公开(公告)号：US20010020545A1

公开(公告)日：2001-09-13

申请号：US09747118

申请日：2000-12-22

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H05K001/16 ,  H05K007/20

CPC classification number: H05K7/1069 ,  B23K20/004 ,  B23K2101/40 ,  C23C18/31 ,  C23C18/32 ,  C23C18/38 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/01048

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.

Abstract translation: 通过将线的自由端接合到基底上，形成具有弹性或线性的接触结构，将线构成为具有弹性形状的线杆，切断线杆，以及在线杆上涂覆线杆 最少一层材料主要用于其结构（弹性，柔度）特性。

公开(公告)号：US06279227B1

公开(公告)日：2001-08-28

申请号：US08735809

申请日：1996-10-21

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R4300

CPC classification number: H05K7/1069 ,  B23K2101/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US6149443A

公开(公告)日：2000-11-21

申请号：US938787

申请日：1997-09-26

Applicant: Sean A. Moran

Inventor： Sean A. Moran

IPC: H01R12/52 ,  H01R12/71 ,  H01R13/24 ,  H05K3/36 ,  H05K7/14 ,  H05K9/00 ,  H01R9/09 ,  H01R23/68

CPC classification number: H01R13/2435 ,  H01R12/52 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0039 ,  H01R12/714 ,  H05K1/0215 ,  H05K2201/0311 ,  H05K2201/10757 ,  H05K2201/2036

Abstract: A ground connector and standoff apparatus or spring member for mounting between two circuit boards is of conductive material and has opposing substantially flat, parallel first and second legs and a spring link connecting the legs. In an uncompressed condition of the spring member, the legs are spaced apart a predetermined distance greater than the spacing between the two circuit boards when connected together. The first leg is connected to one of the circuit boards and the second leg bears against an opposing portion of the other circuit board to provide a ground connection when the boards are connected together, compressing the spring member. A limiter or spacer on the spring member limits compression beyond a predetermined point at which the height of the spring member is equal to a predetermined standoff between the boards.

Abstract translation: 用于安装在两个电路板之间的接地连接器和支座装置或弹簧构件是导电材料，并且具有相对的基本平坦的平行的第一和第二腿部以及连接腿部的弹簧连杆。 在弹簧构件的未压缩状态下，当彼此连接在一起时，腿部间隔开大于两个电路板之间的间隔的预定距离。 第一腿连接到一个电路板，第二个腿抵靠在另一个电路板的相对部分上，当电路板连接在一起时，提供接地连接，压缩弹簧构件。 弹簧构件上的限制器或间隔件限制压缩超过弹簧构件的高度等于板之间的预定间隔的预定点。

公开(公告)号：US5900738A

公开(公告)日：1999-05-04

申请号：US735811

申请日：1996-10-21

Applicant: Igor Y. Khandros ,  Gaetar L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetar L. Mathieu

IPC: H01L23/12 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R4/02 ,  H01R9/00 ,  H01R12/52 ,  H01R33/76 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  G01R31/02

CPC classification number: H05K7/1069 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  G01R1/06761 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/76897 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US5878486A

公开(公告)日：1999-03-09

申请号：US839772

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C25D7/12 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01K9/00

CPC classification number: H05K3/4015 ,  B23K20/004 ,  C25D7/12 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/326 ,  B23K2201/40 ,  G01R1/06761 ,  G01R3/00 ,  G01R31/2884 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K3/20 ,  H05K3/368 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5852871A

公开(公告)日：1998-12-29

申请号：US570230

申请日：1995-12-11

Applicant: Igor Y. Khandros

Inventor： Igor Y. Khandros

IPC: B23K1/00 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R9/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/76897 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609

Abstract: A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensionally). A coating, having one or more layers, is deposited on the wire stem to (i) impart resilient mechanical characteristics to the shaped wire stem and (ii) more securely attach ("anchor") the wire stem to the terminal. Gold is one of several materials described that may be selected for the wire stem. A variety of materials for the coating, and their mechanical properties, are described. The wire stems may be shaped as loops, for example originating and terminating on the same terminal of the electronic component, and overcoated with solder. The use of a barrier layer to prevent unwanted reactions between the wire stem and its environment (e.g., with a solder overcoat) is described. Bonding a second end of the wire to a sacrificial member, then removing the sacrificial member, is described. A plurality of wire stems may be formed on the surface of the electronic component, from different levels thereon, and may be severed so that their tips are coplanar with one another. Many wire stems can be mounted, for example in an array pattern, to one or to both sides of electronic components including semiconductor dies and wafers, plastic and ceramic semiconductor packages, and the like.

Abstract translation: 一种用于在电子部件的表面上制造凸起接触的方法包括将电线的一端接合到电子部件的诸如端子的区域，并将线成形为线杆构造（包括直的， 三维地弯曲）。 具有一个或多个层的涂层沉积在线杆上，以（i）赋予成形线杆弹性机械特性，和（ii）将线杆更牢固地附接（“锚定”）到终端。 金是描述的几种材料之一，可以选择线棒。 描述了用于涂层的各种材料及其机械性能。 线杆可以形成为环，例如起始和终止在电子部件的相同端子上，并用焊料覆盖。 描述了使用阻挡层来防止线杆与其环境之间的不期望的反应（例如，使用焊料外涂层）。 将导线的第二端接合到牺牲部件上，然后移除牺牲部件。 多个线杆可以从电子部件的表面上形成在其上的不同层面上，并且可以被切断，使得它们的尖端彼此共面。 许多线杆可以例如以阵列图形安装到包括半导体管芯和晶片的电子部件的一侧或两侧，塑料和陶瓷半导体封装等。

公开(公告)号：US5726862A

公开(公告)日：1998-03-10

申请号：US596530

申请日：1996-02-02

Applicant: Due Huynh ,  Thomas P. Kirby ,  Micheal M. Austin ,  John E. Herrmann

Inventor： Due Huynh ,  Thomas P. Kirby ,  Micheal M. Austin ,  John E. Herrmann

IPC: H01L33/62 ,  H05K3/30 ,  H05K7/02

CPC classification number: H01L33/62 ,  H05K3/308 ,  H01L2924/0002 ,  H05K2201/094 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/168

Abstract: A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).

Abstract translation: 引线元件（10）设置有第一和第二引线（14和16）。 引线形成有阻止偏差（26和28），其阻止引线超出止动偏差插入电路板（38）。 引线还可以设置有用于将部件保持在电路板上的保持偏差（34和36）。 此外，可以形成停止偏差以指示部件的极性，最后，可以将停止偏差设置有安装部分（50和52），使得引线部件可以表面安装在电路板（54）上 ）。

公开(公告)号：US5610436A

公开(公告)日：1997-03-11

申请号：US486033

申请日：1995-06-07

Applicant: Roger Sponaugle ,  Robert R. Rainey

Inventor： Roger Sponaugle ,  Robert R. Rainey

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/34 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/49811 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/09709 ,  H05K2201/10689 ,  H05K2201/10757 ,  Y02P70/613 ,  Y10T29/49121

Abstract: A surface mount electronic device, attachable to a circuit board, comprises an insulating substrate having a top surface and a bottom surface; a plurality of metallized terminal pads on the bottom surface; and a plurality of leads, each attached to one of the terminal pads by a solder column. Each of the leads comprises a first substantially horizontal lead portion attached to one of the terminal pads by the solder column. A plurality of upturned prongs on the first substantially horizontal lead portion forms a pronged area configured to hold the solder column. A second substantially horizontal lead portion terminates in a free end for attachment to the circuit board. An upwardly curved intermediate lead portion connects the first and second substantially horizontal portions and underlies the bottom surface of the substrate. The lead configuration provides compensation for stresses resulting from mismatching temperature coefficients of expansion between the substrate and the circuit board while providing a small "footprint" and a low vertical profile for the device.

Abstract translation: 可附接到电路板的表面贴装电子器件包括具有顶表面和底表面的绝缘衬底; 底表面上的多个金属化端接垫; 以及多个引线，每个引线通过焊料柱连接到一个端子焊盘。 每个引线包括通过焊料柱连接到一个端子焊盘的第一基本上水平的引线部分。 在第一大致水平的引线部分上的多个向上的尖头形成配置成保持焊料柱的插脚区域。 第二基本水平的引线部分终止于自由端，用于连接到电路板。 向上弯曲的中间引线部分连接第一和第二基本水平的部分并且在基底的底表面的下方。 引线配置为基板和电路板之间的不均匀温度系数提供了应力的补偿，同时为器件提供了一个小的“占用面积”和较低的垂直剖面。

公开(公告)号：US5573172A

公开(公告)日：1996-11-12

申请号：US346131

申请日：1994-11-29

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A hidden lead package device is configured to be placed between a leadless component such as a surface mount package (SMP) used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The hidden lead device is made using materials having similar characteristic thermal expansion properties as that of the SMP and printed circuit board pads to which the hidden lead is affixed. The hidden lead extends across the underside of the SMP along the PCB surface. One end of the lead is brazed to an SMP pad and the opposite end is soldered to a communicating PCB pad. The brazing temperature is higher than the reflow temperature for the solder. The hidden lead device causes the relative movement between the leadless carrier and the printed circuit board to occur along a length of the hidden lead and thus minimizes tensional or compressive forces to the solder joints. Such an approach relieves the stress and resulting creep typically seen at solder joints when mounting leadless packages to printed circuit boards. In addition, by segregating the input and output pads and placing the hidden leads to ground pads between those of input and output pads, crosstalk rejection of the components is improved.

Abstract translation: 隐藏的引线封装器件被配置为放置在诸如用于容纳SAW器件的表面贴装封装（SMP）的无引线部件和被配置为与印刷电路板无引线接触的焊接接头的标准印刷电路板之间。 隐藏引线器件使用具有与SMP相似的特性热膨胀性能的材料和附着有隐藏引线的印刷电路板焊盘制成。 隐藏的引线沿着PCB表面延伸穿过SMP的下侧。 引线的一端钎焊到SMP焊盘，相对端焊接到通信的PCB焊盘。 钎焊温度高于焊料的回流温度。 隐藏的引线装置导致无引线载体和印刷电路板之间的相对运动沿着隐藏引线的长度发生，从而最小化对焊点的张力或压缩力。 当将无引线封装安装到印刷电路板上时，这种方法减轻了在焊点处通常出现的应力和结果的蠕变。 此外，通过分离输入和输出焊盘并将隐藏引线放置在输入和输出焊盘之间的接地焊盘，组件的串扰抑制被改善。

公开(公告)号：US5367192A

公开(公告)日：1994-11-22

申请号：US165043

申请日：1993-12-06

Applicant: Angelo Massironi

Inventor： Angelo Massironi

IPC: H01L23/495 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48 ,  H05K1/08

CPC classification number: H01L23/49548 ,  H05K3/308 ,  H01L2924/0002 ,  H05K2201/09709 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K3/3447

Abstract: This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins to be inserted in holes of the supporting plates and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some of the contact pins are provided with protruding portions defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.

Abstract translation: 用于固定在支撑板上，特别是印刷电路上的集成器件的封装包括插入支撑板的孔中并被焊接到其上的接触针。 为了防止包装翻倒，这可能导致部件之间的短路，至少一些接触销设置有突出部分，突出部分限定与支撑板配合的支座，以限制包装相对于板的倾斜度。