. A rigid rear wall of the case has a planar outer surface including a connector region having two adjacent flaps, each flap molded with a thin flexible section and a rigid terminal section. Printed circuit paths are applied to the plane outer surface including the flaps. Then the flaps are deformed into the case, with the flexible section being curved and the terminal sections being spaced apart with the circuit paths forming terminal strips facing one another to form a connector socket. Interlocking stop elements molded on the inner surface hold the flaps apart to receive a male connector.

Abstract translation: 汽车仪表组合壳体由树脂材料模制而成。 壳体的刚性后壁具有包括具有两个相邻翼片的连接器区域的平面外表面，每个翼片模制有薄的柔性部分和刚性端子部分。 印刷电路路径被施加到包括翼片的平面外表面。 然后，翼片变形为壳体，柔性部分是弯曲的，并且端子部分与形成端子条的电路路径间隔开以形成连接器插座。 在内表面上模制的联锁止动元件将翼片分开以接收公连接器。

公开(公告)号：US5527187A

公开(公告)日：1996-06-18

申请号：US341233

申请日：1994-11-17

Applicant: Gordan Jurasek ,  Douglas P. Gerrelts ,  Victor V. Zaderej

Inventor： Gordan Jurasek ,  Douglas P. Gerrelts ,  Victor V. Zaderej

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/42 ,  H01R13/64

CPC classification number: H05K3/326 ,  H05K1/0271 ,  H05K1/119 ,  H05K1/0284 ,  H05K1/0393 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/1059 ,  H05K3/306 ,  H05K3/42

Abstract: A circuit board for an instrument cluster comprises injection-molded plastic springs connecting islands of the circuit board to a main portion of the circuit board. Each island further has integrally-molded clips residing in the plane of the island. The clips are adapted for insertion and retention of terminals of electrical gauge movements. When the electrical gauge movements are attached to the circuit board via the clips, the springs provide compliance so that the gauge movements can then be attached to one or more face plates of the instrument cluster. The compliance provided by the springs allows tolerance stack-ups among the various components of the instrument cluster assembly to be overcome.

Abstract translation: 用于仪器组的电路板包括将电路板的岛连接到电路板的主要部分的注塑塑料弹簧。 每个岛屿还具有居住在岛的平面中的整体模制的夹子。 夹子适于插入和保持电表运动的端子。 当电表移动通过夹子附接到电路板时，弹簧提供顺应性，使得测量器运动然后可以附接到仪表盘的一个或多个面板。 由弹簧提供的顺应性允许克服仪表组件组件的各种部件之间的公差叠加。

公开(公告)号：US5468909A

公开(公告)日：1995-11-21

申请号：US184614

申请日：1994-01-21

Applicant: Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

Inventor： Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

IPC: H01L23/28 ,  H01L23/34 ,  H05K1/00 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10969

Abstract: An insulating part for an electronic device includes a first metallized outer surface capable of cooling one or more electronic components disposed on the insulating part. The insulating part also includes one or more additional metallized outer surfaces, such as a set of cooling ribs, to provide improved cooling for the electronic components. These additional outer surfaces are coupled electrically and thermally to the first metallized outer surface, and to each other by recesses containing a heat transfer element, such as a metallization or a soldered connection. Thus, heat transferred to the first outer surface is further dissipated among the several additional cooling surfaces.

Abstract translation: 电子器件的绝缘部件包括能够冷却设置在绝缘部件上的一个或多个电子部件的第一金属化外表面。 绝缘部件还包括一个或多个附加的金属化外表面，例如一组冷却肋，以为电子部件提供改进的冷却。 这些额外的外表面电和热耦合到第一金属化的外表面，并且通过包含诸如金属化或焊接连接的传热元件的凹部彼此耦合。 因此，传递到第一外表面的热量在多个额外的冷却表面之间进一步消散。

公开(公告)号：US5462838A

公开(公告)日：1995-10-31

申请号：US152507

申请日：1993-11-15

Applicant: Masahito Sato ,  Kazuaki Tajima ,  Yoshio Matsuda ,  Takahumi Miyamoto

Inventor： Masahito Sato ,  Kazuaki Tajima ,  Yoshio Matsuda ,  Takahumi Miyamoto

IPC: G03F7/24 ,  H05K3/00 ,  H05K3/06 ,  H05K3/46 ,  G03F7/00

CPC classification number: H05K3/4611 ,  H05K3/0014 ,  G03F7/24 ,  H05K2201/0355 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/302 ,  H05K3/0082 ,  H05K3/064 ,  Y10S428/901

Abstract: A method for manufacturing a curved surface multi-layer wiring board having the through-holes and high accurate inner patters with a high reliability. A curved surface multi-layer wiring board is manufactured by processes for forming the inner pattern on the copper clad substrates, and for perforating the holes to the substrates and prepregs, and for laying-up these substrates and prepregs, then for pressing these substrates and prepregs in the formation mould. Then the outer pattern are formed by the laser exposure process after the through holes are connected between the layers. A method is also provided for repeating the laying-up processes in order to obtain a curved surface multi-layer wiring board of which is a three dimensional curved surface.

Abstract translation: 一种制造具有通孔的曲面多层布线板的方法和具有高可靠性的高精度内部印模。 通过在铜包覆基板上形成内部图案的工艺，并将孔穿孔到基板和预浸料，以及用于铺设这些基板和预浸料的方法制造曲面多层布线板，然后压制这些基板 预成型模具中的预浸料。 然后，在通孔连接在层之间之后，通过激光曝光工艺形成外部图案。 还提供了一种用于重复铺设过程以获得其为三维曲面的曲面多层布线板的方法。

公开(公告)号：US5338645A

公开(公告)日：1994-08-16

申请号：US874733

申请日：1986-06-16

Applicant: James M. Henderson ,  Vernon R. Scott ,  Kenneth C. Cote

Inventor： James M. Henderson ,  Vernon R. Scott ,  Kenneth C. Cote

IPC: H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  G03C5/00 ,  B23K9/00 ,  G03C1/00

CPC classification number: H05K3/027 ,  H05K3/0082 ,  H05K2201/0347 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2203/081 ,  H05K2203/107 ,  H05K3/064 ,  H05K3/388 ,  Y10S430/146

Abstract: Printed circuits which reside on three dimensional surfaces are disclosed. Using a first technique, a three dimensional surface is formed on a substrate having a high melting point or permitting a high degree of infrared energy transmittance. The surface contains a layer of metalization maintained at a depth of less than two microns. An infrared laser then moves around the surface and selectively vaporizes metalization leaving a desired printed circuit pattern. The remaining metalization is plated to a useable depth. Using a second technique, a fiber optic bundle is machined on one end to mate with the three dimensional surface. The three dimensional surface, metalized and coated with photo resist, resides in intimate contact with this first end. A second end of the cable is flat and resides in intimate contact with two dimensional master photo artwork. A pattern is exposed on the photoresist through the fiber optic bundle, and the metalization is etched using conventional techniques.

Abstract translation: 公开了驻留在三维表面上的印刷电路。 使用第一技术，在具有高熔点或允许高度的红外能量透射率的基板上形成三维表面。 该表面含有保持在小于2微米深度的金属化层。 然后红外激光器围绕表面移动并选择性地蒸发金属化，留下所需的印刷电路图案。 剩余的金属化被镀覆到可用的深度。 使用第二种技术，在一端加工光纤束以与三维表面配合。 金属化并涂有光致抗蚀剂的三维表面与该第一端紧密接触。 电缆的第二端是平坦的，并与二维主照片图形紧密接触。 通过光纤束在光致抗蚀剂上露出图案，并使用常规技术蚀刻金属化。

公开(公告)号：US5334279A

公开(公告)日：1994-08-02

申请号：US113392

申请日：1993-08-27

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  B44C1/22 ,  C23F1/00

CPC classification number: H05K1/111 ,  B29C33/3878 ,  B29C33/42 ,  B29C33/56 ,  H05K3/0014 ,  H05K3/205 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0315 ,  H05K3/025 ,  H05K3/061 ,  H05K3/107 ,  H05K3/384 ,  H05K3/385 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24917

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

Abstract translation: 一种新的改进的印刷电路板工具及其制造和使用方法，用于生产具有在其中具有强粘合或层压金属垫的凹槽的三维印刷电路板。 印刷电路板工具包括具有设置在基板表面中的多个凹槽形成突起的金属化阳模基板。 制造金属化模具的方法包括形成可用于生产大量用于生产新的和改进的三维印刷电路板的金属化阳模的母本或前驱主工具。 新型改进的三维印刷电路板包括由高热偏转塑料构成的基板和模制到基板表面中的多个凹槽或凹槽，用于在其中接收集成电路的细间距，紧密间隔的引线。 多个金属化的凹陷垫或焊盘粘合或粘合在凹槽内，以在每个凹槽内建立电路径。